CA2117915A1 - Thermally activatable modular construction element, its use, direct glazing process for vehicles, and adhesive - Google Patents

Abstract

ABSTRACT
The storable modular component, especially a storable glass module, is prepared for assembly by gluing to another component without using an additional assembly glue. Along its edge it displays a profiled bead of a latent reactive adhesive which includes predominantly one or more polyurethanes with blocked isocyanate groups, or one or more polyurethane preproducts consisting of polyols and/or polyamines and encapsuled polyisocy-anates, or one or more polyurethanes with radically polymerizable groups. In this case the reaction of the adhesive can be initi-ated at an activation temperature of 70 to 180°C. At the same time, it remains tacky and nonflowing but plastically deformable for a time sufficient for assembly. The stated materials are capable of being activated by being supplied with electrical, electromagnetic or magnetic energy or by infrared radiation. The adhesive may contain magnetizable and/or electrically conductive fillers. The glass module is used for direct glazing of vehi-cles, especially automobiles.

Description

, Swiss Federation Federal Office for Intellectual Propertv ~nticipated Class: E06~/B60J/C09J
Patent Application No.: 00 354/94 Proprietor:
Gurit Essex AG, Freienbach, Switzerland Date of Application: 8 February 1994 Representatives:
Rottmann, Zimmermann + partner AG, Zurich ~
Reference: 22638 -Title:

HEBT ACTIVATED ~ODULaR CONPON~NT, IT8 U8E, PROC~SS
FOR DIR~CT GLA~I~G OF VB~ICLE8, AND ~D~E~IVE
.
The invention concerns : ~ -:
-a heat activated modular component as described in claims 1 .
through 23, : ~ -the~use of the modular component according to the invention : .:
for the direct glazing of vehiclPs, especially automobiles as .

descr~ibed in claim 24 -~
: , . .~ . .
-. ,: , a process for direct glazing or vehicles especially automo~
:biles as described in claims 25 through 51, and :~
an adheslve as described in clalms 52 through 54.
From~the publications EP-B1-0 345 134, EP-Bl~0 312 296 and : EP-B~1-0 351 36:9 prefabricated vehicle windows are alreadv:known for~direct~glazlnq by gluing into a frame, flange or the llke which along their edge display a first trough-profiled adhesive ~
~: strip which~is elastically but not plastically deformab!le and ~ ~l .
whlch is provided with a second adhesive strip, possibly covered ~ ~:
~by~a~:~protective shell:and/or capable of belng activa~ted, o~ a .~2 :~-material chemically::~compatible with the first adhesiva strip.
~Such~prefabric~ated vehlc1e wlndows can be~used as a ready-to install-component for~gluing:into vehicle bodies without:using an .

addit~ional assembly~glue. ~ :C,.,~

~ ` 2~7~
,` .`, ~.",,.
, " ,~, -In this case the preparation of the vehicle window is ~ ;
performed separately in time and space from the actual installa-tion of the window. In other words, the pane of glass can be prepared as a ready to install independent component in an optimized environment with ideal timing and under the best conditions to such an extent that it is necessary only to remove the protective shell has to be removed and/or to activate the second adhesive.
. -Suitable materials for the second adhesive strip named there are: ;;
(a) oxidatively hardening adhesive substances These must be stored with exclusion of air and oxygen and ;~
~therefore modules absolutely require a protective foil or protec~
tive shell.
(b) Moisture-reactive adhesives These must be stored under exclusion of moisture and there-fore also absolutely require a protective foil or protective shell. ;;~
(c) Thermoplastic adhesives ~ , The classical melting adhesives called "hot melts" are solid - ~;
st room temperature and when warmed to a certain temperature ~generally! lying above~150C they become paste-like. A covering by a protective foil or protective shell is not absolutely ';~
necessary here, except possibly to protect against soiling and mechanical damage. In order to arrive at satisfactory thermal ;`
stability~ such products for the auto lndustry must have a softening point above 120C. Such nonreactive adhesives are not ;
:: :- :~ -;. .

2 1 1 ~

used for structural joints and for gluing safety parts in vehicle construction. , (d) Thermosetting adhesives , These differ from the thermoplastic adhesives mentioned under (c) in the fact that at a certain critical temperature Tk they are lrreversibly cured or hardened. Therefore when the --second adheslve strip is applied to the first adhesive strip they ,~, '' ' can~only;be warmed up to a certain first transition temperature Tl lying below the critical temperature Tk. Such products are ,~' , : ~
available but they are either moisture-sensitive and require a covering foil or else they must be held at the curing temperature ',' -,; ,', '~ until they~ are~totally cured.
' ~ (e) Slow reacting two-component systems By a sultable~choi~ce of;~chemical composit~1on these systems ~,'~; ;''','~' can be adjusted to a suitable open time. Here also a covering ,,~
with~a~p~rotective foi~l or~protective shell lS ~not a~bsolutely~ ~ -` ,' ~,'''' neces`sary.' ~Howeverr these~systems are very long in curing and ;',~',',',,,~';,,~
requlre 10ng~flxatlon after 1nsta1;1ation.
;A11~of the~so1ut1ons~named except varlant (;c) share the~
feature;that~the second~adhesive~paxtia~1 strip~requires shielding of;~tha f1rst trough-shaped cured partial strip. In addition the ;'~"', ~ ;~
troughls~hape fast hard'ening a`dhesive~partiial strip~must~be ~ i! ',~ ,~
se1ected~such~ that the~diffu5ion~0f;moisture through the material ,ls~practically~zero in~order to ach1eve a storage~cspaclty of~
-~;more~than a~few~days. ~Thls~1imits~the possibi1it1es of~the choice~of~materia~ great1y~so~that~the~moisture-hardening poly~
urethanes ln~particu1ar may not be~used.

~` - 2 1 ~ 3 ~:

The use of covering foils or protective shells such as is necessary in the above mentioned publications is problematic in two respects. First, it is difficult to seal the coverings against the trough-shaped partial strip, especially in the curved `
areas. Second, the covering material is an undesired waste ~
product which must be collected and recycled. ~ --- : , ~ ::~
In Table 1 typical guideline values for the most important properties of some of the materials named in the publications cited are given.
Table 1 . .. . _ _ _ . --Substance Storage time ~ctivation Open tim~
grou~
(a) 2 to 6 months Oz contact after removal of 10 to 30 l ~ :
protective foil min I .:. .
_ 11 ~ "~
: (b~ 30 min to 2 aLr humidity after removal of 10 to 30 l :
weeks protective foil min ¦
_ . ~. -; , (c) 6 to 12 heat 5 sec. to months l min _ _ _ , ~ . . . .
:(d) 6 to 12 heat after removal of protect 20 sec. to : months foil 3 min I ~ ~ .
. ~ . ,, (e) 30 to ~80 min mln :' - .'. ' ~':
In the meanwhile, however, requirements have been imposed on the automobile industry which cannot be satlsfied by the above~
mentioned substance group. The increasing automation on the assembly line requires a reduction in assembly line components by -~
modulization, i.e. prevlous assembly of modules in special ~:
preassembly islands or preferably by the supplier. 5ince this solution also entails indirect advantages in administration and ;, :
logistics not to mention waste disposal costs, it is expected to spread to other branches of industry also. In the case of direct glazing the elimination of machines such as pumps and robots or ,' ~

.. ~

~` 2 1 1 7 ~

.
the reduction in their number also signifies a saving o~ space and a reduction of the risks related to the use of chemicals. -However, on the other hand, it also means that such prefabricated modules are generally stable over a sufficiently long storage and transportation time of 1 to 3 months~. In addition solutions which require special packages and which cause waste products or recycling operatlons are less deslred. ~
In addition, cycle tlmes are demanded which are far b~low -~-the cycle times~that are~realizable w1th the above mentioned - ;
substance groups. In partlcular cycle times of less than 50 s ~;
are required within which such a module is~made capable of being -;~
glued~and installed.~ Furthermore,~the assemb~ly~should be possible~without conventional aids such as lntermediate parts, ~spacers, adheslve tapes etc.;which prevlously were used to ~-h prevent slipping. ~ , `" ,"~ ,j h .: ,~
;In~the~rest~of~indust~y~also~the need exists for a ~ointlng~
~system~by~structura~ glulng~o~f~-component~parts in~:which the adhesive~ is;~alrèady preapplied to~ the~joint partners which, on thq~one~hand,~ls capable~ oP storage~and tranæportatl~ons, but on~
` ~he other ~can~be~joined ~ithin~short~assembly cyoles and can~
subsequently~be worked ~urth r as a whole without a waiting `~
pèr;iod~
The~purpose~of the~lnvention~was~now~to create a storable heat~act~ivatable~modular;~structural component and~a process for ng~a~modùlar~component~to;another~component, especlally for direct glaz-1ng~of~vehic1es,~whlch~satl~sfles~;these~requ1rements.

