CA2213590A1 - Flexible circuit connector and method of making same - Google Patents

Flexible circuit connector and method of making same

Info

Publication number
CA2213590A1
CA2213590A1 CA002213590A CA2213590A CA2213590A1 CA 2213590 A1 CA2213590 A1 CA 2213590A1 CA 002213590 A CA002213590 A CA 002213590A CA 2213590 A CA2213590 A CA 2213590A CA 2213590 A1 CA2213590 A1 CA 2213590A1
Authority
CA
Canada
Prior art keywords
flexible circuit
substrate
pattern
connector
male pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002213590A
Other languages
French (fr)
Other versions
CA2213590C (en
Inventor
Keith C. Carroll
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
700674 Ontario Ltd
Original Assignee
700674 Ontario Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 700674 Ontario Ltd filed Critical 700674 Ontario Ltd
Priority to CA002213590A priority Critical patent/CA2213590C/en
Priority to US08/947,637 priority patent/US6032359A/en
Publication of CA2213590A1 publication Critical patent/CA2213590A1/en
Application granted granted Critical
Publication of CA2213590C publication Critical patent/CA2213590C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • Y10T29/49151Assembling terminal to base by deforming or shaping
    • Y10T29/49153Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49208Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49217Contact or terminal manufacturing by assembling plural parts by elastic joining

Abstract

In a flexible circuit, a minimal force electrical and mechanical connection of a male pin connector is achieved directly to a single layer of a flexible polyimide film substrate having a thickness in the range of 0.002 to 0.012 inches. The flexible circuit has a female connector including a pattern smoothly cut in the film substrate by a CO2 laser defining pie shaped foldable flaps normally restricting passage through the flexible film at the pattern. The foldable flaps deflect when receiving the male connector in wiping engagement to solely secure the male pin connector to the substrate. The female connector further has a trace coating of an electrically conductive material on the substrate having a contact land area surrounding the pattern and extending over the foldable flaps to provide electrical contact between the trace coating and the male pin connector.
The connection requires no solder to mechanically and electrically maintain contact integrity.
CA002213590A 1997-08-21 1997-08-21 Flexible circuit connector and method of making same Expired - Fee Related CA2213590C (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CA002213590A CA2213590C (en) 1997-08-21 1997-08-21 Flexible circuit connector and method of making same
US08/947,637 US6032359A (en) 1997-08-21 1997-10-09 Method of manufacturing a female electrical connector in a single layer flexible polymeric dielectric film substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA002213590A CA2213590C (en) 1997-08-21 1997-08-21 Flexible circuit connector and method of making same

Publications (2)

Publication Number Publication Date
CA2213590A1 true CA2213590A1 (en) 1999-02-21
CA2213590C CA2213590C (en) 2006-11-07

Family

ID=4161306

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002213590A Expired - Fee Related CA2213590C (en) 1997-08-21 1997-08-21 Flexible circuit connector and method of making same

Country Status (2)

Country Link
US (1) US6032359A (en)
CA (1) CA2213590C (en)

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US7381064B2 (en) * 2003-08-26 2008-06-03 Methode Electronics, Inc. Flexible flat cable termination structure for a clockspring
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US8618659B2 (en) 2011-05-03 2013-12-31 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
US8872318B2 (en) 2011-08-24 2014-10-28 Tessera, Inc. Through interposer wire bond using low CTE interposer with coarse slot apertures
US9105483B2 (en) 2011-10-17 2015-08-11 Invensas Corporation Package-on-package assembly with wire bond vias
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8372741B1 (en) 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
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US9136254B2 (en) 2013-02-01 2015-09-15 Invensas Corporation Microelectronic package having wire bond vias and stiffening layer
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US9034696B2 (en) 2013-07-15 2015-05-19 Invensas Corporation Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
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US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
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US9214454B2 (en) 2014-03-31 2015-12-15 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
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US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
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Also Published As

Publication number Publication date
CA2213590C (en) 2006-11-07
US6032359A (en) 2000-03-07

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