CA2217956A1 - Compact transponder and method for making same - Google Patents
Compact transponder and method for making same Download PDFInfo
- Publication number
- CA2217956A1 CA2217956A1 CA002217956A CA2217956A CA2217956A1 CA 2217956 A1 CA2217956 A1 CA 2217956A1 CA 002217956 A CA002217956 A CA 002217956A CA 2217956 A CA2217956 A CA 2217956A CA 2217956 A1 CA2217956 A1 CA 2217956A1
- Authority
- CA
- Canada
- Prior art keywords
- envelope
- binding
- reservoir
- electronic
- transponder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V15/00—Tags attached to, or associated with, an object, in order to enable detection of the object
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/139—Open-ended, self-supporting conduit, cylinder, or tube-type article
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Geophysics (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Radar Systems Or Details Thereof (AREA)
- Burglar Alarm Systems (AREA)
- Packaging Frangible Articles (AREA)
- Credit Cards Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
A device (70), particularly a transponder, including an electronic assembly (34) and a coating consisting of a shell (20) defining a recess (66), and a solidified binder (64) in which the electronic assembly (34) is embedded. The housing (20) has an opening (26) originally used to insert the electronic assembly (34) and the binder (64) during the manufacture of the device (70). The outer surface (72) of the device (70) in the region of the opening (26) consists of the solidified binder (64). The above-described device is manufactured using a reservoir for filling the recess (66) with the binder (64) and recovering the excess binder, said excess binder and said reservoir being separated from the device once the binder (64) has at least partially solidified.
Description
CA 022179~6 1997-10-09 Case 1297 TRANSPONDER OF SMALL DIMENSIONS AND PROCESS
FOR MANUFACTURING SUCH TRANSPONDERS
The present invention concerns a transponder of small dimensions. A transponder is an electronic module ~unctioning as emitter - receiver. In general, a responder is adapted to supply an identi~ication signal in response to a received excitation signal, which supplies the energy necessary to enable the transponder to generate the identii~ication signal.
Several transponders o:E small ~;m~n~ions are known in the prior art. In the document US 5 025 550, the 10 transponder described is ~ormed by a coil electrically connected to an electronic circuit, this arrangement being located in the interior o~ a glass case entirely enveloping the electronic arrangement.
In the document US 5 235 326, a transponder is 15 described which is also l~ormed by an electronic arrangement comprising an integrated circuit connected to a coil, this arrangement being located in the interior o:E
a closed casing entirely enveloping the electronic arrangement. To assure the stability o~ the electronic 20 arrangement, a binding is provided in the interior o~ this casing.
A similar device is also described in the patent US 4 992 794, where the casing is closed by a plug. Such a solution is also proposed in International Patent 25 Application WO 92/15105. This latter document ~urther proposes other embodiments Eor coating the electronic arrangement of the transponder. A simple over-moulding o~
the electronic arrangement or the placement the electronic arrangement between two sheets o~ thermo:Eusible plastic is 30 envisaged.
Finally, a transponder of~ the same type is described in International Patent Application WO 92/22827. Various embodiments o~ the transponder are proposed in this document. According to one particular embodiment (~igure 4 CA 022179~6 1997-10-09 , 2 4 of this document), the introduction o~ the electronic arrangement, ~ormed by the coil electrically connected to an electronic circuit, into the interior o~ a tube comprising in its upper part and in the interior o~ this tube a ring o~ ~usible material, is envisaged. This ring is ~elted so as to close the entrance opening o~ the electronic arrangement to ~orm the transponder.
All the transponders previously described present a major inconvenience given that the coating o~ the envisaged electronic arrangement requires a relatively complex fabrication process which increases the cost o~
the transponder.
Furthermore, in all the transponders described in the various documents cited hereabove, it is very di~icult to ensure a total ~illing o~ the external envelope de~ining a closed casing integrally surrounding the envisaged electronic arrangement in the interior o~ this casing.
The present invention proposes to alleviate the inconveniences o~ the prior art transponders described hereabove. To that ef~ect, an aim o~ the invention is to provide an inexpensive transponder, in which the protection of the electronic arrangement is completely assured.
Another aim o~ the present invention is to provide a process ~or manu~acturing electronic devices, notably transponders, which enables their manu~acture in an industrially manner ~or a low production cost.
A object o~ the invention is thus a transponder comprising an electronic arrangement and a coating protecting this electronic arrangement. The device is characterized in that the coating is ~ormed by an external envelope, de~ining a pocket and presenting an opening, and a solidi~ied binder completely ~illing the envelope and ~orming an exterior sur~ace o~ the device in the region de~ined by said opening, the electronic arrangement being embedded in the binding.
Due to the particular ~eatures o~ the device according to the invention, the electronic arrangement is CA 022179~6 1997-10-09 properly protected by an open envelope, that is to say, presenting an opening by which the electronic arrangement and the binding have been introduced, and by the filling binding in which the electronic arrangement is embedded.
Such a transponder is distinguished ~rom the above-desc~ibed prior art in that the external envelope is not entirely closed, which avoids at least one operation during the process o~ manu~acturing the device. In addition, given that the binding itsel~ ~orms an exterior sur~ace o~ the transponder, it is easy to ensure a complete filling o~ the envelope, which makes the transponder compact and resistant. Next, the electronic arrangement is completely covered by the binding, which assures stable positioning and total protection.
Another object of the invention is a process ~or manu~acturing an electronic device, characterized in that it comprises the ~ollowing steps :
- providing an envelope, de~ining a pocket, having an upper opening, - providing a reservoir located above said envelope, this reservoir communicating with the pocket by the upper opening and having at least one ~illing opening, - providing a binding in li~uid ~orm in the reservoir, - providing an electronic arrangement in the pocket by the upper opening provided in the envelope, - hardening o~ the provided binding, - separation o~ the electronic device, ~ormed by the envelope and the electronic arrangement embedded in the solidi~ied binding, ~rom the reservoir.
The process according to the above described invention presents several advantages. Notably, the presence o~ the reservoir enables the provision o~
quantitatively more binding than is necessary to ~orm the electronic device according to the invention. The delicate question o~ the binding dose is there~ore ~; m; nuated, whilst assuring a complete ~illing CA 022179~6 1997-10-09 electronic device according to the invention. The delicate question of the binding dose is therefore diminuated, whilst assuring a complete filling of the pocket defined by the envelope by the electronic device.
In the case where the upper opening of the envelope is relatively small, the reservoir can play the role of a funnel thus enabling the easy filling of the pocket. This filling may require complex and a costly equipment without the presence of the said reservoir. According to a particular embodiment of the invention, the reservoir is made from the same material as and integral with the envelope. From this fact, the initially provided reservoir and the envelope form a single piece of the same material.
In such a case, the final separation of the electronic device from the reservoir can be perform by mac~;n;ng, for example, by simple sectioning, with the aid of a blade or a laser beam, at the level of the upper opening of the electronic device.
According to a preferred realisation, several envelopes may be associated with a common reservoir, each of these envelopes presenting an upper opening into the common reservoir. From this fact, it is possible to ensure the filling of several envelopes by a single supply o~
binding from the common reservoir. This step can be advantageously realised by the deposition of a line of binding closing the openings of several envelopes.
Other characteristics and advantages of the invention will be better described with the aid of the following description, made in reference to the annexed drawings in which :
- figure 1 represents schematically a longitudinal cross section of a first embodiment of a transponder according to the transponder;
- figure 2 represents an arrangement of envelopes associated with a common reservoir for a realisation for the process of fabricating transponders according to the invention;
CA 022179~6 1997-10-09 .. ~
- figure 3 represents several electronic arrangements connected to a common support for the said realisation of the process according to the invention;
- figures 4 and 5 represent schematically, according to one cross-sectional representation, two successive states during the said realisation o~ the process according to the invention (the electronic arrangement has not been sectioned);
- figure 6 represents a second embodiment of a transponder obtained by the process of manufacturing described with the aid of figures 2 to 5.
A first embodiment of a transponder according to the invention is represented in figure 1. In this figure 1, the transponder 2 is represented according to a longitudinal cross section. It comprises an electronic arrangement 3 formed by an integrated circuit 4 electrically connected to a coil 6 wound around a coil 8.
The electronic arrangement 3 is incorporated in a coating formed by a binding 10 in which it is embedded and by an envelope 12 which defines an exterior wall of the transponder 2.
According to the invention, the envelope 12 does not totally envelope the electronic arrangement 3. In fact, the envelope 12 presents an opening 14 by which the electronic arrangement 3 and the binding 10 have been introduced into this envelope. The envelope 12 thus de~ines an opening pocket, entirely ~illed by the binding 10 and the electronic arrangement 3 It will be noted that, according to the invention, an exterior sur~ace 16 of the transponder 2 is ~ormed by the binding 10 itsel~.
The envelope 12 possesses an axis of revolution X-X and the exterior sur~ace 16 may be planar, rounded or slightly hollow.
During the manufacture of the transponder 2, one will be watchful that the electronic arrangement 3 is entirely covered by the binding 10 in the region o~ the opening 14 If, after the filling of the envelope 12 by the binding 10 CA 022179~6 1997-10-09 . ~ 6 and after hardening of this binding, the part of the envelope situated in the region of the opening 14 is not entirely and correctly filled by the binding 10, or if the surface 16 ~ormed by the binding presents bumps and irre'gularities forming significant projections, it is possible to ressort to an apparatus acting to smooth the external sur~aces o~ such objects, this being known to a skilled person. In the language of the pro~ession, one refers to the smoothing of the rotating barrel.
With the aid of ~igures 2 to 5, there will be described hereafter a particularly advantageous mode of realisation o~ a process ~or manufacturing electronic devices according to the invention.
In the above-mentioned mode of realisation, at least one envelope 20, defining a pocket, with an upper opening 26, and a reservoir 28 disposed above the envelope 20, are provided. The reservoir 28 comprises a lower hole corresponding to the upper opening 26 o~ the envelope 20.
Next, the reservoir 28 is opened in its upper part to enable binding to be brought ~rom this reservoir. It will be noted that, particularly advantageously, the reservoir 28 is associated with several envelopes 20, 20A, 20B and 20C each presenting an upper opening 26, 26A, 26B and 26C
by which the pockets de~ined by these envelopes communicate with the common reservoir 28. Only ~our envelopes have been shown in figure 2, but this is in no manner limita~ive In ~act, it is possible to ~oresee a reservoir associated with any number o~ envelopes. As an example, the diameter o~ the opening 2 6 is between two and three millimetres, while the principal dimensions o~ the sur~ace de~ined by the edge 30 o~ the upper opening o~ the reservoir 28 are greater, the width being approximately 5 to 6 mm and the length being able to attain several centimetres according to the number o~ intended envelopes.
When the principal dimensions o~ the opening 26 are relatively small, notably less than 5 mm, the reservoir 28 also ~ulfils the role o~ supply ~or the provided binding.
CA 022179~61997-10-09 In fact, the binding provided in the reservoir 28, during a step of the process described herein, is formed by a viscous liquid. Given the viscosity of the binding provided, the drops deposited or the mass of the binding depo'sited in the reservoir 28 present dimensions greater than the dimensions of the upper openings of the envelopes, notably of the average principal dimensions o~
these openings. When the openings 26, 26A, 26B and 26C
have small dimensions, the binding, provided in the form o~ a viscous liquid in the region defined by each of these openings, penetrates into the pockets defined by the envelopes 20, 20A, 20B and 20C. The reservoir 28 has effectively a function of reservoir of the binding during the time interval necessary for the filing of said pockets.
Further to what has been mentioned hereabove, it will thus be noted that the reservoir 28 fulfils, firstly, the role of a reservoir for the binding provided in form of a viscous liquid and, secondly, the role of the supply for the filling of the pockets defined by the envelopes provided with the reservoir 28. These two functions are particularly necessary and advantageous for the manufacture of electronic devices, notably for transponders of small ~;m~n~ions~
It will be noted that the envelopes 20, 20A, 20B and 20C of made o~ the same material as the reservoir 28. The reservoir 28 and the envelopes 20, 2OA, 20B and 20C thus formed by a single piece of same material. However, in another embodiment, it is possible to envisage that the reservoir 28 is materially separated :Erom the provided envelopes.
Several electronic arrangements 34, 34A and 34B are represented in figure 3, each formed by a substrate 36, 36A and 36B on which is arranged a coil 38, 38A and 38B
wound around a core 40, 40A, 40B. Each coil is electrically connected to an integrated circuit 42, 42A
and 42B. As an example, each electronic arrangement 34, CA 022179~6 1997-10-09 34A and 34B defines an electronic device ~or the identi~ication o~ persons or objects.
The substrates 36, 36A and 36B are all connected to a common support 44, which presents positioning holes 46.
The 'electronic arrangements 34, 34A and 34B are placed regularly along the support 44, the distance 50 between two electronic arrangements being equal to the distance 48 separating two neighbouring envelopes. Thus, according to the invention, it is envisaged to provide several electronic arrangements connected to a common support, the number o~ these electronic arrangements corresponding to the number o~ provided envelopes. From this fact, it is clearly possible to simultaneously introduce the plurality of electronic arrangements in the plurality o~
corresponding envelopes. Thus, once the binding is provided in the reservoir 28, the electronic arrangements are simultaneously introduced in the pocket defined by the envelopes at least partially ~illed with binding, as is represented in figure 4. In this figure 4, the envelope 20 and the reservoir 28 are represented in cross-section, the envelope 20 being longitudinal sectioned whilst the reservoir 28 is transversally sectioned.
In the ~ollowing, re~erence will be made to ~igures 4 and 5 ~or the description of the mode o~ realisation of the process according to the invention herein described.
A hole 54 is provided in the lower region o~ the envelope 20. In addition, the hole 54 opens into an external recess 56 ~ormed in the bottom 58 o~ the envelope 20. The hole 54 has a ~unction o~ an orifice ~or the escape o~ air during the introduction o~ the binding o~
the envelope 20. The recess 56 is provided to recuperate the binding able to leak through the hole 54 during the ~illing o~ the envelope 20. However, in order ~o limitate the quantity o~ binding which is able to escape ~rom the hole 54, an advantageous variant o~ the mode o~
realisation herein described envisages to support the bottom 58 against a work sur~ace 60 during introduction o~
CA 022179~6 1997-10-09 ., .
the electronic arrangement 34, as it is represented in figure 4. As an example, the surface 60 forms the upper surface of a block 62 o~ silicon. Thus, the binding 64 entirely fills the envelope 20 during the introduction of the electronic arrangement 34, as is represented in figure 5.
Once the electronic arrangement 34 is completely introduced into the pocket 56 defined by the envelope 20, the surplus of binding is collected by the reservoir 28.
The reservoir 28 has thus a third function, that is to say that, of recovering a surplus of binding, which enables the assurance of the complete filling of the pocket 66 by the binding 64 without requiring a very precise dose during the provision o~ the binding.
Next, the binding 64 solidifies to form a compact mass in which is embedded the electronic arrangement 34.
It will be noted that during the phase of solidification of the binding 64, it is possible to maintain the bottom 58 of the envelope 28 against the surface 60 of the bloc 62 or to withdraw the block 62 given that there is no longer an over-pressure exerted on the binding 64, as is the case during the introduction o~ the electronic arrangement 34 in the pocket 66. It will be noted that the e~fect of over-pressure created by introduction of the electronic arrangement 34 in the pocket 66 is particularly present when the dimensions o~ the section of the coil introduced substantially correspond to the dimensions o~
the upper opening 26 of the envelope 20.
Once the electronic arrangement 34 is introduced into the pocket 66 and the binding 64 is at least partially solidi~ied, it is envisaged to separate the envelope 20, acting to ~orm the electronic device, from the reservoir 28. To do this, there is envisaged, in the present mode of realisation, a sectioning at the level of the line Y-Y.
This sectioning can be realised by several techniques and, for example, with the aid o~ a blade or a source of heat, such as a laser beam. During the sectioning, the substrate CA 022179~6 1997-10-09 ..
36 o~ the electronic arrangement 34 is separated ~rom the support 44, which r~m~; n~ with the reservoir 28 and the residual binding 68.
An electronic device, notably a transponder 70, such as is represented in cross-section in ~igure 6 is there~ore obtained. The transponder 70, de~ining a second embodiment o~ the device according to the invention, presents an envelope 20 de~ining an external wall o~ this transponder 70. Mext, the envelope 20 forms an open pocket 66, this envelope 20 presenting an opening 26. The sur~ace 72 o~ the transponder 70 in the region o~ the opening 26 is ~ormed by the solidi~ied binding 26 in which is embedded the electronic arrangement 34.
It will be noted that the section o~ the transponder may have any geometric ~orm, the circular ~orm presented in ~igure 2 being in no manner limitative.
It will also be noted that the envelope 20 is, ~or example, made ~rom plastic material and that the binding 64 is ~ormed notably by a two-component glue, ~or example an epoxy resin, an acrylic resin or again a polyurethane resin. In the case o~ an epoxy resin, the process o~
manu~acture described hereabove is substantially realised at ambient temperature. One there~ore obtains an electronic device which is compact and complete without requiring a hot coating technic which can be troublesome ~or the printed circuit 42.
The envisaged reservoir in the process ~or manu~acturing an electronic device according to the invention may have several di~erent structures. Il may be notably possible to envisage that the reservoir is ~ormed by several cavities de~ining respective ~unnels ~or the envelopes associated with this reservoir.
According to a variant o~ the mode o~ realisation of the process described hereabove, the reservoir is closed a~ter the introduction o~ the electronic arrangements such that an over pressure can be created in the volume de~ined by the envelopes and reservoir.
CA 022179~6 1997-10-09 It will be noted that the binding may, according to two variants, be provided before the closing of the reservoir, or after this closing, by a filling opening enabling to provide the binding under pressure. In this latter case, it is notably possible to envisage a complete filling of the reservoir whose ~;m~n~ions are reduced to limit the quantity o~ residual binding.
It will also be noted that the binding may generally be provided before or after the electronic arrangements.
According to another mode o~ realisation of the process according to the invention, it is envisaged to unmould the solidified binding in the envelopes and the reservoir, notably with the aid of the support 44 in a variant using elements similar to those represented in figures 2 and 3, and then to separate the binding individually incorporating the electronic arrangement from the solidified residual binding in a reservoir. In this case, the obtained device has no external envelope.
It will finally be noted that the process according to the invention is perfectly suited to the high volume production of electronic devices in which the electronic arrangement are completely protected. However, the process according to the invention may also be used for the piece-by-piece production of an electronic device. In this case, a reservoir may be provided for each envelope.
FOR MANUFACTURING SUCH TRANSPONDERS
The present invention concerns a transponder of small dimensions. A transponder is an electronic module ~unctioning as emitter - receiver. In general, a responder is adapted to supply an identi~ication signal in response to a received excitation signal, which supplies the energy necessary to enable the transponder to generate the identii~ication signal.
Several transponders o:E small ~;m~n~ions are known in the prior art. In the document US 5 025 550, the 10 transponder described is ~ormed by a coil electrically connected to an electronic circuit, this arrangement being located in the interior o~ a glass case entirely enveloping the electronic arrangement.
In the document US 5 235 326, a transponder is 15 described which is also l~ormed by an electronic arrangement comprising an integrated circuit connected to a coil, this arrangement being located in the interior o:E
a closed casing entirely enveloping the electronic arrangement. To assure the stability o~ the electronic 20 arrangement, a binding is provided in the interior o~ this casing.
A similar device is also described in the patent US 4 992 794, where the casing is closed by a plug. Such a solution is also proposed in International Patent 25 Application WO 92/15105. This latter document ~urther proposes other embodiments Eor coating the electronic arrangement of the transponder. A simple over-moulding o~
the electronic arrangement or the placement the electronic arrangement between two sheets o~ thermo:Eusible plastic is 30 envisaged.
Finally, a transponder of~ the same type is described in International Patent Application WO 92/22827. Various embodiments o~ the transponder are proposed in this document. According to one particular embodiment (~igure 4 CA 022179~6 1997-10-09 , 2 4 of this document), the introduction o~ the electronic arrangement, ~ormed by the coil electrically connected to an electronic circuit, into the interior o~ a tube comprising in its upper part and in the interior o~ this tube a ring o~ ~usible material, is envisaged. This ring is ~elted so as to close the entrance opening o~ the electronic arrangement to ~orm the transponder.
All the transponders previously described present a major inconvenience given that the coating o~ the envisaged electronic arrangement requires a relatively complex fabrication process which increases the cost o~
the transponder.
Furthermore, in all the transponders described in the various documents cited hereabove, it is very di~icult to ensure a total ~illing o~ the external envelope de~ining a closed casing integrally surrounding the envisaged electronic arrangement in the interior o~ this casing.
The present invention proposes to alleviate the inconveniences o~ the prior art transponders described hereabove. To that ef~ect, an aim o~ the invention is to provide an inexpensive transponder, in which the protection of the electronic arrangement is completely assured.
Another aim o~ the present invention is to provide a process ~or manu~acturing electronic devices, notably transponders, which enables their manu~acture in an industrially manner ~or a low production cost.
