CA2147398A1 - Solder Medium for Circuit Interconnection - Google Patents
Solder Medium for Circuit InterconnectionInfo
- Publication number
- CA2147398A1 CA2147398A1 CA2147398A CA2147398A CA2147398A1 CA 2147398 A1 CA2147398 A1 CA 2147398A1 CA 2147398 A CA2147398 A CA 2147398A CA 2147398 A CA2147398 A CA 2147398A CA 2147398 A1 CA2147398 A1 CA 2147398A1
- Authority
- CA
- Canada
- Prior art keywords
- solder
- wires
- medium
- pads
- insulating matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0235—Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Electronic devices having at least two components with mating contact pads are provided with high-aspect-ratio solder joints between the mating pads.
These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two components. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to their diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.
These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two components. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to their diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/255,687 US5509815A (en) | 1994-06-08 | 1994-06-08 | Solder medium for circuit interconnection |
US255,687 | 1994-06-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2147398A1 true CA2147398A1 (en) | 1995-12-09 |
CA2147398C CA2147398C (en) | 2000-02-15 |
Family
ID=22969462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002147398A Expired - Fee Related CA2147398C (en) | 1994-06-08 | 1995-04-20 | Solder medium for circuit interconnection |
Country Status (6)
Country | Link |
---|---|
US (2) | US5509815A (en) |
EP (1) | EP0687137A3 (en) |
JP (1) | JPH07336044A (en) |
KR (1) | KR960003518A (en) |
CA (1) | CA2147398C (en) |
TW (1) | TW265481B (en) |
Families Citing this family (49)
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US5661042A (en) * | 1995-08-28 | 1997-08-26 | Motorola, Inc. | Process for electrically connecting electrical devices using a conductive anisotropic material |
US5807766A (en) * | 1995-09-21 | 1998-09-15 | Mcbride; Donald G. | Process for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the process |
US6043990A (en) * | 1997-06-09 | 2000-03-28 | Prototype Solutions Corporation | Multiple board package employing solder balis and fabrication method and apparatus |
US6025649A (en) * | 1997-07-22 | 2000-02-15 | International Business Machines Corporation | Pb-In-Sn tall C-4 for fatigue enhancement |
US5975922A (en) * | 1998-03-09 | 1999-11-02 | Lucent Technologies Inc. | Device containing directionally conductive composite medium |
US6050832A (en) * | 1998-08-07 | 2000-04-18 | Fujitsu Limited | Chip and board stress relief interposer |
US6019610A (en) * | 1998-11-23 | 2000-02-01 | Glatts, Iii; George F. | Elastomeric connector |
US6854985B1 (en) * | 1998-12-16 | 2005-02-15 | Paricon Technologies Corporation | Elastomeric interconnection device and methods for making same |
US6270363B1 (en) * | 1999-05-18 | 2001-08-07 | International Business Machines Corporation | Z-axis compressible polymer with fine metal matrix suspension |
JP3515479B2 (en) * | 2000-04-05 | 2004-04-05 | 北川工業株式会社 | Conductive member and method of manufacturing the same |
RU2264678C2 (en) | 2000-04-27 | 2005-11-20 | Эндресс + Хаузер Гмбх + Ко. Кг | Multilayer piezoceramic part for measuring instruments and its manufacturing process |
AU2001278027A1 (en) * | 2000-07-26 | 2002-02-05 | The Research Foundation Of State University Of New York | Method and system for bonding a semiconductor chip onto a carrier using micro-pins |
US6447308B1 (en) * | 2000-10-31 | 2002-09-10 | Paricon Technologies Corporation | Method and device for increasing elastomeric interconnection robustness |
US20020086566A1 (en) * | 2000-12-06 | 2002-07-04 | Simons Everett F. | Robust, low-resistance elastomeric conductive polymer interconnect |
DE10164799B4 (en) * | 2001-03-21 | 2006-03-30 | Audioton Kabelwerk Gmbh | Mobile telephone device with multicore electrical connection devices |
US6818155B2 (en) * | 2002-01-02 | 2004-11-16 | Intel Corporation | Attaching components to a printed circuit card |
US7249954B2 (en) | 2002-02-26 | 2007-07-31 | Paricon Technologies Corporation | Separable electrical interconnect with anisotropic conductive elastomer for translating footprint |
US20030199181A1 (en) * | 2002-04-17 | 2003-10-23 | Akira Technology Co., Ltd. | Pliable connector and manufacturing method thereof |
US20040050911A1 (en) * | 2002-09-18 | 2004-03-18 | Ho-Young Lee | Solder-fill and its manufacturing method for using semiconductor package and its application for mounting semiconductor chip on PCB |
DE602004018720D1 (en) * | 2003-09-09 | 2009-02-12 | Nitto Denko Corp | Anisotropic conductive film, manufacturing and use process |
US7293995B2 (en) * | 2005-11-08 | 2007-11-13 | Che-Yu Li & Company, Llc | Electrical contact and connector system |
US20080003778A1 (en) * | 2006-06-13 | 2008-01-03 | Rensselaer Polytechnic Institute | Low-temperature welding with nano structures |
US9615463B2 (en) * | 2006-09-22 | 2017-04-04 | Oscar Khaselev | Method for producing a high-aspect ratio conductive pattern on a substrate |
US8623265B2 (en) * | 2007-02-06 | 2014-01-07 | World Properties, Inc. | Conductive polymer foams, method of manufacture, and articles thereof |
CN101600758B (en) * | 2007-02-06 | 2012-07-04 | 环球产权公司 | Conductive polymer foams, method of manufacture, and uses thereof |
US20090226696A1 (en) * | 2008-02-06 | 2009-09-10 | World Properties, Inc. | Conductive Polymer Foams, Method of Manufacture, And Uses Thereof |
DE102008060862B4 (en) * | 2008-12-09 | 2010-10-28 | Werthschützky, Roland, Prof. Dr.-Ing.habil. | Method for miniaturizable contacting of insulated wires |
WO2010101125A1 (en) * | 2009-03-05 | 2010-09-10 | ポリマテック株式会社 | Elastic connector and method of manufacturing same and conductive connector |
US20110079630A1 (en) * | 2009-10-07 | 2011-04-07 | Babcock & Wilcox Technical Services Y-12, Llc | System for reducing metallic whisker formation |
JP5409242B2 (en) * | 2009-10-07 | 2014-02-05 | 新光電気工業株式会社 | Inductor and method of manufacturing inductor |
KR20120125614A (en) * | 2009-12-29 | 2012-11-16 | 로저스코포레이션 | Conductive polymer foams, method of manufacture, and uses thereof |
US20110210283A1 (en) * | 2010-02-24 | 2011-09-01 | Ainissa G. Ramirez | Low melting temperature alloys with magnetic dispersions |
US8939347B2 (en) | 2010-04-28 | 2015-01-27 | Intel Corporation | Magnetic intermetallic compound interconnect |
US9847308B2 (en) | 2010-04-28 | 2017-12-19 | Intel Corporation | Magnetic intermetallic compound interconnect |
US8434668B2 (en) * | 2010-05-12 | 2013-05-07 | Intel Corporation | Magnetic attachment structure |
US8609532B2 (en) * | 2010-05-26 | 2013-12-17 | Intel Corporation | Magnetically sintered conductive via |
US8988895B2 (en) * | 2011-08-23 | 2015-03-24 | Tessera, Inc. | Interconnection elements with encased interconnects |
JP5912741B2 (en) * | 2012-03-27 | 2016-04-27 | 日東電工株式会社 | Joining sheet, electronic component and manufacturing method thereof |
CN102922071B (en) * | 2012-10-25 | 2014-10-08 | 哈尔滨工业大学 | Method for preparing low-temperature interconnection/high-temperature serving joints by using nano intermetallic compound particles |
US9142475B2 (en) | 2013-08-13 | 2015-09-22 | Intel Corporation | Magnetic contacts |
US9282649B2 (en) * | 2013-10-08 | 2016-03-08 | Cisco Technology, Inc. | Stand-off block |
EP2947662A1 (en) | 2014-05-21 | 2015-11-25 | Condalign AS | A method for arranging particles at an interface |
US10104772B2 (en) * | 2014-08-19 | 2018-10-16 | International Business Machines Incorporated | Metallized particle interconnect with solder components |
WO2016048347A1 (en) | 2014-09-26 | 2016-03-31 | Intel Corporation | Flexible packaging architecture |
KR101721667B1 (en) * | 2016-03-08 | 2017-04-10 | 엘에스전선 주식회사 | Multicore conductor wire for solar cell module |
MY192082A (en) * | 2016-12-27 | 2022-07-26 | Intel Corp | Interconnect core |
CA3123513A1 (en) * | 2018-12-19 | 2020-06-25 | Oqab Dietrich Induction Inc. | Induction-based systems and methods for joining substrates |
DE102020202025B4 (en) | 2020-02-18 | 2022-01-20 | Continental Automotive Gmbh | Connection system for electrically connecting printed circuit boards and using a connection system |
US20220052012A1 (en) * | 2020-07-28 | 2022-02-17 | Paricon Technologies Corporation | Compliant Electronic Component Interconnection |
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Publication number | Priority date | Publication date | Assignee | Title |
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US4003621A (en) * | 1975-06-16 | 1977-01-18 | Technical Wire Products, Inc. | Electrical connector employing conductive rectilinear elements |
US4705205A (en) * | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
US4644101A (en) * | 1985-12-11 | 1987-02-17 | At&T Bell Laboratories | Pressure-responsive position sensor |
US4737112A (en) * | 1986-09-05 | 1988-04-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Anisotropically conductive composite medium |
EP0265077A3 (en) * | 1986-09-25 | 1989-03-08 | Sheldahl, Inc. | An anisotropic adhesive for bonding electrical components |
US5045249A (en) * | 1986-12-04 | 1991-09-03 | At&T Bell Laboratories | Electrical interconnection by a composite medium |
JPH07120688B2 (en) * | 1987-06-12 | 1995-12-20 | 株式会社日立製作所 | Micro joint structure |
JPS6422048A (en) * | 1987-07-17 | 1989-01-25 | Fujitsu Ltd | Method for forming solder bump |
US4820376A (en) * | 1987-11-05 | 1989-04-11 | American Telephone And Telegraph Company At&T Bell Laboratories | Fabrication of CPI layers |
JP2573016B2 (en) * | 1988-02-27 | 1997-01-16 | アンプ インコーポレーテッド | Micro input / output pin and method of manufacturing the same |
EP0396522A3 (en) * | 1989-05-05 | 1992-01-22 | International Business Machines Corporation | Universal electrical interconnection system and method |
JP2788755B2 (en) * | 1989-06-05 | 1998-08-20 | 古河電気工業株式会社 | Manufacturing method of electronic component mounting pad |
JPH0311388A (en) * | 1989-06-09 | 1991-01-18 | Komatsu Ltd | Connection structure for electronic display device |
JPH0318094A (en) * | 1989-06-14 | 1991-01-25 | Fujitsu Ltd | Method of mounting electronic parts onto printed circuit board |
-
1994
- 1994-06-08 US US08/255,687 patent/US5509815A/en not_active Expired - Lifetime
-
1995
- 1995-04-20 CA CA002147398A patent/CA2147398C/en not_active Expired - Fee Related
- 1995-05-03 TW TW084104444A patent/TW265481B/zh active
- 1995-05-30 EP EP95303635A patent/EP0687137A3/en not_active Withdrawn
- 1995-06-07 JP JP7163067A patent/JPH07336044A/en active Pending
- 1995-06-08 KR KR1019950014996A patent/KR960003518A/en not_active Application Discontinuation
-
1996
- 1996-01-18 US US08/588,193 patent/US5618189A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR960003518A (en) | 1996-01-26 |
JPH07336044A (en) | 1995-12-22 |
EP0687137A3 (en) | 1996-09-11 |
US5618189A (en) | 1997-04-08 |
EP0687137A2 (en) | 1995-12-13 |
US5509815A (en) | 1996-04-23 |
CA2147398C (en) | 2000-02-15 |
TW265481B (en) | 1995-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |