CA2135508A1 - Method for Forming Solder Balls on a Semiconductor Substrate - Google Patents

Method for Forming Solder Balls on a Semiconductor Substrate

Info

Publication number
CA2135508A1
CA2135508A1 CA2135508A CA2135508A CA2135508A1 CA 2135508 A1 CA2135508 A1 CA 2135508A1 CA 2135508 A CA2135508 A CA 2135508A CA 2135508 A CA2135508 A CA 2135508A CA 2135508 A1 CA2135508 A1 CA 2135508A1
Authority
CA
Canada
Prior art keywords
solder balls
substrate
fixture
semiconductor substrate
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2135508A
Other languages
French (fr)
Other versions
CA2135508C (en
Inventor
Robert J. Lyn
Anthony M. Aulicino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IBM Canada Ltd
Original Assignee
IBM Canada Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IBM Canada Ltd filed Critical IBM Canada Ltd
Priority to CA002135508A priority Critical patent/CA2135508C/en
Priority to US08/558,577 priority patent/US5658827A/en
Priority to JP28302495A priority patent/JP3202903B2/en
Publication of CA2135508A1 publication Critical patent/CA2135508A1/en
Priority to US08/859,546 priority patent/US6030889A/en
Application granted granted Critical
Publication of CA2135508C publication Critical patent/CA2135508C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks

Abstract

A method for forming solder ball contacts on a ball grid array is described. The solder balls are formed by sqeegeeing a solder paste through apertures in a fixture into contact with pads on a substrate, heating the fixture, paste and substrate to reflow the solder paste into solder balls that attach to the pads and are detached from the fixture.
After cooling, the fixture is readily separated from the substrate and leaves the solder balls in conductive contact with contact pads on the substrate.
CA002135508A 1994-09-11 1994-11-09 Method for forming solder balls on a semiconductor substrate Expired - Fee Related CA2135508C (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CA002135508A CA2135508C (en) 1994-11-09 1994-11-09 Method for forming solder balls on a semiconductor substrate
US08/558,577 US5658827A (en) 1994-11-09 1995-10-31 Method for forming solder balls on a substrate
JP28302495A JP3202903B2 (en) 1994-11-09 1995-10-31 Method of forming solder balls on a substrate
US08/859,546 US6030889A (en) 1994-09-11 1997-05-20 Substrate-holding fixture of non-wettable material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA002135508A CA2135508C (en) 1994-11-09 1994-11-09 Method for forming solder balls on a semiconductor substrate

Publications (2)

Publication Number Publication Date
CA2135508A1 true CA2135508A1 (en) 1996-05-10
CA2135508C CA2135508C (en) 1998-11-03

Family

ID=4154645

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002135508A Expired - Fee Related CA2135508C (en) 1994-09-11 1994-11-09 Method for forming solder balls on a semiconductor substrate

Country Status (3)

Country Link
US (2) US5658827A (en)
JP (1) JP3202903B2 (en)
CA (1) CA2135508C (en)

Families Citing this family (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5872051A (en) * 1995-08-02 1999-02-16 International Business Machines Corporation Process for transferring material to semiconductor chip conductive pads using a transfer substrate
US6448169B1 (en) * 1995-12-21 2002-09-10 International Business Machines Corporation Apparatus and method for use in manufacturing semiconductor devices
US5891795A (en) * 1996-03-18 1999-04-06 Motorola, Inc. High density interconnect substrate
JP3401391B2 (en) * 1996-04-16 2003-04-28 日本特殊陶業株式会社 Method for manufacturing substrate having solder bumps
JP3369410B2 (en) * 1996-09-02 2003-01-20 松下電器産業株式会社 Mounting method of semiconductor device
US6083768A (en) 1996-09-06 2000-07-04 Micron Technology, Inc. Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components
US5946555A (en) * 1996-11-04 1999-08-31 Packard Hughes Interconnect Company Wafer level decal for minimal packaging of chips
JP3553300B2 (en) * 1996-12-02 2004-08-11 富士通株式会社 Semiconductor device manufacturing method and semiconductor device mounting method
US5909634A (en) * 1996-12-20 1999-06-01 Texas Instruments Method and apparatus for forming solder on a substrate
US6117759A (en) * 1997-01-03 2000-09-12 Motorola Inc. Method for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit package
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
JP3173410B2 (en) * 1997-03-14 2001-06-04 松下電器産業株式会社 Package substrate and method of manufacturing the same
FR2762715B1 (en) 1997-04-28 2000-07-21 Novatec METHOD FOR PRODUCING AND BRAZING ELECTRICAL CONNECTION BALLS ON WELDING RANGES FOR ELECTRICAL CONNECTIONS OF ELECTRONIC CIRCUITS OR COMPONENTS AND IMPLEMENTING DEVICE
US7288471B2 (en) * 1997-05-27 2007-10-30 Mackay John Bumping electronic components using transfer substrates
US7819301B2 (en) 1997-05-27 2010-10-26 Wstp, Llc Bumping electronic components using transfer substrates
US7842599B2 (en) * 1997-05-27 2010-11-30 Wstp, Llc Bumping electronic components using transfer substrates
US6293456B1 (en) 1997-05-27 2001-09-25 Spheretek, Llc Methods for forming solder balls on substrates
US7654432B2 (en) 1997-05-27 2010-02-02 Wstp, Llc Forming solder balls on substrates
US6609652B2 (en) * 1997-05-27 2003-08-26 Spheretek, Llc Ball bumping substrates, particuarly wafers
US7007833B2 (en) 1997-05-27 2006-03-07 Mackay John Forming solder balls on substrates
US6026566A (en) * 1997-06-05 2000-02-22 Cooper Industries, Inc. Stenciling method and apparatus for PC board repair
US5956606A (en) * 1997-10-31 1999-09-21 Motorola, Inc. Method for bumping and packaging semiconductor die
US6369451B2 (en) * 1998-01-13 2002-04-09 Paul T. Lin Solder balls and columns with stratified underfills on substrate for flip chip joining
US6105852A (en) * 1998-02-05 2000-08-22 International Business Machines Corporation Etched glass solder bump transfer for flip chip integrated circuit devices
US6089151A (en) * 1998-02-24 2000-07-18 Micron Technology, Inc. Method and stencil for extruding material on a substrate
US6239385B1 (en) 1998-02-27 2001-05-29 Agilent Technologies, Inc. Surface mountable coaxial solder interconnect and method
JP2002507845A (en) * 1998-03-23 2002-03-12 スフィアテック エルエルシー Method and apparatus for forming solder balls on a substrate
US6153505A (en) * 1998-04-27 2000-11-28 International Business Machines Corporation Plastic solder array using injection molded solder
US6137693A (en) * 1998-07-31 2000-10-24 Agilent Technologies Inc. High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding
US6105851A (en) * 1998-08-07 2000-08-22 Unisys Corp Method of casting I/O columns on an electronic component with a high yield
US6189772B1 (en) * 1998-08-31 2001-02-20 Micron Technology, Inc. Method of forming a solder ball
US6595408B1 (en) * 1998-10-07 2003-07-22 Micron Technology, Inc. Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement
US6342442B1 (en) * 1998-11-20 2002-01-29 Agere Systems Guardian Corp. Kinetically controlled solder bonding
TW409490B (en) * 1998-12-31 2000-10-21 World Wiser Electronics Inc The equipment for plug hole process and the method thereof
US6252779B1 (en) 1999-01-25 2001-06-26 International Business Machines Corporation Ball grid array via structure
US6179200B1 (en) * 1999-02-03 2001-01-30 Industrial Technology Research Institute Method for forming solder bumps of improved height and devices formed
FR2789541B1 (en) * 1999-02-05 2001-03-16 Novatec Sa Soc METHOD FOR PRODUCING ELECTRONIC MODULES WITH BALL CONNECTOR OR INTEGRATED PREFORMS ON A PRINTED CIRCUIT AND DEVICE FOR IMPLEMENTING THE SAME
US6426564B1 (en) * 1999-02-24 2002-07-30 Micron Technology, Inc. Recessed tape and method for forming a BGA assembly
US6543131B1 (en) * 1999-03-10 2003-04-08 Tessera, Inc. Microelectronic joining processes with temporary securement
US6271107B1 (en) 1999-03-31 2001-08-07 Fujitsu Limited Semiconductor with polymeric layer
US6191022B1 (en) * 1999-04-18 2001-02-20 Cts Corporation Fine pitch solder sphere placement
US6583354B2 (en) * 1999-04-27 2003-06-24 International Business Machines Corporation Method of reforming reformable members of an electronic package and the resultant electronic package
US6513701B2 (en) 1999-06-24 2003-02-04 International Business Machines Corporation Method of making electrically conductive contacts on substrates
US6173887B1 (en) 1999-06-24 2001-01-16 International Business Machines Corporation Method of making electrically conductive contacts on substrates
US6228687B1 (en) * 1999-06-28 2001-05-08 Micron Technology, Inc. Wafer-level package and methods of fabricating
JP3239335B2 (en) 1999-08-18 2001-12-17 インターナショナル・ビジネス・マシーンズ・コーポレーション Method for forming structure for electrical connection and substrate for solder transfer
JP3223283B2 (en) * 1999-09-14 2001-10-29 カシオ計算機株式会社 Method for manufacturing semiconductor device
US6484927B1 (en) * 1999-11-05 2002-11-26 Delaware Capital Formation Corporation Method and apparatus for balling and assembling ball grid array and chip scale array packages
JP3619410B2 (en) * 1999-11-18 2005-02-09 株式会社ルネサステクノロジ Bump forming method and system
US6613605B2 (en) * 1999-12-15 2003-09-02 Benedict G Pace Interconnection method entailing protuberances formed by melting metal over contact areas
JP3423930B2 (en) 1999-12-27 2003-07-07 富士通株式会社 Bump forming method, electronic component, and solder paste
US6710454B1 (en) * 2000-02-16 2004-03-23 Micron Technology, Inc. Adhesive layer for an electronic apparatus having multiple semiconductor devices
US6408511B1 (en) * 2000-08-21 2002-06-25 National Semiconductor, Inc. Method of creating an enhanced BGA attachment in a low-temperature co-fired ceramic (LTCC) substrate
US6649480B2 (en) * 2000-12-04 2003-11-18 Amberwave Systems Corporation Method of fabricating CMOS inverter and integrated circuits utilizing strained silicon surface channel MOSFETs
US6703688B1 (en) * 2001-03-02 2004-03-09 Amberwave Systems Corporation Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
US6830976B2 (en) * 2001-03-02 2004-12-14 Amberwave Systems Corproation Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
TW498506B (en) * 2001-04-20 2002-08-11 Advanced Semiconductor Eng Flip-chip joint structure and the processing thereof
US20030009878A1 (en) * 2001-07-12 2003-01-16 John Gregory Method for attaching an electronic component to a substrate
US7423336B2 (en) * 2002-04-08 2008-09-09 Micron Technology, Inc. Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices
US6995430B2 (en) * 2002-06-07 2006-02-07 Amberwave Systems Corporation Strained-semiconductor-on-insulator device structures
AU2003247513A1 (en) * 2002-06-10 2003-12-22 Amberwave Systems Corporation Growing source and drain elements by selecive epitaxy
US6982474B2 (en) * 2002-06-25 2006-01-03 Amberwave Systems Corporation Reacted conductive gate electrodes
TWI242478B (en) 2002-08-01 2005-11-01 Masami Nakamoto Metal nanoparticle and process for producing the same
US6845901B2 (en) * 2002-08-22 2005-01-25 Micron Technology, Inc. Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
US6964881B2 (en) * 2002-08-27 2005-11-15 Micron Technology, Inc. Multi-chip wafer level system packages and methods of forming same
TW200414858A (en) * 2003-01-15 2004-08-01 Senju Metal Industry Co Apparatus and method for aligning and attaching solder columns to a substrate
JP4585510B2 (en) * 2003-03-07 2010-11-24 台湾積體電路製造股▲ふん▼有限公司 Shallow trench isolation process
US7410919B2 (en) * 2003-06-27 2008-08-12 International Business Machines Corporation Mask and substrate alignment for solder bump process
WO2005093817A1 (en) * 2004-03-29 2005-10-06 Nec Corporation Semiconductor device and process for manufacturing the same
KR100648039B1 (en) * 2004-09-13 2006-11-23 삼성전자주식회사 method of forming solder ball and related fabrication and structure of semiconductor package using the method
US7331503B2 (en) * 2004-10-29 2008-02-19 Intel Corporation Solder printing process to reduce void formation in a microvia
US9258904B2 (en) 2005-05-16 2016-02-09 Stats Chippac, Ltd. Semiconductor device and method of forming narrow interconnect sites on substrate with elongated mask openings
US20060255473A1 (en) 2005-05-16 2006-11-16 Stats Chippac Ltd. Flip chip interconnect solder mask
JP4895936B2 (en) * 2007-07-19 2012-03-14 新光電気工業株式会社 Mounting method of conductive balls
US7928585B2 (en) 2007-10-09 2011-04-19 International Business Machines Corporation Sprocket opening alignment process and apparatus for multilayer solder decal
US8424748B2 (en) 2009-12-21 2013-04-23 Intel Corporation Solder in cavity interconnection technology
US8936967B2 (en) 2011-03-23 2015-01-20 Intel Corporation Solder in cavity interconnection structures
US8993378B2 (en) 2011-09-06 2015-03-31 Taiwan Semiconductor Manufacturing Co., Ltd. Flip-chip BGA assembly process
US20140055961A1 (en) * 2012-08-23 2014-02-27 Shayan Malek Printed Circuit Boards with Recesses
US8955735B2 (en) * 2013-05-17 2015-02-17 Zen Voce Corporation Method for enhancing the yield rate of ball implanting of a substrate of an integrated circuit
US9120170B2 (en) * 2013-11-01 2015-09-01 Zen Voce Corporation Apparatus and method for placing and mounting solder balls on an integrated circuit substrate
US9953908B2 (en) * 2015-10-30 2018-04-24 International Business Machines Corporation Method for forming solder bumps using sacrificial layer
CA3123200A1 (en) * 2018-12-12 2020-06-18 Connlaoth MULHOLLAND Soldering block for led tape light

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3569607A (en) * 1969-08-01 1971-03-09 Ibm Resolderable connector
US4412642A (en) * 1982-03-15 1983-11-01 Western Electric Co., Inc. Cast solder leads for leadless semiconductor circuits
US4655164A (en) * 1985-12-04 1987-04-07 Rca Corporation Fixture for solder processing integrated circuit package leads
US5039628A (en) * 1988-02-19 1991-08-13 Microelectronics & Computer Technology Corporation Flip substrate for chip mount
US5024372A (en) * 1989-01-03 1991-06-18 Motorola, Inc. Method of making high density solder bumps and a substrate socket for high density solder bumps
US4914814A (en) * 1989-05-04 1990-04-10 International Business Machines Corporation Process of fabricating a circuit package
US5372295A (en) * 1991-10-04 1994-12-13 Ryoden Semiconductor System Engineering Corporation Solder material, junctioning method, junction material, and semiconductor device
JP3086066B2 (en) * 1991-10-29 2000-09-11 富士通株式会社 Cream solder printing method and electronic component soldering method
US5403671A (en) * 1992-05-12 1995-04-04 Mask Technology, Inc. Product for surface mount solder joints
US5211328A (en) * 1992-05-22 1993-05-18 International Business Machines Method of applying solder
US5268068A (en) * 1992-12-08 1993-12-07 International Business Machines Corporation High aspect ratio molybdenum composite mask method
US5480835A (en) * 1993-05-06 1996-01-02 Motorola, Inc. Electrical interconnect and method for forming the same
US5478700A (en) * 1993-12-21 1995-12-26 International Business Machines Corporation Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5536677A (en) * 1994-12-01 1996-07-16 Motorola, Inc. Method of forming conductive bumps on a semiconductor device using a double mask structure
US5782399A (en) * 1995-12-22 1998-07-21 Tti Testron, Inc. Method and apparatus for attaching spherical and/or non-spherical contacts to a substrate

