CA2123287A1 - Pin-Fin Heat Sink - Google Patents

Pin-Fin Heat Sink

Info

Publication number
CA2123287A1
CA2123287A1 CA2123287A CA2123287A CA2123287A1 CA 2123287 A1 CA2123287 A1 CA 2123287A1 CA 2123287 A CA2123287 A CA 2123287A CA 2123287 A CA2123287 A CA 2123287A CA 2123287 A1 CA2123287 A1 CA 2123287A1
Authority
CA
Canada
Prior art keywords
heat sink
rods
heat
package
retainer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2123287A
Other languages
French (fr)
Other versions
CA2123287C (en
Inventor
Kevin James Brady
Charles Cohn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of CA2123287A1 publication Critical patent/CA2123287A1/en
Application granted granted Critical
Publication of CA2123287C publication Critical patent/CA2123287C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece

Abstract

A housed integrated circuit unit package is provided with a heat sink for removal and dissipation of heat from electronic circuits housed in packages. The heat sink, mounted on an outer surface of the package, includes a plurality of pins secured at one end with a retainer and flared out at the other end into a starburst or bouquet configuration, the pins being in the form of rods selected from solid cylinders and tubes. The bottom of the retainer-bound end is coated with a securing substance,such as solder or a heat-conducting adhesive, which is planarized to facilitate positioning of the heat sink on the package. The heat sink is secured to the package by means of solder or a heat-conducting adhesive. The heat sink is produced by securing a plurality of elongated rods by retainers placed at intervals corresponding to a height of the heat sink, cutting off said rods adjacent to one side of the retainer, and flaring the rods at the other free end of the cut-off rods into a starburst-like configuration. The retained ends of the rods are dipped into a solder or heat-conducting adhesive and planarized to provide a planar surface for mounting the heat sink on the surface of the package.
CA002123287A 1993-06-29 1994-05-10 Pin-fin heat sink Expired - Lifetime CA2123287C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US085,232 1993-06-29
US08/085,232 US5299090A (en) 1993-06-29 1993-06-29 Pin-fin heat sink

Publications (2)

Publication Number Publication Date
CA2123287A1 true CA2123287A1 (en) 1994-12-30
CA2123287C CA2123287C (en) 1998-09-15

Family

ID=22190306

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002123287A Expired - Lifetime CA2123287C (en) 1993-06-29 1994-05-10 Pin-fin heat sink

Country Status (7)

Country Link
US (1) US5299090A (en)
EP (1) EP0632498B1 (en)
JP (1) JPH07321259A (en)
KR (1) KR950002008A (en)
CA (1) CA2123287C (en)
DE (1) DE69406201T2 (en)
TW (1) TW366167U (en)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
US5533257A (en) * 1994-05-24 1996-07-09 Motorola, Inc. Method for forming a heat dissipation apparatus
US5673177A (en) * 1995-08-01 1997-09-30 International Business Machines Corporation Heat sink structure with corrugated wound wire heat conductive elements
US5696405A (en) * 1995-10-13 1997-12-09 Lucent Technologies Inc. Microelectronic package with device cooling
US6409521B1 (en) 1997-05-06 2002-06-25 Gryphics, Inc. Multi-mode compliant connector and replaceable chip module utilizing the same
EP0889524A3 (en) 1997-06-30 1999-03-03 Sun Microsystems, Inc. Scalable and modular heat sink-heat pipe cooling system
US5860472A (en) * 1997-09-03 1999-01-19 Batchelder; John Samual Fluid transmissive apparatus for heat transfer
US6026895A (en) * 1998-02-06 2000-02-22 Fujitsu Limited Flexible foil finned heatsink structure and method of making same
US6807059B1 (en) * 1998-12-28 2004-10-19 James L. Dale Stud welded pin fin heat sink
DE60016563T2 (en) 1999-02-02 2005-05-12 Gryphics, Inc., Plymouth CONNECTORS WITH LOW OR LOW MOUNTING POWER FOR PCB AND ELECTRICAL DEVICES
US6830460B1 (en) 1999-08-02 2004-12-14 Gryphics, Inc. Controlled compliance fine pitch interconnect
EP1204988A2 (en) * 1999-08-02 2002-05-15 Gryphics, Inc. Controlled compliance fine pitch interconnect
JP2003520454A (en) * 2000-01-20 2003-07-02 グリフィクス インコーポレーティッド Flexible compliance interconnect assembly
US6957963B2 (en) 2000-01-20 2005-10-25 Gryphics, Inc. Compliant interconnect assembly
US6633484B1 (en) * 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
WO2002041396A2 (en) * 2000-11-20 2002-05-23 Intel Corporation High performance heat sink configurations for use in high density packaging applications
US6671172B2 (en) * 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US6657862B2 (en) 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6695045B2 (en) * 2002-03-19 2004-02-24 Mitac Technology Corporation Bladed heat sink
US6817405B2 (en) * 2002-06-03 2004-11-16 International Business Machines Corporation Apparatus having forced fluid cooling and pin-fin heat sink
US20040150956A1 (en) * 2003-01-24 2004-08-05 Robert Conte Pin fin heat sink for power electronic applications
TW566838U (en) * 2003-04-25 2003-12-11 Hon Hai Prec Ind Co Ltd Heat sink
EP1642364A1 (en) * 2003-07-07 2006-04-05 Gryphics, Inc. Normally closed zero insertion force connector
GB2410617A (en) * 2004-01-07 2005-08-03 Jonathan David Cadd Tube heatsink
US7206203B2 (en) * 2004-06-22 2007-04-17 International Business Machines Corporation Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins
GB0511692D0 (en) * 2005-06-08 2005-07-13 Digital Projection Ltd Heat transfer apparatus
US20070215335A1 (en) * 2006-03-14 2007-09-20 Chun-Chi Chen Heat sink
US7644753B2 (en) * 2006-05-23 2010-01-12 Delphi Technologies, Inc. Domed heat exchanger (porcupine)
US8962306B2 (en) * 2006-09-08 2015-02-24 Thermo Fisher Scientific Oy Instruments and method relating to thermal cycling
US7463484B2 (en) * 2007-02-05 2008-12-09 Inventec Corporation Heatsink apparatus
US7836939B2 (en) * 2007-08-01 2010-11-23 Harris Corporation Non-contacting thermal rotary joint
CN201336791Y (en) * 2008-12-17 2009-10-28 鸿富锦精密工业（深圳）有限公司 Radiator
US10274263B2 (en) 2009-04-09 2019-04-30 General Electric Company Method and apparatus for improved cooling of a heat sink using a synthetic jet
US8496049B2 (en) * 2009-04-09 2013-07-30 General Electric Company Heat sinks with distributed and integrated jet cooling
US9615482B2 (en) 2009-12-11 2017-04-04 General Electric Company Shaped heat sinks to optimize flow
US8776871B2 (en) 2009-11-19 2014-07-15 General Electric Company Chassis with distributed jet cooling
US8695687B2 (en) 2010-12-10 2014-04-15 Palo Alto Research Center Incorporated Hybrid pin-fin micro heat pipe heat sink and method of fabrication
US8659042B2 (en) 2010-12-21 2014-02-25 Palo Alto Research Center Incorporated Integrated reflector and thermal spreader and thermal spray fabrication method
EP2695189A1 (en) 2011-04-04 2014-02-12 CeramTec GmbH Ceramic printed circuit board comprising an al cooling body
US20130306291A1 (en) * 2012-05-16 2013-11-21 Chia-Ming Tung Strip heatsink
WO2014018852A1 (en) * 2012-07-27 2014-01-30 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Cold plate for electronics cooling
CN103199066A (en) * 2013-03-03 2013-07-10 秦吉忠 Rib-line-type radiator and manufacturing method
TWI516713B (en) * 2013-06-18 2016-01-11 旭闊系統股份有限公司 Led illuminating apparatus and heat dissipater thereof
CN104051375A (en) * 2014-01-03 2014-09-17 深圳市核创新照明科技有限公司 Rib-line type radiator and manufacturing method thereof
CN103794579A (en) * 2014-02-22 2014-05-14 秦顺宗 Radiator
USD822624S1 (en) 2016-08-30 2018-07-10 Abl Ip Holding Llc Heat sink
DE102016222587A1 (en) * 2016-11-16 2018-05-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Heat exchanger structure and method for its production and use
US10415895B2 (en) * 2016-11-21 2019-09-17 Abl Ip Holding Llc Heatsink
USD822626S1 (en) * 2016-11-21 2018-07-10 Abl Ip Holding Llc Heatsink
US11071234B2 (en) * 2018-10-30 2021-07-20 Board Of Trastees Of The University Of Arkansas Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3706127A (en) * 1970-04-27 1972-12-19 Ibm Method for forming heat sinks on semiconductor device chips
US4450505A (en) * 1982-06-09 1984-05-22 Sperry Corporation Apparatus for cooling integrated circuit chips
US4479140A (en) * 1982-06-28 1984-10-23 International Business Machines Corporation Thermal conduction element for conducting heat from semiconductor devices to a cold plate
US4508163A (en) * 1983-01-18 1985-04-02 Aavid Engineering, Inc. Heat sinks for integrated circuit modules
SU1163126A1 (en) * 1983-06-15 1985-06-23 Проектно-конструкторское бюро электрогидравлики АН УССР Semiconductor device cooling fin
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US4849856A (en) * 1988-07-13 1989-07-18 International Business Machines Corp. Electronic package with improved heat sink
US5057903A (en) * 1989-07-17 1991-10-15 Microelectronics And Computer Technology Corporation Thermal heat sink encapsulated integrated circuit
US5057909A (en) * 1990-01-29 1991-10-15 International Business Machines Corporation Electronic device and heat sink assembly
US5057908A (en) * 1990-07-10 1991-10-15 Iowa State University Research Foundation, Inc. High power semiconductor device with integral heat sink
US5107330A (en) * 1990-10-19 1992-04-21 At&T Bell Laboratories Self-adjusting heat sink design for vlsi packages
US5049981A (en) * 1990-10-19 1991-09-17 At&T Bell Laboratories Heat sink for electronic circitry
SE467721B (en) * 1990-12-20 1992-08-31 Ericsson Telefon Ab L M SET TO MANUFACTURE THE TRANSMISSION BODY AND TOOL TO IMPLEMENT THE SET

Also Published As

Publication number Publication date
DE69406201T2 (en) 1998-02-19
KR950002008A (en) 1995-01-04
TW366167U (en) 1999-08-01
US5299090A (en) 1994-03-29
EP0632498A1 (en) 1995-01-04
EP0632498B1 (en) 1997-10-15
JPH07321259A (en) 1995-12-08
DE69406201D1 (en) 1997-11-20
CA2123287C (en) 1998-09-15

Similar Documents

Publication Publication Date Title
CA2123287A1 (en) Pin-Fin Heat Sink
US5464054A (en) Spring clamp and heat sink assembly
US5276585A (en) Heat sink mounting apparatus
US7064429B2 (en) Electronic package having integrated cooling element with clearance for engaging package
US6501103B1 (en) Light emitting diode assembly with low thermal resistance
US5365399A (en) Heat sinking apparatus for surface mountable power devices
EP0127115A2 (en) Heat sink structure for an electronic package
EP0962123A4 (en) Heat sink mounting assembly for surface mount electronic device packages
US5901048A (en) Printed circuit board with chip collar
CA2205763A1 (en) Ultrasonic vibration bonding chip mounter
DE69835747D1 (en) SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIPS
EP1198005A4 (en) Semiconductor module and method of mounting
SG95603A1 (en) High performance integrated circuit chip package
DE68928320T2 (en) Surface mount type edge mount package for semiconductor integrated circuit devices
US6252773B1 (en) Heat sink attachment apparatus and method
JP3415699B2 (en) Packaged integrated circuit and manufacturing method thereof
EP0700086A3 (en) Integrated circuit package with improved heat dissipation
RU97117466A (en) ASSEMBLY ASSEMBLY FOR FIXING A HEAT RADIATOR REGARDING THE SURFACE OF AN ELECTRONIC DEVICE
KR980005941A (en) Leadframe with detachable die attach paddles
CA1193754A (en) Heat exchanger for integrated circuit packages
EP0883179A3 (en) Spiral pin-fin heatsink for electronic packages
KR970703045A (en) Heat Sink for Integrated Circuit Package (HEAT SINK FOR INTEGRATED CIRCUIT PACKAGES)
DE69936686D1 (en) Substrate for mounting a semiconductor chip
JPH0472747A (en) Semiconductor device
KR200171774Y1 (en) Carrier for carrying semiconductor package

Legal Events

Date Code Title Description
EEER Examination request
MKEX Expiry

Effective date: 20140512