~;~

.t 7 ~

- This problem is solved by a storable modular component .
according to the general part of claim 1 according to the invention by the fact that it displays along its edge a profiled ~ .
adhesive strip of a latent reactive adhesive which consists ~ :
predominantly of: ~ ;
-one or more polyurethanes with blocked isocyanate groups, or -one or more polyurethane preproducts which consists of polyols and/or polyamines and of encapsuled polyisocyanates, or .:
one or more polyurethanes with radically polymerizable ~ - ~
groups, - .
in which the reaction can he initiated at an activation tempera- :~
ture of 70 to 90C, and which simultaneously remains tacky and : : .
' ~: ., ~. .:
nonflowing but plastically deformable for a time sufficient for assembly. ~-The process according to the invention for direct glazing of - . -- : :. :
vehicles according to the general part of Claim 24 is character-i.zed by the fact that one applies: ~ :

-along the edge of the modular component a profiled adhesive .~-. .
.
strip of a latently reactive adhesive consisting predominantly ~ ;~
of~
one or more polyurethanes with blocked isocyanate ~ :
groups, ; ~ -one or more polyurethane-preproducts consisting of :-polyols and/or polyamines and of encapsuled polyisocyanates, or --or or more polyurethanes with radically polymerizable groupS, 79~
,,, ,- , , in the soft state;
-the adhesive strip, if necessary after heating to its ' activation temperature of 70 to 180C along its contact surface ' "-with the modular component is allowed to harden in order to bring ~ ' .
it to reaction, ', ~
-the thus obtained storable modular component, if necessary ' ' '' -' after intermediate storage, is transported to an assembly line, ;-~
:, ., ,:: :: ~ , . , ~ -if necessary, the uncured parts of the adhesive are brought ''-' :~
: to react at least along the contact area wlth the modular compo- ''''''~;''~"'1.:'''''' nent by rapid heating to an actlvation temperature of 70 to 180C ~ ''"'x and the non-pressure-deformable part of the adhesive is made :~''-''.'.
plast.ically deformable but non-flowing over the entire cross- -.' -"' section, tha modular component ls brought~together with the other ~ ' ;component:to whlch lt is to be glued, pressed~together at a '; '~
preass;lgned~j~oining distance, if~necessary the still unactivated ' ~
part~of the~adhesive l5 rap1dly heated to the activation tempera- '' ''~!.''`.'.`` '' ture of 70 t~o~180C Eor lnitiation of~the rea~ction and the joint '~
:immobilized at least until the adhesive ha~s set:and then allows i ~:
to~-f1n1sh reaatlng~without taklng further action, with the qualification that the d1fference between the applica~
t~ion temperaturè and 'the~ actlvation temperàture of the adhesivés ~ ~
.is~at least'20C:. ~: -;'.":~-''='~''~'.-.' Acco~ding to a prsferred version the adhesive along its '~
~contact~surface~with the modùlar component may already be:brou~ht to~react1on~ following appllcation of the~bead;of adheslve by r :~ b~t.

This has the advantage that the bonding of the adhesive to its support is already assured upon arrival at the assembly site.
In this way in the case when the adheslve becomes plastically deformable, a pretreatm~nt of the component before installation may be entirely omitted. If the adhesive melts at temperatures -'- -above 35C, in this case warming of the still uncured part of the -adhesive to a temperature above its melting point is sufficient. -~
The latently reactive adhesives used according to the invention in a preferred version contain one or more polyurethane -~
prepolymers with blocked isocyanate groups or radically polymer~
izable groups or polyols, polyamines and encapsuled polyisocyan~
ates where at least one of~the components of the adhesive is ; ;
. .
crystallizing and the mixture for the overwhelming part melts ;

between 25 and 80C, preferably between 35 and 60C. ~ -, . -, In another variant a mixture of noncrystallizing polyure~
thane prepolymers and crystallizing polyurethane prepolymers or a ~mixture of noncrystallizing and crystallizing polymeric polyols -are used in combination with polyamines and encapsuled isocyan-ates. In this case the two types of polyurethane prepolymers may ~ i also be combined in a copolymer with crystallizing and noncrys~
-:
tallizing molecule parts. As the crystallizing components, for . .
example,lone may use the reaction products of dilsocyanates with ;~
crystallizing polyether polyols such as polytetrahydrofuran, polyethylene glycol, with crystallizing polycarbonate polyols, as well as those~obtained by reaction of 1,4-butanediol with diaryl-`carbonates, e.g. diphenylcarbonates or phosgene.

-' 9 ;'`',`

:'. . ~,.I :.
. . , ~:

2 1 t ~ ~ 17 ! ~ ~
' ':' '''''"'' -' , ' ,, ,-Other examples of crystallizing components are the polyesterpolyols such as polycaprolactone or butanediol-adipic acid-hexanediol polycondensates or polyesteramide polyols which are obtainable, e.g. by reaction of a carbonyl-terminated polyamide ~--oligomer with hydroxyl-~erminated polyethylene terephthalate oligomers or the reaction products of said polyols with diiso-- . :. : ,-, -, -cyanates.
As crystal~lizing components~in addltion one may also use -~
nonreactive substances such as solid softeners, e.g. stearates or hydrogenated ricinus oil or its derlvatives.
Another possibility consists in mixlng thermoplastics into ;the latent reacted polyurethane prepolymer. Examples of such thermoplastics are ethylene-acrylate copolymers, ethylene-acrylic ~ ~acld copolymers, ethylene-vinyl acetate copolymers and thermo~
;~ ~plastic polyurethanes.
Another group of crystalllzing components;is the reaction products of diisocyanates wlth;short-chalned diols, which form '-hard segments~. As protective groups for blocking the isocyanate ,~
groups~ of the prepolymer, in principle, H-active compounds may be ~used~whlch~oan~be spllt off again below the temperature of~the~
polyurethanes. Oximes, phenols and lactams are especially suitable Depending on~the blocklng group it may be necessary, ln order to lower the deblocking temperature5, to add catalysts. ~ `~
~Suitable catalysts are organometal~catalysts such as dibutyltin dllaurate (DBTL~, metal~salts and organic aclds of the tertiary am1nes such as~triethy1enedlamine. ~ In~this case~to lengthen~the :.' ` ?
:''.. .
- 21~7~1~

storage capacity of the latently reactive hot melt adhesives it is desirable to use amine catalysts in the form of their salts - -with organic acids.
The adhesives according to the invention may additionally contain low molecular polyfunctional compounds such as polyols, -e.g. trlmethylolpropane or polyam1nes~such as diethyltoluene diamine for partial pre-crosslinking of the hot adhesives during activation. Instead of these polyfunction~l compounds one may ~-use latent amine hardeners such as dicyanodiamide, phthalic acid anhydride- amine adducts, methylene dianiline salt complexes or other latent hardeners such as are known to the expert.
Instead of polyurethanes with block isocyanate groups, according to the invention, polyurethane preproducts may also be used whose polyisocyanates are low molecular solid compounds ;~ which are protected by a shell of urea and cannot react at room temperature~with the H-active compounds. As H-active compounds ;~one preferably uses macromolecular polyols and/or polyamines and possible;additionally lo~ molecular diols and/or aromatic di~
amines as chain lengtheners. Alternatively, polyurethane pre-polymers with hydroxyl or aromatic amine end groups may be used -in comblnation wlth the blocked polyisocyanate. ;~
The bloc~ing of the isocyanates is preferably achieved with al1phatic primary or secondary amines such as are described in :: ~
the publication EP-B1-0 062 780.
Upon activation of the adhesive by heat, the urea shell is destroyed~by~this and the polylsocyanate liberated. The latter `;
reacts immediately with the H-actlve compounds. Suitable solid ,~, . - ., - .

:~ - 2~.~79~ :

polyisocyanates are, for example, dimeric 4,4'-diisocyanato-diphenyl methane, 3,3'-diisocyanato-4,4'-dimethyl-N,N'-diphenyl- ;~ ~
urea, trimetric isophoron diisocyanate or l,4-phenylene diiso- ~ ~ -cyanate. If polyurethane prepolymers with hydroxyl end groups ¢
are used as the H-active compounds, then by the proper choice of - -the functionality and reactivity it is possible upon heat activa~
tion to obtain the corresponding prepolymers with free isocyanate -end groups which subsequently react with air humidity and cross~
link the polyurethanes.
Another preferred version Of the latently reactive adhesives is based on polyurethanes whose chain ends display radically polymerizable groups. Such groups are preferably acrylate or methacrylate yroups such as can be obtalned by reacting isocyan- `
ate functional prepolymers with OH functional acrylates or methacrylates, e.g. 2-hydroxyethylacrylate or 3-hydropropyl- i.
acrylate o~r by reacting OH or NH functional prepolymers with isocyanatoacrylates or methacylates.
In this variant the adhesives are activated along the contact surface with the support~module upon application OL the `
adhesive bead or before the joining of the module by exposure to heat. ~ -In that version of the invention which envisions the pre~
hardening of the adhesive along its contact surface w1th the -~ ;
support, the duration and intensity of heat exposure is selected such that the thickness of the cured layer lS less than the intended mlnimum thickness of the adhesive jolnt to be formed ~ -after ~oining. Preferably the cured layer thus formed is not ~ ~ -12 ` ~ `

7 ~

significantly thinner, because thus after joining the remaining part still to be cured of the adhesive is minimal. In this case the curing after assembly is possible by heat conduction from the -;
hot ~oint partner even in the case of thick adhesive joints.
The above mentioned adhesive materlals for adhesive strips have~a number of advantages compared to the known materials:
-Under ambient conditions they are capable of being stored ~for up to 3 months without the need for special protective measures such as covering foils or lacquer films. Nevertheless ~i they can be activated wlthin a few seconds to a few minutes. ~ .
-The above mentioned materials accordlng to a preferred ~version are already soft and tacky above 35C and therefore capable of forming a joint. At the same time st room temperature they are essentially solid and do not deform when handled.
-Preferred materials are capable of being pumped already at a temperature~Tp of 50 to G0C and~display a first transition ~point tl~2rom~40 to 50C.
The~act1vation and the lnltlation of crosslinking in a ~`~
referred version is already achieved at a temperature Tk of 80C
so that~a~rapid~and unproblematic activation lS posslble. ~ ---Said materials may be pumped from a supply container to the -~
applicator~ e.g. afnozzlè or a doctor blade wlthout starting the :~. . : ~: .~.
activation and~without noticeably aging.

-Said materials, in a preferred version, a~ter application : :: rapidIy return to a state in which they are dry and touchable.

~As a result a rapld rhythmlcal production of precoated modules is ~`

possible.
. . :: .
~ ~ 13 ~ ~

: . ; :,. :

2 ~
, ~, ,"
,.,,~, ~

-Said materials can be heated to the activation temperature withoui losing their shape.
-The activation and, if necessary, the partial crosslinking can be initiated within 2 minutes, preferably within 1 minute, in ;
an especially preferred version, even within 30 seconds, and the curing continues beyond assembly. Such short activation and -reaction times are to be had when polyurethane preproducts are used in combination with encapsuled solid polyisocyanates.
5imultaneously with activation the adhesive in brought into a plastic form. During installation and subsequent fixation the adhesive hardens again so that the glass pane is firmly seated without slipping or springing back. -~
-Said materials can be activated by the introduction of electrical, electromagnetic, or magnetic energy and softened at ~-the same time without the occurrence of local overheating.
-In a preferred version using blocked isocyanate prepolymers ~ -~
or encapsuled isocyanates the above mentioned materials display enough~active isocyanate groups to anchor themselves to the ~ -~
substrates to be glued, especially a lacquered substrate and to ^`
build up an aging-resistant joint.
-In another version which permits especially simple activa~
tion the adhesive is activated only along lts contact surface `i~
with its support.
-In order to activate the glass module according to the `~
invention, in principle, any form of heat may be used. Howaver, heating in a conventional convection oven is not suitable for - :. . ~ ~, ,-reaching a rapld integral heating of the latently reactive adhe-.~ ,,,,~,, .

.~., ,:. - ..:

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sive. Following this, therefore the glass itself and a possible border frame are jointly warmed to the same extent, which for the case that immediate adhesion is achieved after assembly by cooling and crystallization of the adhesive, is obstructive to -rapid adhesion after assembly without additional reinforcement.
However, if the adhesive bead along its contact surface with the support module hi~s already been activated, then air with a ~ -~
temperature below the activation temperature is suitable for melting the remaining adhesive. .
In the case when infrared radiators are used it is possible to achieve a rapid and specific heating of the adhesives from the surface. However, the problem ls~that the surface is slightly overheated before the base of the plastic bead reaches the necessary activation temperature.
, ~ "
On the other hand, infrared radiation is very well suited for activating the base of the adhesive along its surface with : thé support. In this case the modular component is irradiated from the back side. This is advantageous especially for glass ~ -i: ., .
modules where the thermal radiation penetrates the glass practi~
cally without obstacle and heats the adhesive on its contact surface or interface with the glass. Although an intermediate layer isipresent betwèen the adhesive and~the glass surface, especially the customary black enamel paint and possibly a black primer for masking and protecting the adhesive interface against damaging ultraviolet radiation and under some conditions a profiled plastic mass for holdiny the glass edge, this method :~ :
-- , .
' ~ ,~ , -:~ ~ ' ,' ~` "`` ` 2 1 ~ 7 9 1 ~
-", :", permits a rapid and specific heatiny of the adhesive without ;
significantly heating the glass support.
A modification of this method consists in using, instead of infrared radiators, a beam-expanded relatively long wave laser, ;--e.g. an Nd-YAG laser which drives the contact surface toward the glass from the back side of the glass.
The heating with infrared radiation, especially with bright radiation, lS well suited for activating the adhesive only after -~
assembly or the jcining of the modular components according to -~
the invention even if the latter has not yet cured on its contact -~
~urface on the support. This is especially the case when a glass ~- -,, " ~ ~, module is involved, and the method is especlally effictive if the ~olnt partner consists of a fully heat conducting material, especially of plastic. `~
It has been found that electrical, electromagnetic or `~.;
magnetic energy can be used advantageously for the integral ;~
activation of the adhesive~strip. By allowlng this~form of '!.~;''~;.~ .'',':;" ".
energy ta act specifically on the mass of the~adhesive bead, it ;~
lS possible, if the process is~properly conducted, to heat the adhes:ive to the activation temperature in times of less than 30 seconds without the disturbing manifestation of the problems j;;
mentioned above in connection with the other heating methods. ;~
In the range of electromagnetic energy from 1 to 1000 kHz, magnetic induction is the pr~eferred heating source. I`his source `;
of energy is already used in the automobile industry for direct . i,, . ~ .,. ::
heatlng of two-shelI steel componeDts such as doors or engine hoods, for gluing reinforcing parts to the outer shellsO To be ; 16 ~ ~ 2~791~

sure in such cases the adhesive itself is heated only indirectly by thermal conduction through the steel parts. If the adhesive itself is warmed, then magnetizable and/or electrically conduct-ing fillers must be contained in it which emit or release their heat to the matrix. A good description of the mechanism of heating and the fillers suitable for this application is to be ~found in A. Goldman, Modern Ferrite Technology, Van Nostrand Reinholdj New York (1990j.
Preferred fillers are magnetizable iron oxides such as -, -,., ~
ferrites, magnetites, gamma iron oxides which are available on the market ln very fine grain sizes.~ Even at relative weight portions of less than 15 wt. ~ these permit heating up to 150C
in less than 30 s. However, it is also possible in principle to use electrically conduct~ivè fillers such as iron powders or steel ~flbers.
When heated ln the high frequency (HF~ or in the radio frequency~(RF) field in the range from 1 to 300 MHz one is limited to the internationally established~frequencles for industrial~applications (see Table 2). ~ Besides thi~s, as opposed to;magnetlc induction, a special screening~of the radiation zone against the environment may be necessary.

'rable ! Industri~ally useful frequencies in the RF a~d MW range (statu~ February 1993).
~ RF (radio frequencies) 13.56 MHz~0.05% 27.12 MHzo .6%
40.68 MHz~0.05%
MW (microwaves) 433 MHz 416 MHz 850 MHæ 915 MHz --2.4 to 2.5 GHæ ~ 5.725 to 5.875 GHz ~
24 to 24.250 GH2 61 to 61.5 GHz - -~122 to 123 GHæ 2~44 to 246 GHæ -; 17 21~79~3 -:
, ~,...
, , ~, ,, With this technique the dipoles of the adhesive molecules are excited directly to rotation, and through the corresponding dielectric losses, the matrix is heated up. The adhesive for this purpose is brought lnto the interior of the variable elec~
,., tromagnetic field which is built up between two electrodes --, adapted to the shape of the adhesive strip. With this method it ls also possible to heat the adhesive bead up ko 150C in less - -than 30 seconds.
, ~
Another variant of fast deep-acting energy introduction is microwave. The permisslble wavebands are listed in Table 2. The energy in this case is fed from a transmitter through a waveguide into a resonance-oscillation circuit mounted over the cross section of the adhesive strip. At this time the oscillation ", -~ - ~ ;., circuit must to tuned to the mass of the adhesive strip in such a way that standing waves are not formed in order to assure uniform ~ ' heating of the bead over the entire module surface. ,~
The microwave energy in the electromagnetic range from 0.3 ~ c~-to 5 GHz also acts directly on the macromolecules of the adhesive -by dipole excitation and dielectric losses. It is also possible ~ ;-to accelerate the warming through conductive fillers such as soot ; -~
or polar fillers. Thus with this technique a temperature of over 150C can also be reached in 30 seconds. This technique requires -~
- -:
a careful screer.ing of the workroom from the outside, because microwave radiation is dangerous for the human organism. In order better to control the heating in the microwave field it may be helpful to introduce the energy in a pulsating mode.

.:

21~7~1~

Other principles of this technique are found in: G. Nimitz, Microwaves, Wissenschaftsverlag, Zurich (1990).
Another suitable form of energy for rapid mass-active heating for activation of the hot melt adhesive is to hook up the ~-adhesive strip that has been made conductive to a DC or AC
~ ;
voltage source. With conductive fillers, it is known, the conductivity of organic materials can be increased by several -,. ~
~owers of 10. ~For this purpose frequently conductive fillers ., -. :
such~as soot, graphite, metal flakes etc. are used. Especially suitable for the present invention are fibrous conductive fillers such as steeI fibers which can raise the conductivity by up to factor of lOS. In this way it becomes possible by mixing in ~ - .
fillers of this type in in the range 5 to 10 wt. ~, to produce ::
~products whlch, when the module~is connected to a grid voltage source, heat it up to 150C in less than in 30 seconds.
In order to achieve a uniform distribution of the heat in the case of electric, electromagnetic, or magnetic heating of the hot~melt adhesi~e bead it may be advisable if the coating normal-ly applied over the edge zone~directly on the glass which serves ~Eor~optlc~masking or for protectlon of the~adheslve bead, con-tains pigments which liberate heat under the influence of the above mentioned heating methods, e.g. metal oxides. Al~erna t1vely a primer which contains pigments such as soot may also be used. In order to concentrate the energy on the~adhesive bead ~and to minimize the heating of other elements that are ~located on the-glass module such as radio antennas or heating systems, it is - ": ~-:

~ desirable to focus the electromagnetic or magnetic field of the 7 ~ 1 ~

adhesive bead. In addltion or alternatively conductive coverings can shield against undesired heating.
According to a preferred version the adhesive strip is not totally activated before installation but only along its contact `
surface with the glass, i.e. to a layer thickness that is less - -~
than the nominal or minimal thickness of the adhesive after .,: - , , joining. In this case the still unactivated part of the adhesiv~ ~
: ,- -~ -,, ,:~
which in contact with the joint partner is activated after joining. This can be done by heating the above mentioned inac- --tive part o~ the adhesive strip by direct exposure to heat, e.g.
hot air, above the activation temperature. However, this method ~;
is less well suited if the joining partner is strongly heat conducting and has a high mass. In this case it may be difficult i , ~,... .....
to activate the interface with the joint partner and to achieve a permanent adhesive bond with it.
A preferred method is to heat the ~oint partner at its ;~- ;
contact point with the adhesive in such a way that the adhesive is heated and activated by heat conduction from the joint part~
,: , -, :. .
ner. If the joint partner displays generally or over the region .-:," ~
of its joint zone a heat capacity sufficient to warm the remain~
ing still inactive adhesive mass above the activatlon temperature ;~ ;`
it is possible to heat the joint partner before joining to a temperature sufficiently above the activation temperature. In this case, however, one must make certain to remain sufficiently below the decomposition temperature of the adhesive.
If the joint partner consists of a ferromagn~tic metal, inductive heatlng via a magnetic induction field in the range 'i'~': ~-, ~

2~ 91~

f rom 1 to 1000 kHz it is recommended as an extremely fast heating method. This method is especially well suited for the installa-tion of components, especially of permanently glazed window panes, in vehicle bodies. In this case the flange is heated just before assembly or immediately after assembly of the window through the glass with an induction loop running parallel to the flange. During the inductive heating the supply of energy is regulated by a closed regulating circuit in such a way that the ~ ;
temperature remains sufficiently below the decomposition point of ~he adhesive or of the enamel. ~;~
Metallic joint partners, however, can also be heated by ;~
electrical resistance heating, radiation heat or heat conduction. -Nonmetallic joint partners, e~g. plastics, can be heated ~ -well by infrared radiation, hot air or heat conduction. In this case, however, it is also possible by applying a high frequency ~,, .
~ield to heat the adhesive and if necessary the joint partner ~ ~-directly over the region of the entire adhesive ~oint. Alterna-tively one can also work with a high frequency magnetic field, in ~whlch case the adhesive must contain electrically conducting or ;~
, . ~.
magnetizable fillers.
As mentioned above, the process accordlng to the invention; ;
is espècially advanta~geous for use in vehlcle assembly, since it permits the production of transportable and ready-to-glue compo~
nents under optimal production conditions which require only heat ;~
activation in order to make rapid assembly and practically immediately loadable gluing possible.

.'~

' '~- ` 21~ 191~ , j ,.. .
~ / ~

In Table 3 possible and especially preferred process vari- :
ants made possible by the present inven~ion are compared. - :
., ,", ,, Table 4 shows by the example of direct glazing o~ an auto ' --with glass modules according to the invention two versions with typical cycle times. -' -' :,: ,.,,' ,,,', '',""'', .,: .: :-.'~'' :.',." ,, ':",;', -. ~ :, : ,:
'-~'. '-- ~,.' ~ ,:,:- - , .''',~;.,'' ~'~',';.'"

~,'~, ..'',', :"

.,::
, -,, . :~
:..,: : -.

' ~' '~:; ' ' ':
,, .
, . . ..
., , : 22 ~; -,:~, : -21~ 7 ~13 Tabl~ 3. Proce~ variants for the modular compone~t .
Module/joint Activation 1 Activation 2 on Melting on the Residual l par~ner during produc- the assembly assembly line activation ¦
tion of compo- line before nent installation l . . - -1 Glass/steel Heating of con- None Heating before After instal- ¦
tact area with installation, lation by heat-support, e.g. e.g. with hot ing of flange, _ with IR/laser air e.g. induction 2. Glass/steel None Heating the en- With activation Not necessary l tire bead, e.g. I
with inductlon (poss. combined with IR heating I -_ _of contact area) _ 3. Glass/steel Heating of None Plastically After insta-contact area deformable at llation by l with support as room temperature heating the ¦ -in 1. flange, e.g. by l induction -. . _ . _ .- .
. GLass/SMC* No~e Heating of By heat con- I~mediately I
contact area duction from before in- I ~ -with support contact area duction by e.g. with during acti- heating the IR/laser vation joint partner i ' ~ _ _ . .
5. SMC*/steel Heating of None By hot air After insta-¦ contact area llation by l with support, h~ating the I ~ -e.g. by IR I jolnt partner, ¦
e.g. by 1 ~ resistance heating _ . . ' ~I '-Glass/steel None Heating of ay heat conduc- After install-contact area tion from con- ation by heat-with support, tact area during ing the flange e.g. by IRIlaser activation by induction through gla~ I -w ~, . . - 1 ~7.~ Noryl**/ None None Plastically After joining l ~
~ioryl** deformable at by applying HF I ; ~;
room temperature field over both I ~-~
joint partner~ ¦
_ . : ~ ::~ : :::.. :
'8' Glassjsteel! None ~ ~ i None Plastically iAfter install- ¦ i :
deformable at ation by heat-room temperature ing the adhe- l sive with IR/ l ~I d ~ ~ ~ ~ laser through I ,-~
; ~ ' glass * SMC = S~ eet molding co lpoùnd ( not in~ ~ _ __ _ _ . . - - .
*Noryl GTX by General Electric ( a thermoplastic) : - - - ~ ." .

: ~ ~ .. :.: ;.: i 23 ~ ~

,f ~ , i 2 ~ ~ 7 ~

Table 4. I'ypical cycle time~ of the proce~ according to the iQvention with a glai~ module and arl adhesive bead ~olid at room t~mperature.
.- ,, "; , ~__ , ___ . , ' ' ,'~
I. II . .
With cured con- Without pre- ~ .
. tact area with activation . glass up to 2 (second~) i mm thick ..
: _ ( seconds ) ,, i - Positioning of glaqs module along conveyer belt 2 2 triggered by removal of previous module . ... _.... .
A. Prescribed operations ~advance timeq) _ - Transfer of giass module from conveyer belt to 7 . activation station by a manipulator triggered by the contact of the body in the previous installation , station (with a variable ti.me delay) , . , ::
- 310cking the activation station, heating and 25 ..
: ac~ivation along the glass surface, unlocking : :
, triggered by positioning of the module in the i -.;
activation station . ~
, - -l Total travel time VB. main operation (within the 32 ! assembly cycle) I ~ ",, .- ,,, B. Main cycle times (rohot couPled) _ ............. ___ ;~ -i - Measuring of flange position by robot triggered by 10 0 ~ :
introduction and lock ng of body .:
- Grasping of module, transfer ` 5 5 . ; .
-:Position determination of flange upon approach 0 4 _ - Position of the module on flanae frame 3 3 ~ :.
. , _ , _ . ~ ,: , - Pressing module into opening and simultaneous. 27 17 i : :
;~ illductive heatinq of flange __ _ ;~
;Robot to rest posi ion 3 3 .. _ ..
Total main cyclei time 48 32 ~` . .... -. _ _ _ ,~
; , , '-" ,'j'::

:: ,~ :: .

.:

:
.

:
24 : ~

` ` ' , ' ,,':
E~mple 1 400 g of a polyether diol with a mean molecular weight of 2000 g/mole are brought to react with 250 g of 4,4'-diphenyl-` ~methane diisocyanate and 0.4 g of diazobicyclooctane as a cata-lyst with one another at 70C for 2 hours in a 2 liter glass reactor with a nitrogen connection. Then 100 g of a crystalline softener, 33 g of a conventional softener and 600 g o~ a poly- -ether triol with a~mean molecular weight of 300 g/mole are added. ;
~; The reactlon mlxture is stirred then for another 30~minutes at ;-60C. Then the isocyanate-terminated prepolymer is degassed, ~-mixed with nitrogen and stored in a closed container.
E2~ample ~ 2 300~grams of a polypropylene oxide~diol~and 350 g of a ;`~j`
polytetrahydrofuran diol~ln each case with a mean molecular ~ ;
we1yht of 2000 g/mole were caused to react with 480 g of 4,4'~
dïphenylmethane~dilsocyanate and 0.02 g of dibutylt1n dilaurate -; ;(DBTL) as a catalyst at 70C for 2 h in a 2 1iter reactor with a :~
nltrogen~connection.~Then 290 g of a commercial softener and 50 `~ ~g~o~a~polyether~triol~;with~a mean molecular~weight of 1000 ` ~`
g/mole were~`added~. The reaction mlxture~was then stirred for ,~
another 45 minutes at the same temperature. Then the isocyanate-~terminated~prepolymer was degassed,`mixed with nitrogen and ;i stored in~a~oloaed conbainer.
13xampls ~3 ;400~grams~of a po1yether~diol with;a mean molecular weight of 20~00 g/mole~were~caused to react with 230 g of 4,4'-diphenyl-methane dlisocyanate and 0.03 g of dibutyltin dilaurate (DBTL) as ~ 7 ~

a catalyst at 70C for 2 h in a 2 liter reactor with a nitrogen connection. Then 290 g of a commercial softener and 380 g of a polyether triol with a mean molecular weight of 3000 g/mole were added. The reaction mixture was then stirred for another 30 minutes at the same temperature. Then 50 g of an isocyanate --terminated polyester prepolymer was added to the reaction mixture in a separate step and mixed at 60C. Finally the prepolymer was degassed, mixed with nitrogen and stored in a closed container.
B~ample 4 ;-235 wt. parts of a polypropylene oxide diol (OCZ 57) and 30 wt. parts of a polyester diol (OHZ 32) were reacted with one another at 70C for 2 hours in a 2 liter reactor with a nitrogen , connection with 0.02 g of diazabicyclooctane as the catalyst. ~ ~
~ , ~
Then 382 wt. parts of a propylene oxide triol (OHZ 36) and 226 ... . .
wt. parts of a commercial softener were added. The reaction mixture was then stirred for another 30 minutes at the same temperature. Then the isocyanate terminated prepolymer was degassed, mixed with nitrogen and stored in a closed container.
Example 5 2000.0 g of isocyanate prepolymer of example 1 were warmed while stirring in a stream of nitrogen to 70-80C. Then in nitrogen countercurreht, 8Z.1 g of the blocking agent p-hydroxy~
benzoate was added to the prepolymer. Then the re~ction mixture was heated for 5 hours at this temperature until the NCO absorp~
tion band in the infrared spectrum (2250 cm 1) had totally vanished. After the cooling of the mixture to room temperature the product was stored in a closed container. ;~
" ~

;, ~, ~; 2~7~ s~
, , `
E~ample 6 ~,, ~ .
2000.0 g of the isocyanate prepolymer of example l were ;, ,~
warmed while stirring in a stream of nitrogen to 70C in a 2 ',, ,,', liter glass reactor. Then 46.2 g of the blocking agent methyl- ', ethyl ketoxime were added. The reaction mixture was held at this '~ "
.~ ~,, . .. :
temperature for 0.5 h while stirred. The subsequent IR spectro- ,- ~"
scopic analysis showed the total disappearance of the IR absorp- ','"~
tion band. After the mixture was cooled to room temperature the ',','',' , ~ ,, product was stored in a closed container. ,, -',, E~ample 7 '~
2000.0 g of the isocyanate prepolymer of~example l was '~; ',~' warmed to 70C~while stirr~d in a stream of nitrogen in a 2 liter glass reactor. This was followed by the addition of 70.3 g of ',,;' , ;the blockinq agent epsilon-caprolactam. Then the reaction was ' ,~' heated~at~8~0C until the total disappearance of the NC0 absorp-tion band~;in the IR spectrum for 3 hours. After cooIing to roo~ ", '-temperature the blooked prepolymer was storad in a closed con- ''~
,tainer.
Esample~8 3~00,;~g of p-hydroxybenzoate-blocked prepolymer from example 5 ;' was heated to 50C in a l liter reactor. After ~s hour degassing '`~,'~'''`
of the' prepolymer 0.2~lwt. % o~ the~deblocking oatalyst'dibuty1tin di~laurate (DBTLI was~added and the evacuation con~lnued for 15 m'nutes.~Then the product was f1lled into cartridges~for stor~

~ . .
:~` 21 1791~

E~ample 9 300 g of methyl ethyl ketoxime-blocked prepolymer from èxample 6 were heated to 40C in a 1 liter reactor. After ~ hour degassing of the prepolymer, 0.2 wt. % of the catalyst blocked with formic acid was added and evacuation continued for 15 minutes, Then the product was filled into cartridges for stor~
age.
Exa~ple 10 -:, . . .
300 g of the p-hydroxybenzoate-blocked prepolymer of example - ;
5 were heated to 50OC in a 1 liter reactor. After ~ hour of degassing of the prepolymer 1 g of trimethylol propane and 0.2 : ".
wt. % of the deblocking catalyst dibutyltin dilaurate (DBTL) were added and evacuation continued for 15 minutes. Then the product .. ~ .:
~was filled into cartridges for storage.
E~ample 11 300 g of the p-hydroxybenzoate-blocked prepolymer of example :, were heated to 50C in 1 llter reactor. .~fter ~ hour degas~ing of the prepolymer, 3 g of diethyltoluene d~ethylamine ~DEDTA) -~
were added and evacuation continued 15 minutes. Then t~e product was~ filled into cartridges for storage, ;~
E~ample 12 300 g of thélp_h~ydroxybenzoate-blockèd prepolymer of eXample .
; 5 were heated to 50C in a 1 liter reactor. After ~ hour degas~

~sing of the prepolymer, 3.5 g of dicyanodlamide were added and ~ evacuation continued for 15 minutes. Then the product was filled ; ~nto cartridges for storage.
-::

:
:~

~` 2117~13 ~

Exa~ple 13 .. ..
300 g of the p-hydroxybenzoate~blocked prepolymer of example 5 were heated to 50C in a 1 liter reactor. After ~ hour degas~
. .
sing of the prepolymer, 5 g of the phthalic acid anhydride/ ;~
.. ", ,.
triethylene diamine adduct were added and evacuation continued :, -.: , - -, ., for 15 minutes. Then the product was filled into cartridges f9r storage.
, ........
ample 1~ ~ -300 g of the p-hydroxybenzoate-blocked prepolymer of example . .,,, ", were heated to 50C in a 1 liter reactor. After ~ hour degas- -sing of the prepolymer, 7.7 g of 4,4'~methylene dianiline/NaCl -complex were added and evacuation continued;for 15 minutes. Then ~-the product was filled into cartridges for storage.
Examplè 15 300 of g of epsilon caprolactam-blocked prepolymer from example 7;~were heated to 50C in a 1 liter reaGtor. After ~ hour degassing of~the prepolymer 7 g of 4,4'-diaminodicyclohexyl-methane~wé~re added and;evacuation continued for 15 minutes. Then ;the~product was filled into cartridges for storage.
Exampl~e 16 ~` 300 g of the methylethyl ketoxim-blocked prepolymer of example 6 were heated to 50C in a l llter reactor. After ~2 hour~
degassing of the prepolymer, ~.5 g of the methyl ethyl ketimine~

blocked 4,4'-diamlnodicyclohexylmethane were added and evacuation ~ continue~ for 15 minutes. Then the product was filled into - ~`
`~ cartrldges for storage.

~ 29;

r,~?, ~

Example 17 The adhesive of example 10 was applied from a cartridge preheated to 60C in the form of an adhesive bead to a glass coated with primer. Then the bead was allowed to cool to room temperature. At this time it became solid and nontacky.
Example 18 -The bead of adhesive of example 10 applied to glass was ~stored at room temperature and normal air humidity for 1 month.
During the storage no significant change in the consistency of the adhesive bead occurred.
E~ample 19 20 wt. parts of a polypropylene oxide diol (OHZ 57) and 1.2 equivalent percent of the stabilizer ethylene diamine were mixed in a 1 liter reactor at room temperature. Then lQ.5 wt. parts of ;~
TDIH were disper~ed in and the entire mixture stirred for 1 hour.
After addition of 0.~ wt. parts of DETDA and 40.6 wt. parts of jeffamine T5000 the mixture wàs degassed for 30 minutes. The 12 t;. parts of soot, 16 wt. parts of kaolin as a filler and 0.06 ~-wt. parts of DBTL as a catalyst were added and the degassing ~-contlnued for~30 minutes. Finally the product was filled into -~
cartridge~ for storage.
Ex~mple 20 5 wt. parts of a polyester polyol (OHZ 32~ together with 40 wt. parts of a branched polyureth~ne polyether polyol (OHZ 30) were melted at 60C ln a l liter reactor. After cooling to room --temperature, 1 equivalent percent of jeffamine D400 was added and then 11 wt. parts of TDIH dispersed in. After stirring for 1 -. :
.

:

2 ~ ~ 7 ~
-, ', ,~.',, -", hour 19.3 wt. parts of jeffamine D2000, 0.5 wt. parts of DETDA
and 0.05 wt. parts of DBTL as a catalyst were added and degassing continued for 30 minutes. Then 5 wt. parts of soot, 6 wt. parts of carbosil T5 720 and 14 wt. parts of kaolin as fillers were introduced. The mixture was degassed for 30 minutes and filled -; ~-into cartridges for storage. -~
Preparation of the pol~urethane polYol -~
67 wt. parts of 4,4'-MDI, 250 wt. parts of a polypropylene `
oxide diol ~OHZ 57), 24 wt. parts of a polypropylene oxide triol -(OHZ 36), 433 wt. parts of trimethylol propane and 225 wt. parts of a commercially softener were weiqhed into a 2 liter reactor with a nitrogen fitting and heated to 70C. After addition of , 0.01 wt. ~ of tin octoate as a catalyst, the reaction mixture~was , stirred ~or 2 hours and filled for storage.
Examplo 21 22 wt. parts of a polypropylene oxlde triol (OHZ 36) with 4.3 equivalent percent or diethylene triamine were stirred at '`~
room temperature in a 1 liter reactor. Then 25 wt. parts of the `
pulverized IPDI trimer Tl890 were dispersed in for 1 hour. This was followed by the addition of 18 wt. parts of jeffamine T5000 ~ ;~
and 4 wt. parts of DETDA. After stirring for another 30 minutes l0 wt. ! pàrts of sdot'and 15 wt. parts of calcium carbonate were added as fillers and 0.05 wt. parts of DBTL as a catalyst. The ~ -~mixture was degassed for 30 minutes and filled into cartridges for storage.

,.: ",. ~, . ,, - -- . ;.
31 `~-~1~7~1i E~a~ple 22 12.5 wt. parts of 4,4'-MDI, 22 wt. parts of polypropylene oxide diol (OHZ 57) and 43 wt. parts of a polypropylene oxide triol (OHZ 36) and 0.01 wt. parts of DBTL in 22.5 wt. parts of softener were reacted at 60C for 2 hours in a 2 liter reactor with a nitrogen fitting. This was followed hy the addition of 0.05 wt. % of benzoquinone as a stabilizer. Then within 30 minutes 4 wt. parts of 2-hydroxyethylacrylate were added in drops. The reaction mixture was then stirred for another 15 ~ninutes and degassed for 15 minutes. since no NCO bands could be detected in IR spestrum any longer the product was filled into a container for storage.
E~ample 23 ; 12 wt. parts of 4~4'-MDI, 21 wt. parts of a polypropylene oxide diol ~OHZ 57), 38 wt. parts of a polypropylene oxide triol (OHZ 36) and 0.01 grams of~DBTL as catalyst were reacted for 2 -~-hours at 60C in 22.5 wt. parts of softener ln a 2 liter reactor. ; ~
~ , , hen 5 wt. parts of an isocyanate-terminated polyester-prepolymer ; ~were melted into the reaction mixture. This was followed by the ;;~ -~
addition of 0.05 wt. parts of benzoquinone and 4.5 wt. parts of 2-hydroxyethylacrylate. The reaction mixture was stirred for 1 I ' hour andidégassed~for i5 minutes. Then 5~wt. parts of '500t, 6 wt. parts of HDK and 22 parts of talcum were mixed with the ~ -~
~ ~ , prepolymer, then it was degassed for 1 hour and filled into cartridges for storage.
,:

32 ~

~: .
.

2~7~

E~ample 24 (Warmi~g in the conve~tion oven) ~
The adhesive bead applied to the glass and stored at room ~-temperature was heated for lO minutes in a convection oven preheated to 150C. After this time the temperature in the --adhesive bead was 140C. After this the adhesive bead was -~
allowed to cool again. After 6 hours the adheslve had cross~
linked. ~-E~ample 25 (Ohmic heating) ~.~
-. . , , ~, 350 g of the blocked prepolymer of example 10 were mixed in a laboratory planetary mixer with lO0 g of soot and 50 g of steel fibers (BEKI S~IELDS GR 9~/C 03/5) in a vacuum for 1 hour at 50C~ The product was filled into aluminum cartridges. From -~
this product a triangular bead 12 cm long was applied to a glass ~-plate. At both ends an electrode l cm deep was pressed into the ~`
triangular bead. The two electrodes were connected to a DC or AC
voltage source (0 to 250 V, 5 A). For 30 seconds an AC or DC - -~
voltage of 50 V was applied. After the current was switched off the temperature in the adhesive bead was measured with a thermal ~ -sensor (135C after 30 seconds at 50 V). - ~
E~am~le 26 (Miarowave heating) - ; `
325 g of the blocked prepolymer of example lO were mixed ;' ; -with 25 g of soot 'and 150 g of fillers for l hour at 500C in a ~ `~
vacuum in a laboratory planetary mixer. The product was filled `~
into an aluminum cartridge. A 13 cm long triangular bead was applied from this product to a glass plate. The adhesive bead was irradiated in a microwave oven ~or 40 sec. at lO00 W power .,~ ,.. :--.
with microwaves. The bead temperature was measured with a fiber ~ 21 ~7~1~

optic temperature measuring device and recorded with a flat bed recorder. After this microwave treatment 130C was measured in the adhesive bead.
Exa~ple 27 (High frequency heati~g/t~nsile te~t~
325 g of the blocked prepolymer of example 10 were mixed -~
with 25 g of soot and 15~ g of fillers for 1 hour at 50C in a vacuum in a laboratory planetary mixer. The product was filled , -into an aluminum cartridge. The adhesive was applied to a glass substrate ~25 x 100 x 4 mm). The sample was treated in an HF
system (27 MHz) for 30 sec. with a power of 100 W/g of adhesive.
The temperature in the adhesive was measured with a fiber optic temperature measuring device~and recorded with a flat bed record- ~
er. After 30 seconds the temperature of 140C was measured in --the adhesive. -~
~Example 28 (Indu¢tion heatinq and te~sile~test) - ;
323 g of the blocked prepolymer of example 10 were mixed with 25 g of filler and 150 g of ferrite powder (Yerritkerne 27, ground) in a vacuum for ~1 hour at 50C in a laboratory planetary mixer. The product was filled into an aluminum car~
trldge. With this product a 5 cm long triangular bead was ~ ~ -;,: :
applied to a glass pla~e. The glass plate with the triangular ~ ~ `
bead was placed in thè center of an induction coil of 60 mm' ' diameter which was connected to an induction generator of 3 kW
power. The frequency of~ this device was ca. 200 kHz. The power `~
of the installation was controlled by a microprocessor. The ~
temperature curve was measured with a thermocouple and recorded ~ ;
with a flat bed recorder. -: ~: : :.
:: : : :
~ ; 34 ~ :-`~` 2~7~

After 18 seconds of inductive heating 150C was measured.
This temperature was maintained for another 30 seconds. 10 seconds after completion of the heating the adhesive-glass module was joined by means of a perforated diaphram (hole size 50 x 20 mm) and a suitable apparatus to an enameled peel-off body (steel, 40 x 10 x 56 mm) in such a way that a glass-metal adhesion of 40 x 10 x 4 mm was formed. The material which bulged out was removed with 2 mm wide bent spatula.
Then the sample was exposed from the glass side by means of an induction coil to a magnetic induction field for 10 seconds.

,, :
After the current source was switched off the adhesive had hardened. After conditioning for 24 hours at 23C and 50%
- . .. ::
relative humidity it was pulled on a tensile testing machine at a tension of 10 N and a speed of 400 mm/min. until it broke. A ,~' , maximal force of 4.5 MPa was measured and a cohesive fracture was . ~ . . -observed inside the bead of adhesive. `-Example 29 ;
:. . .
A triangular bead of the product of example 19 was applied to a glass plate. The glass plate with the triangular bead was ", ;
irradiated with a short wava infrared source from below. After '~ -~ . :: ...: .
20 seconds, a temperature of 100C was measured at the base of ~
, the adhesive bead.; Aftar this time the base of the adhesive bead ,-had hardaned to a depth of ca. 1.5 mm while the upper part of the -adhesive bead was soft and uncrosslinked. Approximately 10 ` -~
: .
seconds after the infrared heating source was turned off the adhesive was joined to a piece of steel overlapping in such a way that a tensile-shearing test piece with an overlap width of 10 mm -~ -' '-'~ '~, ' :, ~, ,.

:

:
and a layer thickness of 3 mm was created. The material which bulged out was removed with a 2 mm wide bent spatula. Then the sample was exposed for 7 seconds from the glass side to a magnet-ic induction field produced by an induction coil. After the -current source was switched off the entire adhesive had hardened.
After storage for 24 hours at 23C and 50% relative humidity the determination of the tensile shearing strength yielded a value of - -3.5 MPa with a cohesive fracture inside the adhesive bead. -~
Example 30 : ~:
, . : .
. ..
A triangular bead of the product of example 23 was applied to a glass plate. The glass plate with the triangular bead was irradiated with a short wave infrared source from below. After ~ ;
30 seconds a temperature of 130C was measured at the base of adhesive bead. After this time the adhesive bead had hardened at .
the base to the depth of about 1 mm, while the upper part of the adhesive bead was soft and uncrosslinked. Approximately 10 ;~ seconds after the infrared heating source was switched off the ~; adhesive was joined to a steel substrate in such a way that a tensile-shearing test piece with an overlap width of 10 mm and a ; layer thickness of 3 mm was created. The material bulging out ~;
was removed with a 2 mm wide bent spatula. Then the sample was ` ~ exposed from the gilass side to a magnetic induction field gener- ~;
ated by an induction coil for 7 seconds. After the current ~-source was switched off the adhesive had hardened.
xample 31 (Referenc~s ~xample~ -The test ~rom Pxample 29 was repeated but without irradia~
tion with the infrared source. After heating for lS seconds by : ' '.:, :

Claims (54)

Claims

1. Storable modular component that is prepared for assembly by gluing to another component without using an assembly glue characterized by the fact that a profiled strip of adhesive of a latently reactive adhesive is placed along its edge which consi-sts predominantly of - one or more polyurethanes with blocked isocyanate groups, or - one or more polyurethane preproducts consisting of polyols and/or polyamines and encapsuled polyisocyanates, or - one or more polyurethanes with radically polymerizable groups, in which he reaction is initiated at an activation temperature of 70 to 180°C and which simultaneously remains tacky and non-flowing but plastically deformable for a time sufficient for assembly.

2. Storable glass module as in claim 1 for direct glazing of vehicles which is prepared for gluing into a frame or flange without using an assembly glue and which displays along its edge a profiled strip of adhesive lying directly on the glass pane or on a separate intermediate support characterized by the fact that the adhesive strip consists of a material which is nontacky and is latently reactive and consists of one or more polyurethanes or polyurethane preproducts according to claim 1, of which at least one is constructed from a crystallizing polyol.

3. Modular component as in claims 1 or 2 characterized by the fact that the adhesive is already cured along its contact surface with the modular component.

4. Modular component as in one of claims 1 through 3 character-ized by the fact that maximally 20 wt. % of the polyols serving to construct the polyurethanes are polyester polyols.

5. Modular component as in one of claims 1 through 4 character-ized by the fact that the adhesive is solid at room temperature and has a softening point of 25 to 80°C, preferably 35 to 60°C
and that a maximum of 20 wt. %, preferably 5 to 15 wt. %, of the polyols serving to construct the polyurethanes are polyester polyols, while the remainder are polyether polyols.

6. Modular component as in one of claims 1 through 3 character-ized by the fact that the adhesive is a hot melt adhesive with a softening point above 80°C.

7. Modular component as in one of claims 1 through 6 character-ized by the fact that the difference between the softening point and the activation temperature is at least 20°C, preferably at least 30°C.

8. Modular component as in one of claims 1 through 7 character-ized by the fact that it is capable of being stored under ambient conditions below 30°C for at least 14 days, preferably for at least 2 months.

9. Modular component as in one of claims 1 through 3 character-ized by the fact that the adhesive contains at least one crystal-lizing component based on polytetrahydrofuran polyol, polycar-bonate polyol or polyester amide polyol.

10. Modular component as in one of claims 1 through 9 character-ized by the fact that the adhesive consists predominantly of polyurethanes with blocked isocyanate groups.

11. Modular component as in claim 10 characterized by the fact that the isocyanate groups are blocked by phenol, ketoxime or epsilon-caprolactam compounds.

12. Modular component as in claim 11 characterized by the fact that the adhesive additionally contains low molecular H-active polyfunctional compounds or latent amine hardener.

13. Modular component as in claim 11 characterized by the fact that the adhesive additionally contains organometal compounds or tertiary amines as catalysts.

14. Modular component as in one of claims 1 through 9 character-ized by the fact that the adhesive consists predominantly of one or more polyurethanes with possibly substituted acrylate or methacrylate end groups and contains the additives necessary for initiation and control of the radical polymerization.

15. Modular component as in one of claims 1 through 9 character-ized by the fact that the adhesive consists predominantly of polyurethane preproducts whose isocyanates are low molecular solid compounds which are protected by a shell of urea.

16. Modular component as in claim 15 characterized by the fact that the polyurethane preproducts consist of polyurethane pre-polymers with hydroxy or aromatic amine end groups, aromatic amines and encapsuled solid polyisocyanates.

17. Modular component as in claim 15 characterized by the fact that polyurethane preproducts consist of macromolecular polyols, aromatic polyamines and encapsuled polyisocyanates.

18. Modular component as in one of claims 1 through 17 charac-terized by the fact that the modular component is capable of being activated on the assembly line within 2 minutes, preferably within 1 minute, especially within 30 seconds.

19. Modular component as in one of claims 1 through 18 charac-terized by the fact that the adhesive contains softeners, thixo-tropic agents and/or fillers.

20. Modular component as in one of claims 1 through 19 charac-terized by the fact that the adhesive contains magnetizable and/or electrically conducting fillers.

21. Modular component as in claim 20 characterized by the fact that the adhesive contains 2 to 20 wt. %, preferably 5 to 15 wt.%
gamma iron oxide.

22. Glass module as in claims 2 through 20 characterized by the fact that at least one black essentially light impermeable coating is arranged between the glass and the adhesive bead.

23. Glass module as in claim 22 characterized by the fact that the black coating contains pigments or other fillers which liberate heat in an electrical, electromagnetic or magnetic field.

24. Use of a glass module as in one of claims 2 through 23 for direct glazing of vehicles, especially automobiles.

25. Process for gluing a modular component to another component without using an assembly glue characterized by the fact that one applies - along the edge of the modular component a profiled string of adhesive of a latent reactive adhesive which include predomi-nantly:
- one or more polyurethanes with blocked isocyanate groups, or - one or more polyurethane preproducts consisting of polyols and/or polyamines, and of encapsuled polyisocyanates, or - one or more polyurethanes with radically polymerizable groups, in the soft state;

- an adhesive strip, if necessary after heating to its activation temperature of 70 to 180°C, along its contact surface with the modular component in order to cause it to react, is allowed to harden;
- the thus obtained storable modular component is transport-ed to an assembly line, if necessary after intermediate storage, - if necessary, the uncured part of the adhesive is brought to reaction at least along the contact surface with the modular component by rapid heating to an activation temperature of 70 to 180°C, and the non-pressure-deformable part of the adhesive is made plastically deformable but nonflowing over the entire cross section, - the modular component is brought together with the other components to be glued to it, pressed together up to a certain joint distance, if necessary the still unactivated part of the adhesive is brought rapidly to the activation temperature of 70 to 180°C to initiate the reaction, and the joint is held fixed until at least the adhesive has solidified and then allowed to finish reacting without further action, with the qualification that the difference between the applica-tion temperature and the activation temperature of the adhesive is at least 20°C.

26. Process as in claim 25 for direct glazing of vehicles, especially automobiles, characterized by the fact that - the profiled bead of the adhesive is applied along the edge of a glass pane, either directly on it or on a separate intermediate support, - the adhesive bead, if necessary after heating to its activation temperature of 70 to 180°C, is allowed to solidify along its contact surface with the modular component in order to bring it to reaction, - the storable glass module thus obtained, if necessary after intermediate storage, is transported to the vehicle assem-bly line, - if necessary the uncured part of the adhesive, at least the contact surface with the glass module, is brought to reaction by rapid heating to the activation temperature and the non-press-ure deformable part of the adhesive is made plastically deform-able but nonflowing over the entire cross section, - the glass module is inserted into the frame or flange of the vehicle and pressed in up to the preassigned joining dis-tance, the still unactivated part of the adhesive is heated to the activation temperature and the glass module is held firmly until the adhesive solidifies and then allowed to finish react-ing.

27. Process as in claims 25 or 26 characterized by the fact that the adhesive consists predominantly of one or more polyurethanes with blocked isocyanate groups.

28. Process as in claims 25 or 26 characterized by the fact that the adhesive consists predominantly of one or more polyurethanes with possibly substituted acrylate or methacrylate end groups and contains the additives necessary for initiation and control of the radical polymerization.

29. Process as in claims 25 or 26 characterized by the fact that the adhesive consists predominately of polyurethane preproducts whose isocyanates are low molecular solid compounds which are protected by a shell of urea.

30. Process as in claim 29 characterized by the fact that the polyurethane preproducts consist of polyurethane prepolymers with hydroxy or aromatic amine end groups, aromatic amines and encap-suled solid polyisocyanates.

31. Process as in claim 29 characterized by the fact that the polyurethane preproducts consist of macromolecular polyols, aromatic polyamines and encapsuled polyisocyanates.

32. Process as in one of claims 25 through 31 characterized by the fact that the softening point of the adhesive is 25 to 80°C, preferably 35 to 60°C.

33. Process as in one of claims 25 through 32 characterized by the fact that the activation temperature is 70 to 150°C, prefera-bly 80 to 120°C.

34. Process as in one of claims 25 to 33 characterized by the fact that at least one of the polyurethanes or polyurethane preproducts is constructed from crystallizing polyester polyol and in the adhesive displays a melting point of 35 to 60°C.

35. Process as in claim 34 characterized by the fact that maximally 20 wt. %, preferably 5 to 10 wt. %, of the polyols used to construct the polyurethane consists of polyester polyols f and the remainder of polyether polyols.

36. Process as in claim 34 characterized by the fact that the adhesive before application is heated to a temperature of 35 to 60°C and that the profiled adhesive bead is not deformed after it solidifies when handled.

37. Process as in claim 34 characterized by the fact that the adhesive is conveyed without a heated vat pump at room tempera-ture lying above 10°C and before discharge as a bead is warmed to a temperature of 35 to 60°C, preferably 40 to 50°C.

38. Process as in one of claims 25 through 37 characterized by the fact that the adhesive is applied through a nozzle.

39. Process as in one of claims 25 through 37 characterized by the fact that the adhesive is applied by doctor blade.

40. Process as in one of claims 25 through 39 characterized by the fact that the modular component is heated on the assembly line within 2 minutes, preferably within 1 minute, especially within 30 seconds.

41. Process as in claims 26 and 40 characterized by the fact that on the assembly line the adhesive is brought to reaction rapidly along the contact surface by infrared rays passing through the glass pane and is made plastically deformable over its entire cross section.

42. Process as in claim 40 characterized by the fact that the heating of the adhesive by microwave radiation takes place in an electromagnetically shielded room, where the microwaves are coupled in a resonance oscillation circuit mounted over the cross section of the adhesive bead that is automatically tuned to the mass of the adhesive.

43. Process as in claim 40 characterized by the fact that the adhesive contains ferromagnetic and/or electrically conducting fillers and that on the assembly line it is heated in the alter-nating magnetic field at 10 to 1000 kHz, preferably at 100 to 500 kHz.

44. Process as in claim 40 characterized by the fact that the adhesive on the assembly line is heated by a high frequency field formed between electrodes.

45. Process as in claim 40 characterized by the fact that the adhesive contains electrically conductive fillers and that it is heated on the assembly line by being wired as an ohmic resistance with direct or alternating currant.

46. Process as in claim 40 characterized by the fact that the modular component on the assembly line, following the rapid heating within a production cycle of 60 seconds, preferably 35 seconds, is joined [to the other] by a robot and held without further fixation.

47. Process as in one of claims 25 through 39 characterized by the fact that the adhesive which has possibly cured along the contact surface with the modular component, is installed without preheating and activation.

48. Process as in claim 46 or 47 characterized by the fact that the other component to be glued to the modular component consists of inductively heatable material, especially steel, and following the joining together along the adhesion zone is heated by magnet-ic induction so that the still unactivated part of the adhesive is heated to the activation temperature by heat conduction.

49. Process as in claims 46 or 47 characterized by the fact that following the joining the adhesive is heated along the adhesion zone through the support by means of infrared radiation to the activation temperature.

50. Process as in claims 26 and 48 characterized by the fact that after the glass module is applied to the vehicle frame or flange the sheet metal the adhesive is inductively heated from the application side along the vehicle frame or flange and thus the still unactivated part of the adhesive is caused to react by heat conduction.

51. Process as in claims 46 or 49 characterized by the fact that the other component to be joined to the modular component is preheated to a temperature above the activation temperature and that after they are joined together, through the heat flux from the other component the still unactivated part of the adhesive is brought to reaction.

52. Latently reactive or reactive polyurethane adhesive which includes predominantly - one or more polyurethanes with blocked or free isocyanate groups, or - one or more polyurethane preproducts consisting of polyols and/or polyamines and encapsuled polyisocyanates or - one or more polyurethanes with radically polymerizable groups, in which at least one of the polyols serving to construct the polyurethanes is a solid polyol which displays a melting point of 35 to 80°C in the adhesive.

53. Polyurethane adhesive as in claim 52 characterized by the;
fact that maximally 20 wt.%, preferably 5 to 15 wt. %, of the polyols serving to construct the polyurethanes are solid, prefer-ably crystallizing polyester polyols which in the adhesive display a melting point of 35 to 80°C, preferably 35 to 60°C, while the remainder are polyether polyols.

54. Polyurethane adhesive as in claim 52 characterized by the fact that the solid polyol, which is preferably a crystallizing polyol, is at least one of the group which consists of polytetra-hydrofuran polyols, polycarbonate polyols and polyesteramide polyols.