A object o~ the invention is thus a transponder comprising an electronic arrangement and a coating protecting this electronic arrangement. The device is characterized in that the coating is ~ormed by an external envelope, de~ining a pocket and presenting an opening, and a solidi~ied binder completely ~illing the envelope and ~orming an exterior sur~ace o~ the device in the region de~ined by said opening, the electronic arrangement being embedded in the binding.
Due to the particular ~eatures o~ the device according to the invention, the electronic arrangement is CA 022179~6 1997-10-09 properly protected by an open envelope, that is to say, presenting an opening by which the electronic arrangement and the binding have been introduced, and by the filling binding in which the electronic arrangement is embedded.
Such a transponder is distinguished ~rom the above-desc~ibed prior art in that the external envelope is not entirely closed, which avoids at least one operation during the process o~ manu~acturing the device. In addition, given that the binding itsel~ ~orms an exterior sur~ace o~ the transponder, it is easy to ensure a complete filling o~ the envelope, which makes the transponder compact and resistant. Next, the electronic arrangement is completely covered by the binding, which assures stable positioning and total protection.
Another object of the invention is a process ~or manu~acturing an electronic device, characterized in that it comprises the ~ollowing steps :
- providing an envelope, de~ining a pocket, having an upper opening, - providing a reservoir located above said envelope, this reservoir communicating with the pocket by the upper opening and having at least one ~illing opening, - providing a binding in li~uid ~orm in the reservoir, - providing an electronic arrangement in the pocket by the upper opening provided in the envelope, - hardening o~ the provided binding, - separation o~ the electronic device, ~ormed by the envelope and the electronic arrangement embedded in the solidi~ied binding, ~rom the reservoir.
The process according to the above described invention presents several advantages. Notably, the presence o~ the reservoir enables the provision o~
quantitatively more binding than is necessary to ~orm the electronic device according to the invention. The delicate question o~ the binding dose is there~ore ~; m; nuated, whilst assuring a complete ~illing CA 022179~6 1997-10-09 electronic device according to the invention. The delicate question of the binding dose is therefore diminuated, whilst assuring a complete filling of the pocket defined by the envelope by the electronic device.
In the case where the upper opening of the envelope is relatively small, the reservoir can play the role of a funnel thus enabling the easy filling of the pocket. This filling may require complex and a costly equipment without the presence of the said reservoir. According to a particular embodiment of the invention, the reservoir is made from the same material as and integral with the envelope. From this fact, the initially provided reservoir and the envelope form a single piece of the same material.
In such a case, the final separation of the electronic device from the reservoir can be perform by mac~;n;ng, for example, by simple sectioning, with the aid of a blade or a laser beam, at the level of the upper opening of the electronic device.
According to a preferred realisation, several envelopes may be associated with a common reservoir, each of these envelopes presenting an upper opening into the common reservoir. From this fact, it is possible to ensure the filling of several envelopes by a single supply o~
binding from the common reservoir. This step can be advantageously realised by the deposition of a line of binding closing the openings of several envelopes.
Other characteristics and advantages of the invention will be better described with the aid of the following description, made in reference to the annexed drawings in which :
- figure 1 represents schematically a longitudinal cross section of a first embodiment of a transponder according to the transponder;
- figure 2 represents an arrangement of envelopes associated with a common reservoir for a realisation for the process of fabricating transponders according to the invention;
CA 022179~6 1997-10-09 .. ~
- figure 3 represents several electronic arrangements connected to a common support for the said realisation of the process according to the invention;
- figures 4 and 5 represent schematically, according to one cross-sectional representation, two successive states during the said realisation o~ the process according to the invention (the electronic arrangement has not been sectioned);
- figure 6 represents a second embodiment of a transponder obtained by the process of manufacturing described with the aid of figures 2 to 5.
A first embodiment of a transponder according to the invention is represented in figure 1. In this figure 1, the transponder 2 is represented according to a longitudinal cross section. It comprises an electronic arrangement 3 formed by an integrated circuit 4 electrically connected to a coil 6 wound around a coil 8.
The electronic arrangement 3 is incorporated in a coating formed by a binding 10 in which it is embedded and by an envelope 12 which defines an exterior wall of the transponder 2.
According to the invention, the envelope 12 does not totally envelope the electronic arrangement 3. In fact, the envelope 12 presents an opening 14 by which the electronic arrangement 3 and the binding 10 have been introduced into this envelope. The envelope 12 thus de~ines an opening pocket, entirely ~illed by the binding 10 and the electronic arrangement 3 It will be noted that, according to the invention, an exterior sur~ace 16 of the transponder 2 is ~ormed by the binding 10 itsel~.
The envelope 12 possesses an axis of revolution X-X and the exterior sur~ace 16 may be planar, rounded or slightly hollow.
During the manufacture of the transponder 2, one will be watchful that the electronic arrangement 3 is entirely covered by the binding 10 in the region o~ the opening 14 If, after the filling of the envelope 12 by the binding 10 CA 022179~6 1997-10-09 . ~ 6 and after hardening of this binding, the part of the envelope situated in the region of the opening 14 is not entirely and correctly filled by the binding 10, or if the surface 16 ~ormed by the binding presents bumps and irre'gularities forming significant projections, it is possible to ressort to an apparatus acting to smooth the external sur~aces o~ such objects, this being known to a skilled person. In the language of the pro~ession, one refers to the smoothing of the rotating barrel.
With the aid of ~igures 2 to 5, there will be described hereafter a particularly advantageous mode of realisation o~ a process ~or manufacturing electronic devices according to the invention.
In the above-mentioned mode of realisation, at least one envelope 20, defining a pocket, with an upper opening 26, and a reservoir 28 disposed above the envelope 20, are provided. The reservoir 28 comprises a lower hole corresponding to the upper opening 26 o~ the envelope 20.
Next, the reservoir 28 is opened in its upper part to enable binding to be brought ~rom this reservoir. It will be noted that, particularly advantageously, the reservoir 28 is associated with several envelopes 20, 20A, 20B and 20C each presenting an upper opening 26, 26A, 26B and 26C
by which the pockets de~ined by these envelopes communicate with the common reservoir 28. Only ~our envelopes have been shown in figure 2, but this is in no manner limita~ive In ~act, it is possible to ~oresee a reservoir associated with any number o~ envelopes. As an example, the diameter o~ the opening 2 6 is between two and three millimetres, while the principal dimensions o~ the sur~ace de~ined by the edge 30 o~ the upper opening o~ the reservoir 28 are greater, the width being approximately 5 to 6 mm and the length being able to attain several centimetres according to the number o~ intended envelopes.
When the principal dimensions o~ the opening 26 are relatively small, notably less than 5 mm, the reservoir 28 also ~ulfils the role o~ supply ~or the provided binding.
CA 022179~61997-10-09 In fact, the binding provided in the reservoir 28, during a step of the process described herein, is formed by a viscous liquid. Given the viscosity of the binding provided, the drops deposited or the mass of the binding depo'sited in the reservoir 28 present dimensions greater than the dimensions of the upper openings of the envelopes, notably of the average principal dimensions o~
these openings. When the openings 26, 26A, 26B and 26C
have small dimensions, the binding, provided in the form o~ a viscous liquid in the region defined by each of these openings, penetrates into the pockets defined by the envelopes 20, 20A, 20B and 20C. The reservoir 28 has effectively a function of reservoir of the binding during the time interval necessary for the filing of said pockets.
Further to what has been mentioned hereabove, it will thus be noted that the reservoir 28 fulfils, firstly, the role of a reservoir for the binding provided in form of a viscous liquid and, secondly, the role of the supply for the filling of the pockets defined by the envelopes provided with the reservoir 28. These two functions are particularly necessary and advantageous for the manufacture of electronic devices, notably for transponders of small ~;m~n~ions~
It will be noted that the envelopes 20, 20A, 20B and 20C of made o~ the same material as the reservoir 28. The reservoir 28 and the envelopes 20, 2OA, 20B and 20C thus formed by a single piece of same material. However, in another embodiment, it is possible to envisage that the reservoir 28 is materially separated :Erom the provided envelopes.
Several electronic arrangements 34, 34A and 34B are represented in figure 3, each formed by a substrate 36, 36A and 36B on which is arranged a coil 38, 38A and 38B
wound around a core 40, 40A, 40B. Each coil is electrically connected to an integrated circuit 42, 42A
and 42B. As an example, each electronic arrangement 34, CA 022179~6 1997-10-09 34A and 34B defines an electronic device ~or the identi~ication o~ persons or objects.
The substrates 36, 36A and 36B are all connected to a common support 44, which presents positioning holes 46.
The 'electronic arrangements 34, 34A and 34B are placed regularly along the support 44, the distance 50 between two electronic arrangements being equal to the distance 48 separating two neighbouring envelopes. Thus, according to the invention, it is envisaged to provide several electronic arrangements connected to a common support, the number o~ these electronic arrangements corresponding to the number o~ provided envelopes. From this fact, it is clearly possible to simultaneously introduce the plurality of electronic arrangements in the plurality o~
corresponding envelopes. Thus, once the binding is provided in the reservoir 28, the electronic arrangements are simultaneously introduced in the pocket defined by the envelopes at least partially ~illed with binding, as is represented in figure 4. In this figure 4, the envelope 20 and the reservoir 28 are represented in cross-section, the envelope 20 being longitudinal sectioned whilst the reservoir 28 is transversally sectioned.
In the ~ollowing, re~erence will be made to ~igures 4 and 5 ~or the description of the mode o~ realisation of the process according to the invention herein described.
A hole 54 is provided in the lower region o~ the envelope 20. In addition, the hole 54 opens into an external recess 56 ~ormed in the bottom 58 o~ the envelope 20. The hole 54 has a ~unction o~ an orifice ~or the escape o~ air during the introduction o~ the binding o~
the envelope 20. The recess 56 is provided to recuperate the binding able to leak through the hole 54 during the ~illing o~ the envelope 20. However, in order ~o limitate the quantity o~ binding which is able to escape ~rom the hole 54, an advantageous variant o~ the mode o~
realisation herein described envisages to support the bottom 58 against a work sur~ace 60 during introduction o~
CA 022179~6 1997-10-09 ., .
the electronic arrangement 34, as it is represented in figure 4. As an example, the surface 60 forms the upper surface of a block 62 o~ silicon. Thus, the binding 64 entirely fills the envelope 20 during the introduction of the electronic arrangement 34, as is represented in figure 5.
Once the electronic arrangement 34 is completely introduced into the pocket 56 defined by the envelope 20, the surplus of binding is collected by the reservoir 28.
The reservoir 28 has thus a third function, that is to say that, of recovering a surplus of binding, which enables the assurance of the complete filling of the pocket 66 by the binding 64 without requiring a very precise dose during the provision o~ the binding.
Next, the binding 64 solidifies to form a compact mass in which is embedded the electronic arrangement 34.
It will be noted that during the phase of solidification of the binding 64, it is possible to maintain the bottom 58 of the envelope 28 against the surface 60 of the bloc 62 or to withdraw the block 62 given that there is no longer an over-pressure exerted on the binding 64, as is the case during the introduction o~ the electronic arrangement 34 in the pocket 66. It will be noted that the e~fect of over-pressure created by introduction of the electronic arrangement 34 in the pocket 66 is particularly present when the dimensions o~ the section of the coil introduced substantially correspond to the dimensions o~
the upper opening 26 of the envelope 20.
Once the electronic arrangement 34 is introduced into the pocket 66 and the binding 64 is at least partially solidi~ied, it is envisaged to separate the envelope 20, acting to ~orm the electronic device, from the reservoir 28. To do this, there is envisaged, in the present mode of realisation, a sectioning at the level of the line Y-Y.
This sectioning can be realised by several techniques and, for example, with the aid o~ a blade or a source of heat, such as a laser beam. During the sectioning, the substrate CA 022179~6 1997-10-09 ..
36 o~ the electronic arrangement 34 is separated ~rom the support 44, which r~m~; n~ with the reservoir 28 and the residual binding 68.
An electronic device, notably a transponder 70, such as is represented in cross-section in ~igure 6 is there~ore obtained. The transponder 70, de~ining a second embodiment o~ the device according to the invention, presents an envelope 20 de~ining an external wall o~ this transponder 70. Mext, the envelope 20 forms an open pocket 66, this envelope 20 presenting an opening 26. The sur~ace 72 o~ the transponder 70 in the region o~ the opening 26 is ~ormed by the solidi~ied binding 26 in which is embedded the electronic arrangement 34.
It will be noted that the section o~ the transponder may have any geometric ~orm, the circular ~orm presented in ~igure 2 being in no manner limitative.
It will also be noted that the envelope 20 is, ~or example, made ~rom plastic material and that the binding 64 is ~ormed notably by a two-component glue, ~or example an epoxy resin, an acrylic resin or again a polyurethane resin. In the case o~ an epoxy resin, the process o~
manu~acture described hereabove is substantially realised at ambient temperature. One there~ore obtains an electronic device which is compact and complete without requiring a hot coating technic which can be troublesome ~or the printed circuit 42.
The envisaged reservoir in the process ~or manu~acturing an electronic device according to the invention may have several di~erent structures. Il may be notably possible to envisage that the reservoir is ~ormed by several cavities de~ining respective ~unnels ~or the envelopes associated with this reservoir.
According to a variant o~ the mode o~ realisation of the process described hereabove, the reservoir is closed a~ter the introduction o~ the electronic arrangements such that an over pressure can be created in the volume de~ined by the envelopes and reservoir.
CA 022179~6 1997-10-09 It will be noted that the binding may, according to two variants, be provided before the closing of the reservoir, or after this closing, by a filling opening enabling to provide the binding under pressure. In this latter case, it is notably possible to envisage a complete filling of the reservoir whose ~;m~n~ions are reduced to limit the quantity o~ residual binding.
It will also be noted that the binding may generally be provided before or after the electronic arrangements.
According to another mode o~ realisation of the process according to the invention, it is envisaged to unmould the solidified binding in the envelopes and the reservoir, notably with the aid of the support 44 in a variant using elements similar to those represented in figures 2 and 3, and then to separate the binding individually incorporating the electronic arrangement from the solidified residual binding in a reservoir. In this case, the obtained device has no external envelope.
It will finally be noted that the process according to the invention is perfectly suited to the high volume production of electronic devices in which the electronic arrangement are completely protected. However, the process according to the invention may also be used for the piece-by-piece production of an electronic device. In this case, a reservoir may be provided for each envelope.
Claims (15)
1. Process of manufacturing a device (70) characterized in that it comprises the following steps:
- providing an envelope (20), defining a pocket (66) having an upper opening (26);
- providing a reservoir (28) disposed above said envelope, this reservoir communicating with said pocket by said upper opening and having at least one feeling opening;
- providing a binding (64) in liquid form in said reservoir;
- providing an electronic arrangement (34) in said pocket by said upper opening;
- hardening of said binding, - separation of said device, formed by said envelope and said electronic arrangement embedded in said solidified binding, from said reservoir.
- providing an envelope (20), defining a pocket (66) having an upper opening (26);
- providing a reservoir (28) disposed above said envelope, this reservoir communicating with said pocket by said upper opening and having at least one feeling opening;
- providing a binding (64) in liquid form in said reservoir;
- providing an electronic arrangement (34) in said pocket by said upper opening;
- hardening of said binding, - separation of said device, formed by said envelope and said electronic arrangement embedded in said solidified binding, from said reservoir.
2. Process according to claim 1, characterized in that the quantity of said binding (64) provided is greater than a quantity of this binding incorporated in said device (70) resulting after said separation step, this separation being effectuated by a sectioning at the level of said upper opening (26) of said envelope (20).
3. Process according to claim 2, characterized in that said reservoir (28) is made from the same material as and integral with said envelope (20), said initially provided reservoir and said envelope forming a single piece of a same material.
4. Process according to one of claim 1 to 3, characterized in that said provided envelope (20) presents a hole in its lower part.
5. Process according to claim 4, characterized in that said hole (54) opens into an external recess (56) provided in said envelope (20).
6. Process according to claim 4 or 5, characterized in that said hole (54) is closed on the external side of said envelope (20) by sealing means during the provision of said electronic arrangement (34) in said pocket (66) formed by said envelope.
7. Process according to one of the preceding claims, characterized in that said reservoir (28) acts as funnel for the filling of said pocket by said binding (64), a contour (30) of the filling opening of said reservoir defining a surface whose two principal dimensions are greater than at least the smallest dimensions of the upper opening (26) of said envelope.
8. Process according to one of the preceding claims, by which it is envisaged to simultaneously manufacture several devices, characterized in that several envelopes (20, 20A, 20B, 20C) are provided with a single common reservoir (28) communicating with the pockets, defined by said envelopes, by the upper openings (26, 26A, 26B, 26C) of these envelopes, several electronic arrangements (34, 34A, 34B) being provided and introduced respectively in said pockets.
9. Process according to claim 8, characterized in that said electronic arrangements (34, 34A, 34B) are initially connected to each other by a support (44), these electronic arrangements being located under said support with a regular spacing (50) corresponding to the spacing (48) of said provided envelopes (20, 20A, 20B, 20C), said electronic arrangements being simultaneously introduced into said pockets with the aid of said support, this support being separated from these electronic arrangements during said separation step in which the devices, respectively formed by said envelope and said electronic arrangements embedded in said binding filling these envelopes are separated from said common reservoir.
10. Transponder (2; 70) comprising an electronic arrangement (3; 34) and a coating (10, 12; 20, 64) protecting this electronic arrangement, characterized in that said coating is formed by an external envelope (12;
20), defining a pocket and presenting an opening, and a solidified binding entirely filling said envelope and forming an external surface of said transponder in the region defined by said opening, said electronic arrangement being embedded in said binding.
20), defining a pocket and presenting an opening, and a solidified binding entirely filling said envelope and forming an external surface of said transponder in the region defined by said opening, said electronic arrangement being embedded in said binding.
11. Transponder according to claim 10, characterized in that said envelope (20) presents, in a region situated at an extremity opposite to said opening, a hole (54) of small cross-section.
12. Transponder according to claim 11, characterized in that said hole (54) opens into an external recess (56) formed in said envelope.
13. Transponder according to one of claim 10 to 12, characterized in that said binding (10; 20) is constituted by a two-component glue.
14. Transponder according to one of claim 10 to 13, characterized in that said envelope (12; 20) is formed from plastic material.
15. Transponder according to one of claim 10 to 14, characterized in that said electronic arrangement is formed by an integrated circuit (4; 42) and a coil (6; 40) electrically connected.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9504392A FR2733104B1 (en) | 1995-04-12 | 1995-04-12 | SMALL-DIMENSIONAL ANSWERING MACHINE AND METHOD FOR MANUFACTURING SUCH ANSWERING MACHINES |
| FR95/04392 | 1995-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2217956A1 true CA2217956A1 (en) | 1996-10-17 |
Family
ID=9478041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002217956A Abandoned CA2217956A1 (en) | 1995-04-12 | 1996-03-25 | Compact transponder and method for making same |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US5895235A (en) |
| EP (1) | EP0820686B1 (en) |
| JP (1) | JPH11505604A (en) |
| CN (1) | CN1097422C (en) |
| AT (1) | ATE197108T1 (en) |
| AU (1) | AU704453B2 (en) |
| CA (1) | CA2217956A1 (en) |
| DE (1) | DE69610697T2 (en) |
| FR (1) | FR2733104B1 (en) |
| TW (1) | TW290781B (en) |
| WO (1) | WO1996032829A1 (en) |
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-
1995
- 1995-04-12 FR FR9504392A patent/FR2733104B1/en not_active Expired - Fee Related
-
1996
- 1996-03-25 EP EP96905667A patent/EP0820686B1/en not_active Expired - Lifetime
- 1996-03-25 AU AU49369/96A patent/AU704453B2/en not_active Ceased
- 1996-03-25 WO PCT/CH1996/000110 patent/WO1996032829A1/en active IP Right Grant
- 1996-03-25 DE DE69610697T patent/DE69610697T2/en not_active Expired - Lifetime
- 1996-03-25 JP JP8530609A patent/JPH11505604A/en active Pending
- 1996-03-25 AT AT96905667T patent/ATE197108T1/en active
- 1996-03-25 US US08/930,571 patent/US5895235A/en not_active Expired - Lifetime
- 1996-03-25 CN CN96194317A patent/CN1097422C/en not_active Expired - Fee Related
- 1996-03-25 CA CA002217956A patent/CA2217956A1/en not_active Abandoned
- 1996-03-26 TW TW085103625A patent/TW290781B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| FR2733104B1 (en) | 1997-06-06 |
| AU704453B2 (en) | 1999-04-22 |
| EP0820686A1 (en) | 1998-01-28 |
| US5895235A (en) | 1999-04-20 |
| WO1996032829A1 (en) | 1996-10-17 |
| CN1097422C (en) | 2002-12-25 |
| FR2733104A1 (en) | 1996-10-18 |
| EP0820686B1 (en) | 2000-10-18 |
| JPH11505604A (en) | 1999-05-21 |
| TW290781B (en) | 1996-11-11 |
| AU4936996A (en) | 1996-10-30 |
| DE69610697T2 (en) | 2001-05-03 |
| DE69610697D1 (en) | 2000-11-23 |
| CN1186589A (en) | 1998-07-01 |
| ATE197108T1 (en) | 2000-11-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |