CA2123287C - Pin-fin heat sink - Google Patents
Pin-fin heat sinkInfo
- Publication number
- CA2123287C CA2123287C CA002123287A CA2123287A CA2123287C CA 2123287 C CA2123287 C CA 2123287C CA 002123287 A CA002123287 A CA 002123287A CA 2123287 A CA2123287 A CA 2123287A CA 2123287 C CA2123287 C CA 2123287C
- Authority
- CA
- Canada
- Prior art keywords
- heat sink
- pins
- rods
- retainer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
Abstract
A housed integrated circuit unit package is provided with a heat sink for removal and dissipation of heat from electronic circuits housed in packages. The heat sink, mounted on an outer surface of the package, includes a plurality of pins secured at one end with a retainer and flared out at the other end into a starburst or bouquet configuration, the pins being in the form of rods selected from solid cylinders and tubes. The bottom of the retainer-bound end is coated with a securing substance,such as solder or a heat-conducting adhesive, which is planarized to facilitate positioning of the heat sink on the package. The heat sink is secured to the package by means of solder or a heat-conducting adhesive. The heat sink is produced by securing a plurality of elongated rods by retainers placed at intervals corresponding to a height of the heat sink, cutting off said rods adjacent to one side of the retainer, and flaring the rods at the other free end of the cut-off rods into a starburst-like configuration. The retained ends of the rods are dipped into a solder or heat-conducting adhesive and planarized to provide a planar surface for mounting the heat sink on the surface of the package.
Description
PIN-FIN HEAT SINK
Field of the Invention This invention concerns a heat sink for removal and dissipation of heat from electronic circuits, such as housed in packages.
Back~round of the Invention Integrated circuit units, such as integrated circuit chips (ICs) and hybrid integrated circuit (HIC) modules, are conventionally housed in suitable plastic or ceramic packages to protect them mechanically, electrically and chemically. However, such packages are not always capable of efficiently dissipating the heat generated by the circuits. In order to overcome this problem, a given package is provided with a heat sink that is attached to its outer surface. Typically a heat sink utilizes an array of elongated fins arranged on a common platform. The heat sink is often used in conjunction with a cooling fluid, such as air, circulating through the spaces between the fins for conducting the heat away from the circuit. One example of a prior art pin-fin heat sink, 61, mounted on a pin grid array package, 62, is shown in FIG. 6. In FIG. 7 is shown another version of a prior art channeled-fin heat sink, 71, mounted on quad flatpack package 72. A
drawback of the prior art heat sink is its relative high cost. A pin-fin heat sink is made by a costly process of machining out of a block of metal a plurality of square pin-fins.
Furthermore, a channeled-fin heat sink is highly dependent on the direction of the cooling fluid flow. The fluid flowing through the channels between the fins of the channeled-fin heat sink removes heat much more efficiently than the fluid flowing transverse to the heat sink.
Summary of the Invention In accordance with one aspect of the invention there is provided an encapsulated device with a heat sink, which comprises: a housing enclosing an integrated circuit unit, and a heat sink secured on an outside planar surface of the housing, in which said heat sink comprises a plurality of elongated pins held at one end by a retainer and "~
- ?1 23287 - la-having a flared-out star-burst configuration at the opposite end, said pins being of a material having high thermal conductive characteristics, said one end having a planar surface secured to the planar surface of the housing.
In particular, this invention embodies a heat sink for removal and dissipation of 5 heat from electronic circuits housed in IC packages. The heat sink, mounted on an outer surface of the package, includes a plurality of pins secured at one end with a retainer and flared-out at the other end into a star-burst or bouquet configuration. The bottom of the retainer-bound end is coated with a securing substance, such as solder or a heat-conducting adhesive, which is planarized to facilitate positioning of the heat sink on the 10 package. The heat sink is secured to the package by means of solder or a heat-conducting adhesive. The heat sink is produced by securing a plurality of elongated rods by retainers placed along the rods at intervals corresponding to a height of the heat sink, cutting off said rods adjacent to one side of the retainer to form pins of the heat sink, and flaring the rods at the other free end of the cut-off rods into a star-burst-like 15 configuration. The retained ends of the rods are dipped into a solder or heat-conducting adhesive and planarized to provide a planar surface for "'1~
21~32~ 7 mounting the heat sink on the surface of the package.
Brief Description of the Drawings FIG.lis a schematic representation of an IC package with a pin-fin heat sink embodying the invention;
S FIG.2is a schematic representation of an assembly of rods and retainer rings in the process of fabricating the pin-fin heat sink;
FIG.3is a schematic representation of a bundle of pins and a retaining ring, separated from the assembly of FIG.2;
FIG.4is a schematic representation of the heat sink formed by flaring 10 the pins into a star-burst or bouquet shape;
FIG. 5 is a plot comparing thermal characteristics of a device without the heat sink (curve A), with a conventional pin-fin heat sink (curve B), and with a heat sink embodying this invention (curve C);
FIG.6is a schematic representation of a device with a prior art 15 conventional pin-fin heat sink; and FIG.7is a schematic representation of a device with a prior art channeled-fin heat sink.
Detailed Description Shown in FIG.lis a schematic representation of a typical integrated circuit (IC) package, 10, with a heat-sink, 11. The IC package includes an integrated circuit unit (not shown) and a plurality of electrical conductors, 13. The IC unit may be a chip or a module with at least one chip and other elements and conductors of a hybrid integrated circuit. The housing encloses and protects the IC unit, while allowing electrical connections to be made to the circuit with conductors 13. In the exemplary embodiment shown in FIG.l the electrical conductors are pins of a pin grid array. Alternatively, the conductors could be leads of a lead frame. The heat sink is secured to the IC package by means of solder or an adhesive. The latter comprises an adhesive, such as an epoxy, in which are dispersed particles of heat conductive material, such as copper, aluminum, silver, etc.
Heat sink 11 includes a plurality of pins, 14, in the form of solid rods or tubes of highly thermally conductive material. The pins are secured in a retainer, such as a ring, 15, while the upper part of the pins is flared out into a star-burst or bouquet shape. The size of the ring and the number of pins are selected such that the pins fit into the ring in a tightly fitting manner and to fit the size of the device. The pins are additionally secured in the ring by means of a solder or an adhesive. The lower surface of the heat sink presents a planar surface which is even with the lower - 21232~7 rim of the ring to facilitate positioning the heat sink on and attaching it to IC package 10. Depending on the construction of the device, the heat sink may be secured onthe insulating material of the housing or on a heat-spreader plate, such as plate 16, by means of solder or an adhesive. The flared configuration of the pins permits the use 5 of the heat sink with cooling fluid systems without regard for the direction of the flow of the cooling fluid. Furthermore, the heat sink is relatively easy to produce.
The heat sink is produced by bunching together a selected number of elongated metal rods, 17, and fastening the rods by means of retainers, such as metal rings 15, positioned along the rods at spaced intervals, L (FIG. 2). The rods may be 10 solid or hollow (tubular) and are of a highly thermally conductive material, such as copper, copper alloys, and aluminum. Rings 15 are spaced at intervals (L) corresponding to a desired length of the pins in the heat sink such that when the rods are cut off and flared out at the free end, it will result in the required thermal characteristics and overall volume. A bundle of rods 17 is cut into sections of a 15 preselected length at one side of each ring resulting in a preform shown in FIG. 3 as including pins 14 and rings 15. The size of the ring is selected to tightly embrace each bundle of rods. Instead of a solid ring, the rods may be bound by means of a tape or wire, securing the rods into a tight bundle at the bound end. The rods at the ring side of each bundle are further secured by dipping the cut off end 18 into a 20 molten solder or into a liquid adhesive provided with a filler of heat conducting particles. The surface of the dipped end, after cooling, is ground or machined flat, if needed, to ensure planar fit of the bottom of the heat sink to the IC package.
The rods are flared or fanned outwardly resulting in a star-burst or bouquet form at the free end of the bundle (FIG. 4). To protect the metal of the heat 25 sink from corrosion, the heat sink, with the exception of the bottom of the heat sink, is painted with a thin layer of black paint. The painting also enhances the aesthetic nature of the heat sink, as compared to a possible blotched appearance of oxidized metal of the heat sink.
In FIG. 5 is shown a comparison of thermal characteristics of 30 encapsulated devices with an exemplary bouquet-style heat sink, without a heat sink and with a conventional pin-fin heat sink of the type shown in FIG. 6. The thermal characteristics were tested on a 159 VO CPGA (ceramic pin grid array) package 16 x 16 pin grid array at sea level and room ambient temperature, with a 0.269 inch square power chip and a Cu-W heat spreader. A comparison of the thermal 35 characteristics of the device tested without heat sink (plot A), with a finned heat sink (plot B) and with a bouquet heat sink (plot C), shows that the bouquet heat sink has 2123~87 excellent heat removing characteristics, especially at lower cooling air flow rates.
The plots show that the performance of the device with an exemplary heat sink issuperior to devices without any heat sink and is favorably comparable to deviceswith the commercially available pin-fin heat sink.
S Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details, representative devices, and illustrated examples shown and described. Accordingly, various modifications may be made without departing fromthe spirit or scope of the general inventive concept as defined by the appended claims 10 and their equivalents.
Field of the Invention This invention concerns a heat sink for removal and dissipation of heat from electronic circuits, such as housed in packages.
Back~round of the Invention Integrated circuit units, such as integrated circuit chips (ICs) and hybrid integrated circuit (HIC) modules, are conventionally housed in suitable plastic or ceramic packages to protect them mechanically, electrically and chemically. However, such packages are not always capable of efficiently dissipating the heat generated by the circuits. In order to overcome this problem, a given package is provided with a heat sink that is attached to its outer surface. Typically a heat sink utilizes an array of elongated fins arranged on a common platform. The heat sink is often used in conjunction with a cooling fluid, such as air, circulating through the spaces between the fins for conducting the heat away from the circuit. One example of a prior art pin-fin heat sink, 61, mounted on a pin grid array package, 62, is shown in FIG. 6. In FIG. 7 is shown another version of a prior art channeled-fin heat sink, 71, mounted on quad flatpack package 72. A
drawback of the prior art heat sink is its relative high cost. A pin-fin heat sink is made by a costly process of machining out of a block of metal a plurality of square pin-fins.
Furthermore, a channeled-fin heat sink is highly dependent on the direction of the cooling fluid flow. The fluid flowing through the channels between the fins of the channeled-fin heat sink removes heat much more efficiently than the fluid flowing transverse to the heat sink.
Summary of the Invention In accordance with one aspect of the invention there is provided an encapsulated device with a heat sink, which comprises: a housing enclosing an integrated circuit unit, and a heat sink secured on an outside planar surface of the housing, in which said heat sink comprises a plurality of elongated pins held at one end by a retainer and "~
- ?1 23287 - la-having a flared-out star-burst configuration at the opposite end, said pins being of a material having high thermal conductive characteristics, said one end having a planar surface secured to the planar surface of the housing.
In particular, this invention embodies a heat sink for removal and dissipation of 5 heat from electronic circuits housed in IC packages. The heat sink, mounted on an outer surface of the package, includes a plurality of pins secured at one end with a retainer and flared-out at the other end into a star-burst or bouquet configuration. The bottom of the retainer-bound end is coated with a securing substance, such as solder or a heat-conducting adhesive, which is planarized to facilitate positioning of the heat sink on the 10 package. The heat sink is secured to the package by means of solder or a heat-conducting adhesive. The heat sink is produced by securing a plurality of elongated rods by retainers placed along the rods at intervals corresponding to a height of the heat sink, cutting off said rods adjacent to one side of the retainer to form pins of the heat sink, and flaring the rods at the other free end of the cut-off rods into a star-burst-like 15 configuration. The retained ends of the rods are dipped into a solder or heat-conducting adhesive and planarized to provide a planar surface for "'1~
21~32~ 7 mounting the heat sink on the surface of the package.
Brief Description of the Drawings FIG.lis a schematic representation of an IC package with a pin-fin heat sink embodying the invention;
S FIG.2is a schematic representation of an assembly of rods and retainer rings in the process of fabricating the pin-fin heat sink;
FIG.3is a schematic representation of a bundle of pins and a retaining ring, separated from the assembly of FIG.2;
FIG.4is a schematic representation of the heat sink formed by flaring 10 the pins into a star-burst or bouquet shape;
FIG. 5 is a plot comparing thermal characteristics of a device without the heat sink (curve A), with a conventional pin-fin heat sink (curve B), and with a heat sink embodying this invention (curve C);
FIG.6is a schematic representation of a device with a prior art 15 conventional pin-fin heat sink; and FIG.7is a schematic representation of a device with a prior art channeled-fin heat sink.
Detailed Description Shown in FIG.lis a schematic representation of a typical integrated circuit (IC) package, 10, with a heat-sink, 11. The IC package includes an integrated circuit unit (not shown) and a plurality of electrical conductors, 13. The IC unit may be a chip or a module with at least one chip and other elements and conductors of a hybrid integrated circuit. The housing encloses and protects the IC unit, while allowing electrical connections to be made to the circuit with conductors 13. In the exemplary embodiment shown in FIG.l the electrical conductors are pins of a pin grid array. Alternatively, the conductors could be leads of a lead frame. The heat sink is secured to the IC package by means of solder or an adhesive. The latter comprises an adhesive, such as an epoxy, in which are dispersed particles of heat conductive material, such as copper, aluminum, silver, etc.
Heat sink 11 includes a plurality of pins, 14, in the form of solid rods or tubes of highly thermally conductive material. The pins are secured in a retainer, such as a ring, 15, while the upper part of the pins is flared out into a star-burst or bouquet shape. The size of the ring and the number of pins are selected such that the pins fit into the ring in a tightly fitting manner and to fit the size of the device. The pins are additionally secured in the ring by means of a solder or an adhesive. The lower surface of the heat sink presents a planar surface which is even with the lower - 21232~7 rim of the ring to facilitate positioning the heat sink on and attaching it to IC package 10. Depending on the construction of the device, the heat sink may be secured onthe insulating material of the housing or on a heat-spreader plate, such as plate 16, by means of solder or an adhesive. The flared configuration of the pins permits the use 5 of the heat sink with cooling fluid systems without regard for the direction of the flow of the cooling fluid. Furthermore, the heat sink is relatively easy to produce.
The heat sink is produced by bunching together a selected number of elongated metal rods, 17, and fastening the rods by means of retainers, such as metal rings 15, positioned along the rods at spaced intervals, L (FIG. 2). The rods may be 10 solid or hollow (tubular) and are of a highly thermally conductive material, such as copper, copper alloys, and aluminum. Rings 15 are spaced at intervals (L) corresponding to a desired length of the pins in the heat sink such that when the rods are cut off and flared out at the free end, it will result in the required thermal characteristics and overall volume. A bundle of rods 17 is cut into sections of a 15 preselected length at one side of each ring resulting in a preform shown in FIG. 3 as including pins 14 and rings 15. The size of the ring is selected to tightly embrace each bundle of rods. Instead of a solid ring, the rods may be bound by means of a tape or wire, securing the rods into a tight bundle at the bound end. The rods at the ring side of each bundle are further secured by dipping the cut off end 18 into a 20 molten solder or into a liquid adhesive provided with a filler of heat conducting particles. The surface of the dipped end, after cooling, is ground or machined flat, if needed, to ensure planar fit of the bottom of the heat sink to the IC package.
The rods are flared or fanned outwardly resulting in a star-burst or bouquet form at the free end of the bundle (FIG. 4). To protect the metal of the heat 25 sink from corrosion, the heat sink, with the exception of the bottom of the heat sink, is painted with a thin layer of black paint. The painting also enhances the aesthetic nature of the heat sink, as compared to a possible blotched appearance of oxidized metal of the heat sink.
In FIG. 5 is shown a comparison of thermal characteristics of 30 encapsulated devices with an exemplary bouquet-style heat sink, without a heat sink and with a conventional pin-fin heat sink of the type shown in FIG. 6. The thermal characteristics were tested on a 159 VO CPGA (ceramic pin grid array) package 16 x 16 pin grid array at sea level and room ambient temperature, with a 0.269 inch square power chip and a Cu-W heat spreader. A comparison of the thermal 35 characteristics of the device tested without heat sink (plot A), with a finned heat sink (plot B) and with a bouquet heat sink (plot C), shows that the bouquet heat sink has 2123~87 excellent heat removing characteristics, especially at lower cooling air flow rates.
The plots show that the performance of the device with an exemplary heat sink issuperior to devices without any heat sink and is favorably comparable to deviceswith the commercially available pin-fin heat sink.
S Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details, representative devices, and illustrated examples shown and described. Accordingly, various modifications may be made without departing fromthe spirit or scope of the general inventive concept as defined by the appended claims 10 and their equivalents.
Claims (8)
1. An encapsulated device with a heat sink, which comprises:
a housing enclosing an integrated circuit unit, and a heat sink secured on an outside planar surface of the housing, in which said heat sink comprises a plurality of elongated pins held at one end by a retainer and having a flared-out star-burst configuration at the opposite end, said pins being of a material having high thermal conductive characteristics, said one end having a planar surface secured to the planar surface of the housing.
a housing enclosing an integrated circuit unit, and a heat sink secured on an outside planar surface of the housing, in which said heat sink comprises a plurality of elongated pins held at one end by a retainer and having a flared-out star-burst configuration at the opposite end, said pins being of a material having high thermal conductive characteristics, said one end having a planar surface secured to the planar surface of the housing.
2. The device of claim 1 in which said pins are in the form of rods selected from solid cylinders and tubes.
3. The device of claim 1 in which said retainer is a ring.
4. The device of claim 1 in which the pins at said one end are further secured within the retainer by securing mean selected from solder and a plastic adhesive.
5. The device of claim 4 in which ends of the pins at said one end are planarized by means of a substance selected from solder and plastic adhesives.
6. A method of producing a heat sink comprising a plurality of elongated pins held at one end by a retainer and having a flared-out star-burst configuration at the opposite end, which comprises:
placing retainers along a length of a plurality of elongated rods, said retainers keeping the rods bunched at intervals of predetermined length and said rods being of a material having high thermal characteristics, cutting the rods into sections to form pins, each section including pins of saidpredetermined length and a retainer, coating an end surface adjacent the retainer with a substance selected from solder and a thermally conductive adhesive, planarizing the coated end surface, if needed, and flaring the pins into said flared-out star-burst configuration at said opposite end.
placing retainers along a length of a plurality of elongated rods, said retainers keeping the rods bunched at intervals of predetermined length and said rods being of a material having high thermal characteristics, cutting the rods into sections to form pins, each section including pins of saidpredetermined length and a retainer, coating an end surface adjacent the retainer with a substance selected from solder and a thermally conductive adhesive, planarizing the coated end surface, if needed, and flaring the pins into said flared-out star-burst configuration at said opposite end.
7. The method of claim 6 in which said pins are selected from solid rods and tubes.
8. The method of claim 6 in which said retainer is a ring.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/085,232 US5299090A (en) | 1993-06-29 | 1993-06-29 | Pin-fin heat sink |
| US085,232 | 1993-06-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2123287A1 CA2123287A1 (en) | 1994-12-30 |
| CA2123287C true CA2123287C (en) | 1998-09-15 |
Family
ID=22190306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002123287A Expired - Lifetime CA2123287C (en) | 1993-06-29 | 1994-05-10 | Pin-fin heat sink |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5299090A (en) |
| EP (1) | EP0632498B1 (en) |
| JP (1) | JPH07321259A (en) |
| KR (1) | KR950002008A (en) |
| CA (1) | CA2123287C (en) |
| DE (1) | DE69406201T2 (en) |
| TW (1) | TW366167U (en) |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5390734A (en) * | 1993-05-28 | 1995-02-21 | Lytron Incorporated | Heat sink |
| US5533257A (en) * | 1994-05-24 | 1996-07-09 | Motorola, Inc. | Method for forming a heat dissipation apparatus |
| US5673177A (en) * | 1995-08-01 | 1997-09-30 | International Business Machines Corporation | Heat sink structure with corrugated wound wire heat conductive elements |
| US5696405A (en) * | 1995-10-13 | 1997-12-09 | Lucent Technologies Inc. | Microelectronic package with device cooling |
| US6409521B1 (en) | 1997-05-06 | 2002-06-25 | Gryphics, Inc. | Multi-mode compliant connector and replaceable chip module utilizing the same |
| EP0889524A3 (en) | 1997-06-30 | 1999-03-03 | Sun Microsystems, Inc. | Scalable and modular heat sink-heat pipe cooling system |
| US5860472A (en) * | 1997-09-03 | 1999-01-19 | Batchelder; John Samual | Fluid transmissive apparatus for heat transfer |
| US6026895A (en) | 1998-02-06 | 2000-02-22 | Fujitsu Limited | Flexible foil finned heatsink structure and method of making same |
| US6807059B1 (en) * | 1998-12-28 | 2004-10-19 | James L. Dale | Stud welded pin fin heat sink |
| EP1147695B1 (en) | 1999-02-02 | 2004-12-08 | Gryphics, Inc. | Low or zero insertion force connector for printed circuit boards and electrical devices |
| JP2003506833A (en) * | 1999-08-02 | 2003-02-18 | グリフィクス インコーポレーティッド | Fine pitch wiring with controlled compliance |
| US6830460B1 (en) * | 1999-08-02 | 2004-12-14 | Gryphics, Inc. | Controlled compliance fine pitch interconnect |
| US6957963B2 (en) * | 2000-01-20 | 2005-10-25 | Gryphics, Inc. | Compliant interconnect assembly |
| AU2001232772A1 (en) * | 2000-01-20 | 2001-07-31 | Gryphics, Inc. | Flexible compliant interconnect assembly |
| US6633484B1 (en) * | 2000-11-20 | 2003-10-14 | Intel Corporation | Heat-dissipating devices, systems, and methods with small footprint |
| WO2002041396A2 (en) * | 2000-11-20 | 2002-05-23 | Intel Corporation | High performance heat sink configurations for use in high density packaging applications |
| US6657862B2 (en) | 2001-09-10 | 2003-12-02 | Intel Corporation | Radial folded fin heat sinks and methods of making and using same |
| US6671172B2 (en) * | 2001-09-10 | 2003-12-30 | Intel Corporation | Electronic assemblies with high capacity curved fin heat sinks |
| US6695045B2 (en) * | 2002-03-19 | 2004-02-24 | Mitac Technology Corporation | Bladed heat sink |
| US6817405B2 (en) * | 2002-06-03 | 2004-11-16 | International Business Machines Corporation | Apparatus having forced fluid cooling and pin-fin heat sink |
| US20040150956A1 (en) * | 2003-01-24 | 2004-08-05 | Robert Conte | Pin fin heat sink for power electronic applications |
| TW566838U (en) * | 2003-04-25 | 2003-12-11 | Hon Hai Prec Ind Co Ltd | Heat sink |
| WO2005008838A1 (en) * | 2003-07-07 | 2005-01-27 | Gryphics, Inc. | Normally closed zero insertion force connector |
| GB2410617A (en) * | 2004-01-07 | 2005-08-03 | Jonathan David Cadd | Tube heatsink |
| US7206203B2 (en) * | 2004-06-22 | 2007-04-17 | International Business Machines Corporation | Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins |
| GB0511692D0 (en) * | 2005-06-08 | 2005-07-13 | Digital Projection Ltd | Heat transfer apparatus |
| US20070215335A1 (en) * | 2006-03-14 | 2007-09-20 | Chun-Chi Chen | Heat sink |
| US7644753B2 (en) * | 2006-05-23 | 2010-01-12 | Delphi Technologies, Inc. | Domed heat exchanger (porcupine) |
| US8962306B2 (en) | 2006-09-08 | 2015-02-24 | Thermo Fisher Scientific Oy | Instruments and method relating to thermal cycling |
| US7463484B2 (en) * | 2007-02-05 | 2008-12-09 | Inventec Corporation | Heatsink apparatus |
| US7836939B2 (en) * | 2007-08-01 | 2010-11-23 | Harris Corporation | Non-contacting thermal rotary joint |
| CN201336791Y (en) * | 2008-12-17 | 2009-10-28 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| US10274263B2 (en) | 2009-04-09 | 2019-04-30 | General Electric Company | Method and apparatus for improved cooling of a heat sink using a synthetic jet |
| US9615482B2 (en) | 2009-12-11 | 2017-04-04 | General Electric Company | Shaped heat sinks to optimize flow |
| US8496049B2 (en) * | 2009-04-09 | 2013-07-30 | General Electric Company | Heat sinks with distributed and integrated jet cooling |
| US8776871B2 (en) | 2009-11-19 | 2014-07-15 | General Electric Company | Chassis with distributed jet cooling |
| US8695687B2 (en) | 2010-12-10 | 2014-04-15 | Palo Alto Research Center Incorporated | Hybrid pin-fin micro heat pipe heat sink and method of fabrication |
| US8659042B2 (en) | 2010-12-21 | 2014-02-25 | Palo Alto Research Center Incorporated | Integrated reflector and thermal spreader and thermal spray fabrication method |
| DE102012205178A1 (en) | 2011-04-04 | 2012-10-04 | Ceramtec Gmbh | Ceramic circuit board with Al-cooler |
| US20130306291A1 (en) * | 2012-05-16 | 2013-11-21 | Chia-Ming Tung | Strip heatsink |
| WO2014018852A1 (en) * | 2012-07-27 | 2014-01-30 | Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University | Cold plate for electronics cooling |
| CN103199066A (en) * | 2013-03-03 | 2013-07-10 | 秦吉忠 | Rib-line-type radiator and manufacturing method |
| TWI516713B (en) * | 2013-06-18 | 2016-01-11 | 旭闊系統股份有限公司 | Led illuminating apparatus and heat dissipater thereof |
| CN104051375A (en) * | 2014-01-03 | 2014-09-17 | 深圳市核创新照明科技有限公司 | Rib-line type radiator and manufacturing method thereof |
| CN103794579A (en) * | 2014-02-22 | 2014-05-14 | 秦顺宗 | Radiator |
| USD822624S1 (en) | 2016-08-30 | 2018-07-10 | Abl Ip Holding Llc | Heat sink |
| DE102016222587A1 (en) * | 2016-11-16 | 2018-05-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Heat exchanger structure and method for its production and use |
| US10415895B2 (en) * | 2016-11-21 | 2019-09-17 | Abl Ip Holding Llc | Heatsink |
| USD822626S1 (en) * | 2016-11-21 | 2018-07-10 | Abl Ip Holding Llc | Heatsink |
| US11071234B2 (en) * | 2018-10-30 | 2021-07-20 | Board Of Trastees Of The University Of Arkansas | Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3706127A (en) * | 1970-04-27 | 1972-12-19 | Ibm | Method for forming heat sinks on semiconductor device chips |
| US4450505A (en) * | 1982-06-09 | 1984-05-22 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
| US4479140A (en) * | 1982-06-28 | 1984-10-23 | International Business Machines Corporation | Thermal conduction element for conducting heat from semiconductor devices to a cold plate |
| US4508163A (en) * | 1983-01-18 | 1985-04-02 | Aavid Engineering, Inc. | Heat sinks for integrated circuit modules |
| SU1163126A1 (en) * | 1983-06-15 | 1985-06-23 | Проектно-конструкторское бюро электрогидравлики АН УССР | Semiconductor device cooling fin |
| US4712159A (en) * | 1986-04-14 | 1987-12-08 | Thermalloy Incorporated | Heat sink clip assembly |
| US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
| US5057903A (en) * | 1989-07-17 | 1991-10-15 | Microelectronics And Computer Technology Corporation | Thermal heat sink encapsulated integrated circuit |
| US5057909A (en) * | 1990-01-29 | 1991-10-15 | International Business Machines Corporation | Electronic device and heat sink assembly |
| US5057908A (en) * | 1990-07-10 | 1991-10-15 | Iowa State University Research Foundation, Inc. | High power semiconductor device with integral heat sink |
| US5049981A (en) * | 1990-10-19 | 1991-09-17 | At&T Bell Laboratories | Heat sink for electronic circitry |
| US5107330A (en) * | 1990-10-19 | 1992-04-21 | At&T Bell Laboratories | Self-adjusting heat sink design for vlsi packages |
| SE467721B (en) * | 1990-12-20 | 1992-08-31 | Ericsson Telefon Ab L M | SET TO MANUFACTURE THE TRANSMISSION BODY AND TOOL TO IMPLEMENT THE SET |
-
1993
- 1993-06-29 US US08/085,232 patent/US5299090A/en not_active Expired - Lifetime
-
1994
- 1994-04-26 TW TW086220296U patent/TW366167U/en unknown
- 1994-05-10 CA CA002123287A patent/CA2123287C/en not_active Expired - Lifetime
- 1994-06-22 EP EP94304526A patent/EP0632498B1/en not_active Expired - Lifetime
- 1994-06-22 DE DE69406201T patent/DE69406201T2/en not_active Expired - Lifetime
- 1994-06-28 KR KR1019940014929A patent/KR950002008A/en not_active Application Discontinuation
- 1994-06-29 JP JP6146898A patent/JPH07321259A/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07321259A (en) | 1995-12-08 |
| DE69406201T2 (en) | 1998-02-19 |
| EP0632498A1 (en) | 1995-01-04 |
| EP0632498B1 (en) | 1997-10-15 |
| TW366167U (en) | 1999-08-01 |
| KR950002008A (en) | 1995-01-04 |
| CA2123287A1 (en) | 1994-12-30 |
| DE69406201D1 (en) | 1997-11-20 |
| US5299090A (en) | 1994-03-29 |
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