Also Published As

Publication number Publication date
US6030889A (en) 2000-02-29
CA2135508C (en) 1998-11-03
JPH08213505A (en) 1996-08-20
US5658827A (en) 1997-08-19
JP3202903B2 (en) 2001-08-27

Similar Documents

Publication Publication Date Title
CA2135508A1 (en) Method for Forming Solder Balls on a Semiconductor Substrate
AU2777395A (en) Microelectronic contacts and assemblies
KR970001928B1 (en) Process for flip-chip connection of a semiconductor chip
TW347582B (en) Chip package board having utility rings
KR100267159B1 (en) Smiconductor device and method for manufacturing semiconductor device
AU1423797A (en) A ball grid array integrated circuit package that has vias located within the solder pads
EP0714123A3 (en) A semiconductor device, a semiconductor device-mounted apparatus, and a method for replacing the semiconductor device
EP1154471A4 (en) Semiconductor chip and manufacture method thereof
EP0459773A3 (en) Semiconductor device and method for producing the same
SG69995A1 (en) Semiconductor body with solder material layer
JPS55121654A (en) Compression bonded semiconductor device
JPS57143838A (en) Manufacture of semiconductor device
EP1369910A3 (en) Mounting method of semiconductor device
TW341726B (en) Flip-chip type connection with elastic contacts
JPS57115850A (en) Chip carrier for semiconductor ic
CN1118886C (en) Electric connector and method of making same
EP0676806A3 (en) Ball grid array intergrated circuit package with high thermal conductivity.
TW354412B (en) A method of forming a bump, and a semiconductor device
JPS55110051A (en) Lead frame and semiconductor device
TW369688B (en) Method of forming ball grid array contacts
JPS5395575A (en) Pressing contact type semiconductor device and its manufacture
JPS5526684A (en) Semiconductor device
EP1030355A4 (en) Press contact semiconductor device
JPS6431573A (en) Solder removing method
SE9901427D0 (en) Improved solder balls and use thereof

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed