CA2111770C - Information recording and reproducing apparatus for recording and reproducing information by using a probe electrode - Google Patents
Information recording and reproducing apparatus for recording and reproducing information by using a probe electrodeInfo
- Publication number
- CA2111770C CA2111770C CA002111770A CA2111770A CA2111770C CA 2111770 C CA2111770 C CA 2111770C CA 002111770 A CA002111770 A CA 002111770A CA 2111770 A CA2111770 A CA 2111770A CA 2111770 C CA2111770 C CA 2111770C
- Authority
- CA
- Canada
- Prior art keywords
- probe
- recording medium
- plate
- recording
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/12—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
- G11B9/14—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
- G11B9/1409—Heads
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/12—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
- G11B9/14—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
- G11B9/1418—Disposition or mounting of heads or record carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q80/00—Applications, other than SPM, of scanning-probe techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/943—Information storage or retrieval using nanostructure
- Y10S977/947—Information storage or retrieval using nanostructure with scanning probe instrument
Abstract
An information recording and reproducing apparatus is provided with a probe electrode supported by a probe plate and arranged to face a recording medium supported by a recording medium plate, drive elements for relatively moving the recording medium and the probe electrode, voltage application circuit for applying a voltage between the recording medium and the probe electrode and an electric wire take-out portion for taking out an electric wire provided on at least one of a plane of the probe plate opposite to the probe electrode and a plane of the recording medium plate opposite to the recording medium.
Description
- 1 - 21~
Information Recording and Reproduclng Apparatus for Recording and Reproducing Information by Using a Probe Electrode BACKGROUND OF THE INVENTION
Field of the Invention The present invention relates to an information recording and reproducing apparatus for perfol ~ ng at least one of recording and reproducing of information, which uses a principle of a sc~nn~ ng tunneling microscope or a sC~nnl n~ interatomic force microscope.
Related ~ackaround Art Recently, a 9c~nn~ng t~lnnel ing microscope (herelnafter referred to as STM) capable of directly observing an electron structure of a surface atom of a con~l-ctor, and an interatomic force microscope which applles the technology of the STM have been developed and various applications thereof have been pLoposed.
Part~cul~rly, applications for a recording apparatus whlch writes information into a ,eco ding medium at a high resolution and a lep,od~c1 ng apparatus for re~ng the informatlon written in the recording medium at a high resolutlon have been developed. In an apparatus which applies the STM, it has been proposed to manufacture components thereof by a ~nown technology called micL. ah~n1C~ or micromach1n~ng (see, for example, K.E. Pe~e-~en, Proc. IEEE, 70, 420 (1982)).
' ~
,. : .. . .
,, "
~ - 2 - , 2~ 70 An example is described below.
As shown in Fig. 1, a probe board 114 for supporting a plurality of probe electrodes 113 and a lead wire board 119 are provided on a probe base board 115, and the probe electrodes 113 and the lead wire board 119 are electrically connected with respect to the respective probe electrodes 113 by co~necting wires 118 such as wire hond~ng. On the other hand, a recording medium 116 supported by a recording medium plate 117 is arranged to face the plane of the probe -plate 114 on which the probe electrodes are provided.
A pulsive voltage for writing a record bit on the L aao dlng medium 116 by a recording/reproducing voltage application circult (not shown) is applied between the leco~ding medium 116 and each of the probe electrodes 113, and a read voltage for reAd1ng the written information is applied to ~eco,d and ap-oduce the ~ ~-lnformation.
Ilc~_v~" in the aonven~lonal recordlng and ~ep,od~cing apparatus described above, the probe plate and the L eco,ding medium are in a very close position ln the recordlng and reproduc1ng modes. As a result, ess the electrlc lead wires from the probe plate are optimally ~esigned, the conneoting wires which are .~o~e~ing parts wlth the lead wire plate lnterfere wlth the ~eCG~ ding medium plate or the recordlng medium, 80 that there will arlse a problem that the " ' '' ~ ; ,' ~ "
. , ,, ~, . . ' .: ~ .~ .
connecting wire~ are shorted each other or the connecting wires are broken. This problem is serious particularly when the probe electrodes and the recording medium are relatively moved in a plane by a large distance.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide an information recording and reproducing apparatus which optimize the wiring of the lead wires from the probe plate ~o prevent the interference with the recording medium and the recordlng medium plate when the recording medium and the probe electrodes are relatively moved.
The above ob~ect i8 aohieved by an information recording and ,ep-od~cing apparatus, which is provided with probe electrodes supported by a probe plate and arranged to face a recording medium supported by a recolding medium plate, moving means for relatively moving the recording medium and the probe electrodes, voltage appllcation means for applying a voltage between the recording medium and the probe electrodes, and electric wire take-out portion for taking out electric wires provlded on at least one of a plane of the probe base plane oppostte to the probe ele~-odes and a plane of the recording medlum plate opposite to the recording medium.
'" ' :
-In the information recording and reproducing apparatus of the present invention, since the electric wire lead means for taking out the electric wires is provided on at least one of the plane of the probe plate opposite to the probe electrodes and the plane of the recording medium plate opposite to the recording medium, the electric wires are taken out of the plane opposite to the plane to which the probe electrodes and the recording medium face. As a result, there is no projecting member other than the probe electrodes between the probe plate and the recording medium, and even if the probe electrodes and the recording medium are relatively moved in the plane, the electric wires do not interfere with the recording medium or the probe electrodes.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 shows a sectional view of a neighborhood of a probe plate and a recording medium for illustrating a positional relationship between the probe plate and the recording medium in a conventional information recording and reproducing apparatus, Fig. 2 shows a block diagram of one embodiment of the information recording and reproducing apparatus of the present invention, Fig. 3 shows a sectional view of a neighborhood of a cantilever of the probe plate shown in Fig. 2 Fig. 4 shows a sectional view of a neighborhood of the probe plate and the recording medium for illustrating a positional relation between the probe plate and the recording medium shown in Fig. 2 Fig. 5 shows a perspective view of a probe plate and an electric circuit board shown in Fig. 4, Fig. 6 shows a sectional view of a neighborhood of a cantilever of a probe plate in other embodiment of the information recording and reproducing apparatus of the present invention, and Fig. 7 shows a sectional view of the recording medium shown in Fig. 4.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
An embodiment of the present invention is now explained with reference to the drawings.
Fig. 2 shows a block diagram of one embodiment of the information recording and reproducing apparatus of the present invention. As shown in Fig. 2, conductive probe electrodes 1 are fixed to free ends of cantilevers 2 made of elastic material. The fixed ends of the cantilevers 2 are fixed to a probe plate 3 made of a silicon single crystal substrate. An xy drive element 6 including a piezo-electric element has one end thereof fixed to the probe plate 3 and the other end thereof fixed to an inslde of a main body 7, so that the probe electrodes 1 can be driven in xy 2~11770 directions by the xy drive element 6. Accordingly, the probe electrodes 1 can be moved to any position in the xy direction.
On the other hand, a recording medium 8 includ~s a record layer having a Squarilium-Bis-6-n-Oatylazulene (SOAZ~ dye organic thin film deposited on a gold electrode, and the gold electrode of the recording medium 8 is formed on a medium plate 80. A z drive element 9 including a piezo-electric element has one end thereof fixed to the medium substrate 80 and the other end fixed to the inside of the main body 7, so that the medium plate 80 is driven in the z direction by the z drlve element 9 and the recording medlum 8 is moved ln the z direction. As seen from the above descrlption, the drive means for relatively moving the probe electrodes 1 and the recording medium 8 ls constituted by the xy drive element 6 and the z drive ~1 e, 1, 9.
A probe position controller 10 controls the z posltion of the probe electrodes 1 (a SpAC~ ng be~leon the probe electrode 1 and the ,eoo~ding medium 8) and the xy posltion of the probe electrodes 1 by lnstructlon of ~tgnal proo~s~ ng, or slgnal from tlming con~,oller 13 or switching circuit 11, and it is co~ns~ed to the xy drlve 9~ e ? ~ 6 and the z drive ql f sr~ 9. The switching circuit ll swltches ~ Al9 to the probe ele~odes 1 by a slgnAl from the timing cor.~,oller 13, and switches the signal from the probe .. .
;, '' '~ ' ., 211177~
electrodes 1 and transmits it to a waveform shaping circuit 14. A recording/reproducing voltage application circuit 12 which serves as voltage application means applies a pulsive voltage to write a record bit, to the recording medium 8 by a signal from the timing controller 13, and applies a read voltage to read the written information. The timing controller 13 is connected to the probe position controller 10, the switching circuit 11 and the recording/reproducing voltage application circuit 12 to eontrol the time division processing of the recorded and reproduced data and the allocation of the reeord signals to the probe eleetrodes. The waveform shaping circuit 14 which serves as current detection means detects a current flowing between the recording medium 8 and the probe eleetrodes 1 to reproduce the information recolded by the signal from the probe electrodes 1.
A structure of the probe plate 3 is explained in detail with reference to Fig. 3. Fig. 3 shows a seetional view of a neighbo,l,ood of a eantilever of the probe plate shown in Fig. 2. As shown in Fig. 3, the eantilever 2 to which the probe eleetrode 1 iB fixed is made by depositing a re~ ent oxide ~ilm 20 and an eleetrieal slgnal wire 40. The probe eleetrode l i8 eleetrleally connected to the eleetrleal slgnal wlre 40. The fixed end of the eantilever 2 is fixed to one plane of the probe plate 3 made of a s~l~eon single , - 8 - 2 ~7 7 0 crystal plate, and an electrical wire lead portion 4 is formed on the other plane of the probe plate 3. The electric wire lead portion 4 includes a conductive member 41, a conductive film 42 having a metal vapor-deposited thereon, and a le~i ng wire 43 by wirebon~;ng which serves as an electrical wire for taking out an electrical signal out of the probe plate 3. An electrical signal from the probe electrode 1 flows to the electrical signal wire 40, the conductive member 41, the con~uctive film 42 and the lead wire 43 se~uentially, whereby the electrical signal is taken ~ ~;
out to the plane of the probe plate 3 opposite to the probe electrode 1.
The electric wire lead 4 of the present embodiment is formed in the followlng manner. Ions are t ~lAnted to that portion of the silicon single crystal substrate (probe plate 3) having both sides thereof polished which i8 to be formed into the conduotlve member 41.
Then, an area from a rear side (an upper plane ln Fig.
Information Recording and Reproduclng Apparatus for Recording and Reproducing Information by Using a Probe Electrode BACKGROUND OF THE INVENTION
Field of the Invention The present invention relates to an information recording and reproducing apparatus for perfol ~ ng at least one of recording and reproducing of information, which uses a principle of a sc~nn~ ng tunneling microscope or a sC~nnl n~ interatomic force microscope.
Related ~ackaround Art Recently, a 9c~nn~ng t~lnnel ing microscope (herelnafter referred to as STM) capable of directly observing an electron structure of a surface atom of a con~l-ctor, and an interatomic force microscope which applles the technology of the STM have been developed and various applications thereof have been pLoposed.
Part~cul~rly, applications for a recording apparatus whlch writes information into a ,eco ding medium at a high resolution and a lep,od~c1 ng apparatus for re~ng the informatlon written in the recording medium at a high resolutlon have been developed. In an apparatus which applies the STM, it has been proposed to manufacture components thereof by a ~nown technology called micL. ah~n1C~ or micromach1n~ng (see, for example, K.E. Pe~e-~en, Proc. IEEE, 70, 420 (1982)).
' ~
,. : .. . .
,, "
~ - 2 - , 2~ 70 An example is described below.
As shown in Fig. 1, a probe board 114 for supporting a plurality of probe electrodes 113 and a lead wire board 119 are provided on a probe base board 115, and the probe electrodes 113 and the lead wire board 119 are electrically connected with respect to the respective probe electrodes 113 by co~necting wires 118 such as wire hond~ng. On the other hand, a recording medium 116 supported by a recording medium plate 117 is arranged to face the plane of the probe -plate 114 on which the probe electrodes are provided.
A pulsive voltage for writing a record bit on the L aao dlng medium 116 by a recording/reproducing voltage application circult (not shown) is applied between the leco~ding medium 116 and each of the probe electrodes 113, and a read voltage for reAd1ng the written information is applied to ~eco,d and ap-oduce the ~ ~-lnformation.
Ilc~_v~" in the aonven~lonal recordlng and ~ep,od~cing apparatus described above, the probe plate and the L eco,ding medium are in a very close position ln the recordlng and reproduc1ng modes. As a result, ess the electrlc lead wires from the probe plate are optimally ~esigned, the conneoting wires which are .~o~e~ing parts wlth the lead wire plate lnterfere wlth the ~eCG~ ding medium plate or the recordlng medium, 80 that there will arlse a problem that the " ' '' ~ ; ,' ~ "
. , ,, ~, . . ' .: ~ .~ .
connecting wire~ are shorted each other or the connecting wires are broken. This problem is serious particularly when the probe electrodes and the recording medium are relatively moved in a plane by a large distance.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide an information recording and reproducing apparatus which optimize the wiring of the lead wires from the probe plate ~o prevent the interference with the recording medium and the recordlng medium plate when the recording medium and the probe electrodes are relatively moved.
The above ob~ect i8 aohieved by an information recording and ,ep-od~cing apparatus, which is provided with probe electrodes supported by a probe plate and arranged to face a recording medium supported by a recolding medium plate, moving means for relatively moving the recording medium and the probe electrodes, voltage appllcation means for applying a voltage between the recording medium and the probe electrodes, and electric wire take-out portion for taking out electric wires provlded on at least one of a plane of the probe base plane oppostte to the probe ele~-odes and a plane of the recording medlum plate opposite to the recording medium.
'" ' :
-In the information recording and reproducing apparatus of the present invention, since the electric wire lead means for taking out the electric wires is provided on at least one of the plane of the probe plate opposite to the probe electrodes and the plane of the recording medium plate opposite to the recording medium, the electric wires are taken out of the plane opposite to the plane to which the probe electrodes and the recording medium face. As a result, there is no projecting member other than the probe electrodes between the probe plate and the recording medium, and even if the probe electrodes and the recording medium are relatively moved in the plane, the electric wires do not interfere with the recording medium or the probe electrodes.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 shows a sectional view of a neighborhood of a probe plate and a recording medium for illustrating a positional relationship between the probe plate and the recording medium in a conventional information recording and reproducing apparatus, Fig. 2 shows a block diagram of one embodiment of the information recording and reproducing apparatus of the present invention, Fig. 3 shows a sectional view of a neighborhood of a cantilever of the probe plate shown in Fig. 2 Fig. 4 shows a sectional view of a neighborhood of the probe plate and the recording medium for illustrating a positional relation between the probe plate and the recording medium shown in Fig. 2 Fig. 5 shows a perspective view of a probe plate and an electric circuit board shown in Fig. 4, Fig. 6 shows a sectional view of a neighborhood of a cantilever of a probe plate in other embodiment of the information recording and reproducing apparatus of the present invention, and Fig. 7 shows a sectional view of the recording medium shown in Fig. 4.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
An embodiment of the present invention is now explained with reference to the drawings.
Fig. 2 shows a block diagram of one embodiment of the information recording and reproducing apparatus of the present invention. As shown in Fig. 2, conductive probe electrodes 1 are fixed to free ends of cantilevers 2 made of elastic material. The fixed ends of the cantilevers 2 are fixed to a probe plate 3 made of a silicon single crystal substrate. An xy drive element 6 including a piezo-electric element has one end thereof fixed to the probe plate 3 and the other end thereof fixed to an inslde of a main body 7, so that the probe electrodes 1 can be driven in xy 2~11770 directions by the xy drive element 6. Accordingly, the probe electrodes 1 can be moved to any position in the xy direction.
On the other hand, a recording medium 8 includ~s a record layer having a Squarilium-Bis-6-n-Oatylazulene (SOAZ~ dye organic thin film deposited on a gold electrode, and the gold electrode of the recording medium 8 is formed on a medium plate 80. A z drive element 9 including a piezo-electric element has one end thereof fixed to the medium substrate 80 and the other end fixed to the inside of the main body 7, so that the medium plate 80 is driven in the z direction by the z drlve element 9 and the recording medlum 8 is moved ln the z direction. As seen from the above descrlption, the drive means for relatively moving the probe electrodes 1 and the recording medium 8 ls constituted by the xy drive element 6 and the z drive ~1 e, 1, 9.
A probe position controller 10 controls the z posltion of the probe electrodes 1 (a SpAC~ ng be~leon the probe electrode 1 and the ,eoo~ding medium 8) and the xy posltion of the probe electrodes 1 by lnstructlon of ~tgnal proo~s~ ng, or slgnal from tlming con~,oller 13 or switching circuit 11, and it is co~ns~ed to the xy drlve 9~ e ? ~ 6 and the z drive ql f sr~ 9. The switching circuit ll swltches ~ Al9 to the probe ele~odes 1 by a slgnAl from the timing cor.~,oller 13, and switches the signal from the probe .. .
;, '' '~ ' ., 211177~
electrodes 1 and transmits it to a waveform shaping circuit 14. A recording/reproducing voltage application circuit 12 which serves as voltage application means applies a pulsive voltage to write a record bit, to the recording medium 8 by a signal from the timing controller 13, and applies a read voltage to read the written information. The timing controller 13 is connected to the probe position controller 10, the switching circuit 11 and the recording/reproducing voltage application circuit 12 to eontrol the time division processing of the recorded and reproduced data and the allocation of the reeord signals to the probe eleetrodes. The waveform shaping circuit 14 which serves as current detection means detects a current flowing between the recording medium 8 and the probe eleetrodes 1 to reproduce the information recolded by the signal from the probe electrodes 1.
A structure of the probe plate 3 is explained in detail with reference to Fig. 3. Fig. 3 shows a seetional view of a neighbo,l,ood of a eantilever of the probe plate shown in Fig. 2. As shown in Fig. 3, the eantilever 2 to which the probe eleetrode 1 iB fixed is made by depositing a re~ ent oxide ~ilm 20 and an eleetrieal slgnal wire 40. The probe eleetrode l i8 eleetrleally connected to the eleetrleal slgnal wlre 40. The fixed end of the eantilever 2 is fixed to one plane of the probe plate 3 made of a s~l~eon single , - 8 - 2 ~7 7 0 crystal plate, and an electrical wire lead portion 4 is formed on the other plane of the probe plate 3. The electric wire lead portion 4 includes a conductive member 41, a conductive film 42 having a metal vapor-deposited thereon, and a le~i ng wire 43 by wirebon~;ng which serves as an electrical wire for taking out an electrical signal out of the probe plate 3. An electrical signal from the probe electrode 1 flows to the electrical signal wire 40, the conductive member 41, the con~uctive film 42 and the lead wire 43 se~uentially, whereby the electrical signal is taken ~ ~;
out to the plane of the probe plate 3 opposite to the probe electrode 1.
The electric wire lead 4 of the present embodiment is formed in the followlng manner. Ions are t ~lAnted to that portion of the silicon single crystal substrate (probe plate 3) having both sides thereof polished which i8 to be formed into the conduotlve member 41.
Then, an area from a rear side (an upper plane ln Fig.
3) of the sillcon slngle ~y~al to the lon implanted portion which ls to be ~ormed into the conductlve - ~er 41 is eleotrolytlcally etched by potassium hyd~o~lde (KOH) solution. Thus, the conductlve - ~- 41 18 formed at the bottom of the hole formed by the etching.
Then, chromium (Cr) 18 evapGrated on to the hole through a mask, and gold (Au) i8 applied to ~orm the conductive film 42. A bond~ng pad for the wlre hon~1n3 . ~ , . ; ' ' , , 2~ ~177~
is provided on the conductive film 42 as connecting means.
The probe electrodes 1 and the cantilevers 2 are formed in the following -nne.r. A thermal oxidization film is formed on a silicon single crystal substrate to a thickness of 0.3 ,um, and as many oxide films 20 as the number of cantilevers 2 to bs formed, which are of lever shape having a length of 100 ,um and a width of 20 ,um, are patterned. A pattern of the electrical signal wire 40 is then formed on the oxide film 20 and a predeteL ~ned portion of the silicon single crystal substrate is etched by potassium hydroxide (KOH) solution from the upper surface to form the cantilevers 2.
Then, carbon (C) is deposlted to a height of 5 ,um at the ends of the cantilevers 2 by an eleatron beam deposition method to form the probe electrodes 1.
A positional relationship between the probe plate 3 and the recording medium 8 (see Fig. 2) is now expl~1ne~ with reference to Figs. 4 and 5. Fig. 4 8hows a sectional view of a ne~ghborhood of the probe plate and the recording medium for illustrating the positional relationship be~.~een the probe plate and the recording medium shown in Fig. 2, and Fig. 5 shows a ~eI ~pective view of the probe substrate and the electric circuit board shown in Fig. 4. As shown in Flg8. 4 and 5, an electrlo clrcult board 5 (which lncludes the circuits 10-14 of Fig. 2) for effecting ... . .. .. ...... .
~. ..
o 21~7~0 the control is attached to the plane of the probe plate 3 opposite to the probe elec~ode 1, and the lead wires 43 are co~n~cted to the signal wires through a bond~ ng pad (not shown) formed in the electric wiring area 51 of the electric circuit board 5 from the electric wire lead 4 formed on the probe plate 3. Electric parts 52 ~
for ~oce~slng the signals from the probe ele~lodes 1 ~ -are mounted on the electric circuit board 5 and they are connected to the con~,ol unit through an external connection unit 53 having a fle~l hl e printed circuit board. The recording medium 8 is arranged to face the probe electrodes 1.
In the present construction, only the probe elec~sodes 1 pro~ect to the plane of the probe plate 3 faclng the recording medium 8. Thus, when the probe ~:
plate 3 and the recordlng medlum 8 are relatively moved in a plane, the lead wires 43 do not interfere wlth the ;
~eco.ding medium 8. As a result, the degree of f.~ed~
ln arrAnglng the probe substrate 3 and the ~eco-ding medium 8 is lncreased. Further, since the electric ~n~l wires from the probe elec~odes 1 are co~e~ed I ;
to the electric circuit ln short paths wlthout routing the probe plate 3, the circuit is resistable to di~urbance.
Fig. 6 shows a ~ectional view of a ne~ hGrl~ood of the cantilevers of the probe plate in ano~l.e.
embo~1 sr~ of the lnformatlon ~~co dlng and .ep.~ n~
;. " :' '~' -11- 2~770 apparatus of the present inventlon. In the present embo~ nt, the conductive probe electrodes 1 are fixed to free ends of the cantilevers 2 having a resilient and conductive film 21 and electrical signal wires 40 and they are electrically connected to the conductive film 21 and the electrical signAl wires 40. The fixed ends of the cantilevers 2 are fixed to the probe plate 3 made of a silicon single ~y~al substrate. The electrical wire lead 4 includes electrlcal signal wires 40, conductive film 21, conductive wires 44 having metal evaporated thereon, and a metal bump 45 formed to ;
take out the electrlcal slgnals out of the probe plate -~
3. The electrical ~lgnal from the probe ele~L ode 1 -sequentlally flowes to the conductive film 21, the electrlcal 8ignal wires 40, the conductive wires 44 and the bump 45, so that the electrlcal ~lgnal is taken out of the plane of the probe plate 3 oppo~lte to the probe ele~odes l. The probe plate 3 and the eleatric ;
clrcult board 5 are electrlcally conne~;led by using condl~otive partiGles 47 contalned ln an anlsG~o~
oo.-l.cLlve sheet 46 between the bump 45 facing the probe plate 3 and the ele~L~ode pad 55 facing the electrlc clrcult board 5. The ~acordlng medlum (not shown) 18 arranged to face the probe eleo~odes 1. ~
The probe plate 3 of the y~aser~ ment 18 ~-~ormed in the followlng manner. Ions are lmplanted to a 811 ~con slngle ~ly~al substrate having both sides -~ - 12 - 2~ ~77 ~
thereof polished to form a conductive member, and a plurality of lever shaped conductive films 21 having a length of 150 ~m and a width of 30 ~m are patterned (only one lever is shown in Fig. 6). Then, a pattern of the electrical signal wires 40 is formed and electrolytic etching is conducted by potassium hydroxide (KOH) solution to the ion implanted area from a rear side (upper surface in Fig. 6) of the silicon single crystal substrate. Thus, the cantilevers 2 and the levers with short electrical wire leads are formed.
Chromium (Cr) is evaporated to the short levers through a mask, and gold (Au) is applied to form the conductive wlres 44. The bumps 45 for the anisotoropy co~uctive sheet 46 are provlded on the conductive wires 44.
Then, carbon (C) is depos~ted to a height of 5 ,um at the ends of the cantilevers 2 by an electron beam flepo~ltlon method to form the probe electrodes l. In this ?nnsr~ the probe ele~odes 1 are formed at the ends of the cantilevers 2 on the probe plate 3.
The probe plate 3 and the electric circuit board 5 are csnnected in the ~ollowing -- er. The aniso~oroyy condllctive sheet 46 having a number of co~ductive particles 47 uniformly dispeL~ed in the bond is posl~loned between the probe plate 3 and the electric alrcuit board 5, and it i8 heated and pressurlzed 80 that the oon~lctive particles 47 are physically contacted only vertically (between the bump 45 and the . .
~ - 13 -2~17~0 electrode pad 55) to make it conductive.
In the present embodiment, like in the embodiment shown in Fig. 3, only the probe electrodes 1 pro;ect to the plane of the probe plate 3 opposite to the ~e~olding medium (not shown). Accordingly, when the probe plate 3 and the recording medium are relatively moved in the plane, the conductive wires 44 do not interfere with the recording medium. Further, since the electrical signal wires 40 from the probe electrodes 1 can be connected to the electric circuit ~
board 5 in a short path without routing to the probe ~ -plate 3, the circuit is resistable to disturbance.
In the embodiments described above, the electrical wires are taken out from the nei~hborhood of the probe ele~LIodes l to the opposite side of the probe substrate 3 although the present provided on the probs plate 3 and the electric wires may be taken out of the end of the probe plate 3. The position to taken out to the opposite side of the probe plate 3 is not limited to that described in the embod~ ~nts. Further, while the probe plate 3 is described in connection with the I ;
take-out of the electric wires, it may be applied to the medium plate 80 (Flg. 4).
This is explained in detail with reference to Fig.
7. Numeral 80 denotes a recording medium plate made of a sllicon ~ingle crystal substrate, numeral 81 denotes a recording medium underlying electrode having gold :
'' '~
: ' : '' ,', .
~ 14 - 2~1770 (Au) epitaxially grown, numeral 82 denotes a record layer having a Squarilium-~is-6-n-Octylazulene (SOAZ) dye organic thin film deposlted on the recording medium underlying substrate by an LB method, nl - al 83 denotes an electric wire take-out portion formed on the plane of the recording medium plate opposite to the ecoLd layer, n~ - al 84 denotes a con~uQtive member, n~ - al 85 denotes a co~ductive film having gold ;;~ ;
e~apo~ated, and nl ~ al 86 denotes an electrical wire for taking the electrical s1 gn~l out of the eco ding medium plate 80. Thus, the info ?tion s~gnal from the Leao~d layer 82 flows to the ~ecor~ing medium underlylng ele~,ode 8~, the co~uctive member 84, the oonduGtive fllm 85 and the lead wlre 86 sequentially, 80 that the lnformatlon 81gnA1 may be taken out from the plane of the recordlng medlum substrate 80 opposite to the L~UO d layer.
The eleotric wire lead 83 ln the present embodlment 18 formed in the same manner as that of the eleotrio wire lead 4 of Fig. 3. It 18 also effective where the underlylng ele~lode of the ~e~o~ding medium 8 i8 divlded lnto a plurality of portions. The eleotrioal con~e~ion bet~en the probe plate 3 and the eleotrloal clrcult board 5 may be made by solds~ing but preferably it i8 made by solderless mountlng method suoh as con~uGtlve bond con~e~lon, conductive plated resin ball co-~ec~ion or dlreot connection by gold bump ~177~
and insulative resin.
The present invention offers the following advantages.
Since the electric wire lead for taking out the -electric wire is provided on at least one of the plane of the probe plate opposite to the probe electrodes and the plane of the recording medium plate opposite to the recording medium, there is no projecting member other than the probe electrodes between the probe plate and the recording medium. Thus, when the probe electrodes and the recording medium are relatively moved in the -~
plane, the electric wires do not interfere with the recordlng medium or the probe electrodes. As a result, the recording and reproduclng apparatus having a high ;~
degree of freedom in arranging the probe plate and the L ecolding medium substrate is attained.
Further, since it is not ~ecess~ry to route the electric wires on the plate, the length of the electric wlres can be shortened and the s~gn~l from the probe ele~odes is resistive to the external disturbance and the design of the probe plate having a plurality of ~ ;
probe electrodes is facilitated.
Then, chromium (Cr) 18 evapGrated on to the hole through a mask, and gold (Au) i8 applied to ~orm the conductive film 42. A bond~ng pad for the wlre hon~1n3 . ~ , . ; ' ' , , 2~ ~177~
is provided on the conductive film 42 as connecting means.
The probe electrodes 1 and the cantilevers 2 are formed in the following -nne.r. A thermal oxidization film is formed on a silicon single crystal substrate to a thickness of 0.3 ,um, and as many oxide films 20 as the number of cantilevers 2 to bs formed, which are of lever shape having a length of 100 ,um and a width of 20 ,um, are patterned. A pattern of the electrical signal wire 40 is then formed on the oxide film 20 and a predeteL ~ned portion of the silicon single crystal substrate is etched by potassium hydroxide (KOH) solution from the upper surface to form the cantilevers 2.
Then, carbon (C) is deposlted to a height of 5 ,um at the ends of the cantilevers 2 by an eleatron beam deposition method to form the probe electrodes 1.
A positional relationship between the probe plate 3 and the recording medium 8 (see Fig. 2) is now expl~1ne~ with reference to Figs. 4 and 5. Fig. 4 8hows a sectional view of a ne~ghborhood of the probe plate and the recording medium for illustrating the positional relationship be~.~een the probe plate and the recording medium shown in Fig. 2, and Fig. 5 shows a ~eI ~pective view of the probe substrate and the electric circuit board shown in Fig. 4. As shown in Flg8. 4 and 5, an electrlo clrcult board 5 (which lncludes the circuits 10-14 of Fig. 2) for effecting ... . .. .. ...... .
~. ..
o 21~7~0 the control is attached to the plane of the probe plate 3 opposite to the probe elec~ode 1, and the lead wires 43 are co~n~cted to the signal wires through a bond~ ng pad (not shown) formed in the electric wiring area 51 of the electric circuit board 5 from the electric wire lead 4 formed on the probe plate 3. Electric parts 52 ~
for ~oce~slng the signals from the probe ele~lodes 1 ~ -are mounted on the electric circuit board 5 and they are connected to the con~,ol unit through an external connection unit 53 having a fle~l hl e printed circuit board. The recording medium 8 is arranged to face the probe electrodes 1.
In the present construction, only the probe elec~sodes 1 pro~ect to the plane of the probe plate 3 faclng the recording medium 8. Thus, when the probe ~:
plate 3 and the recordlng medlum 8 are relatively moved in a plane, the lead wires 43 do not interfere wlth the ;
~eco.ding medium 8. As a result, the degree of f.~ed~
ln arrAnglng the probe substrate 3 and the ~eco-ding medium 8 is lncreased. Further, since the electric ~n~l wires from the probe elec~odes 1 are co~e~ed I ;
to the electric circuit ln short paths wlthout routing the probe plate 3, the circuit is resistable to di~urbance.
Fig. 6 shows a ~ectional view of a ne~ hGrl~ood of the cantilevers of the probe plate in ano~l.e.
embo~1 sr~ of the lnformatlon ~~co dlng and .ep.~ n~
;. " :' '~' -11- 2~770 apparatus of the present inventlon. In the present embo~ nt, the conductive probe electrodes 1 are fixed to free ends of the cantilevers 2 having a resilient and conductive film 21 and electrical signal wires 40 and they are electrically connected to the conductive film 21 and the electrical signAl wires 40. The fixed ends of the cantilevers 2 are fixed to the probe plate 3 made of a silicon single ~y~al substrate. The electrical wire lead 4 includes electrlcal signal wires 40, conductive film 21, conductive wires 44 having metal evaporated thereon, and a metal bump 45 formed to ;
take out the electrlcal slgnals out of the probe plate -~
3. The electrical ~lgnal from the probe ele~L ode 1 -sequentlally flowes to the conductive film 21, the electrlcal 8ignal wires 40, the conductive wires 44 and the bump 45, so that the electrlcal ~lgnal is taken out of the plane of the probe plate 3 oppo~lte to the probe ele~odes l. The probe plate 3 and the eleatric ;
clrcult board 5 are electrlcally conne~;led by using condl~otive partiGles 47 contalned ln an anlsG~o~
oo.-l.cLlve sheet 46 between the bump 45 facing the probe plate 3 and the ele~L~ode pad 55 facing the electrlc clrcult board 5. The ~acordlng medlum (not shown) 18 arranged to face the probe eleo~odes 1. ~
The probe plate 3 of the y~aser~ ment 18 ~-~ormed in the followlng manner. Ions are lmplanted to a 811 ~con slngle ~ly~al substrate having both sides -~ - 12 - 2~ ~77 ~
thereof polished to form a conductive member, and a plurality of lever shaped conductive films 21 having a length of 150 ~m and a width of 30 ~m are patterned (only one lever is shown in Fig. 6). Then, a pattern of the electrical signal wires 40 is formed and electrolytic etching is conducted by potassium hydroxide (KOH) solution to the ion implanted area from a rear side (upper surface in Fig. 6) of the silicon single crystal substrate. Thus, the cantilevers 2 and the levers with short electrical wire leads are formed.
Chromium (Cr) is evaporated to the short levers through a mask, and gold (Au) is applied to form the conductive wlres 44. The bumps 45 for the anisotoropy co~uctive sheet 46 are provlded on the conductive wires 44.
Then, carbon (C) is depos~ted to a height of 5 ,um at the ends of the cantilevers 2 by an electron beam flepo~ltlon method to form the probe electrodes l. In this ?nnsr~ the probe ele~odes 1 are formed at the ends of the cantilevers 2 on the probe plate 3.
The probe plate 3 and the electric circuit board 5 are csnnected in the ~ollowing -- er. The aniso~oroyy condllctive sheet 46 having a number of co~ductive particles 47 uniformly dispeL~ed in the bond is posl~loned between the probe plate 3 and the electric alrcuit board 5, and it i8 heated and pressurlzed 80 that the oon~lctive particles 47 are physically contacted only vertically (between the bump 45 and the . .
~ - 13 -2~17~0 electrode pad 55) to make it conductive.
In the present embodiment, like in the embodiment shown in Fig. 3, only the probe electrodes 1 pro;ect to the plane of the probe plate 3 opposite to the ~e~olding medium (not shown). Accordingly, when the probe plate 3 and the recording medium are relatively moved in the plane, the conductive wires 44 do not interfere with the recording medium. Further, since the electrical signal wires 40 from the probe electrodes 1 can be connected to the electric circuit ~
board 5 in a short path without routing to the probe ~ -plate 3, the circuit is resistable to disturbance.
In the embodiments described above, the electrical wires are taken out from the nei~hborhood of the probe ele~LIodes l to the opposite side of the probe substrate 3 although the present provided on the probs plate 3 and the electric wires may be taken out of the end of the probe plate 3. The position to taken out to the opposite side of the probe plate 3 is not limited to that described in the embod~ ~nts. Further, while the probe plate 3 is described in connection with the I ;
take-out of the electric wires, it may be applied to the medium plate 80 (Flg. 4).
This is explained in detail with reference to Fig.
7. Numeral 80 denotes a recording medium plate made of a sllicon ~ingle crystal substrate, numeral 81 denotes a recording medium underlying electrode having gold :
'' '~
: ' : '' ,', .
~ 14 - 2~1770 (Au) epitaxially grown, numeral 82 denotes a record layer having a Squarilium-~is-6-n-Octylazulene (SOAZ) dye organic thin film deposlted on the recording medium underlying substrate by an LB method, nl - al 83 denotes an electric wire take-out portion formed on the plane of the recording medium plate opposite to the ecoLd layer, n~ - al 84 denotes a con~uQtive member, n~ - al 85 denotes a co~ductive film having gold ;;~ ;
e~apo~ated, and nl ~ al 86 denotes an electrical wire for taking the electrical s1 gn~l out of the eco ding medium plate 80. Thus, the info ?tion s~gnal from the Leao~d layer 82 flows to the ~ecor~ing medium underlylng ele~,ode 8~, the co~uctive member 84, the oonduGtive fllm 85 and the lead wlre 86 sequentially, 80 that the lnformatlon 81gnA1 may be taken out from the plane of the recordlng medlum substrate 80 opposite to the L~UO d layer.
The eleotric wire lead 83 ln the present embodlment 18 formed in the same manner as that of the eleotrio wire lead 4 of Fig. 3. It 18 also effective where the underlylng ele~lode of the ~e~o~ding medium 8 i8 divlded lnto a plurality of portions. The eleotrioal con~e~ion bet~en the probe plate 3 and the eleotrloal clrcult board 5 may be made by solds~ing but preferably it i8 made by solderless mountlng method suoh as con~uGtlve bond con~e~lon, conductive plated resin ball co-~ec~ion or dlreot connection by gold bump ~177~
and insulative resin.
The present invention offers the following advantages.
Since the electric wire lead for taking out the -electric wire is provided on at least one of the plane of the probe plate opposite to the probe electrodes and the plane of the recording medium plate opposite to the recording medium, there is no projecting member other than the probe electrodes between the probe plate and the recording medium. Thus, when the probe electrodes and the recording medium are relatively moved in the -~
plane, the electric wires do not interfere with the recordlng medium or the probe electrodes. As a result, the recording and reproduclng apparatus having a high ;~
degree of freedom in arranging the probe plate and the L ecolding medium substrate is attained.
Further, since it is not ~ecess~ry to route the electric wires on the plate, the length of the electric wlres can be shortened and the s~gn~l from the probe ele~odes is resistive to the external disturbance and the design of the probe plate having a plurality of ~ ;
probe electrodes is facilitated.
Claims (7)
1. An information recording and reproducing apparatus for performing at least one of recording and reproducing of information by using a probe electrode comprising:
the probe electrode supported by a probe plate and arranged to face a recording medium supported by a recording medium plate;
moving means for relatively moving said recording medium and said probe electrode;
voltage application means for applying a voltage between said recording medium and said probe electrode;
and an electric wire take-out portion for taking out an electric wire provided on at least one of a plane of said probe plate opposite to said probe electrode and a plane of said recording medium plate opposite to said recording medium.
the probe electrode supported by a probe plate and arranged to face a recording medium supported by a recording medium plate;
moving means for relatively moving said recording medium and said probe electrode;
voltage application means for applying a voltage between said recording medium and said probe electrode;
and an electric wire take-out portion for taking out an electric wire provided on at least one of a plane of said probe plate opposite to said probe electrode and a plane of said recording medium plate opposite to said recording medium.
2. An apparatus according to Claim 1, wherein said probe plate is a single crystal substrate.
3. An apparatus according to Claim 1, wherein said recording medium plate is a single crystal substrate.
4. An apparatus according to Claim 2, wherein said single crystal substrate is a silicon single crystal substrate.
5. An apparatus according to Claim 3, wherein said single crystal substrate is a silicon single crystal substrate.
6. An apparatus according to Claim 1, wherein said probe plate is separate from an electrical circuit board for conducting control, and includes connection means for electrically connecting said probe plate and said electrical circuit board through said electrical wire take-out portion.
7. An information recording and reproducing apparatus according to Claim 6, wherein said connection means is formed by a solderless mounting method.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4340754A JP3025120B2 (en) | 1992-12-21 | 1992-12-21 | Recording and playback device |
| JP4-340754 | 1992-12-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2111770A1 CA2111770A1 (en) | 1994-06-22 |
| CA2111770C true CA2111770C (en) | 1998-10-13 |
Family
ID=18339990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002111770A Expired - Fee Related CA2111770C (en) | 1992-12-21 | 1993-12-17 | Information recording and reproducing apparatus for recording and reproducing information by using a probe electrode |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5426631A (en) |
| EP (1) | EP0603770B1 (en) |
| JP (1) | JP3025120B2 (en) |
| AT (1) | ATE190424T1 (en) |
| CA (1) | CA2111770C (en) |
| DE (1) | DE69328012T2 (en) |
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| US6337479B1 (en) * | 1994-07-28 | 2002-01-08 | Victor B. Kley | Object inspection and/or modification system and method |
| US5751683A (en) * | 1995-07-24 | 1998-05-12 | General Nanotechnology, L.L.C. | Nanometer scale data storage device and associated positioning system |
| US6339217B1 (en) | 1995-07-28 | 2002-01-15 | General Nanotechnology Llc | Scanning probe microscope assembly and method for making spectrophotometric, near-field, and scanning probe measurements |
| US6353219B1 (en) | 1994-07-28 | 2002-03-05 | Victor B. Kley | Object inspection and/or modification system and method |
| JPH09293283A (en) * | 1996-04-25 | 1997-11-11 | Hewlett Packard Co <Hp> | Probe device, its manufacture and media movement type memory device |
| JPH10321631A (en) * | 1997-05-19 | 1998-12-04 | Oki Electric Ind Co Ltd | Semiconductor device and its manufacture |
| US6459088B1 (en) * | 1998-01-16 | 2002-10-01 | Canon Kabushiki Kaisha | Drive stage and scanning probe microscope and information recording/reproducing apparatus using the same |
| US6923044B1 (en) | 2001-03-08 | 2005-08-02 | General Nanotechnology Llc | Active cantilever for nanomachining and metrology |
| US6787768B1 (en) | 2001-03-08 | 2004-09-07 | General Nanotechnology Llc | Method and apparatus for tool and tip design for nanomachining and measurement |
| US6752008B1 (en) | 2001-03-08 | 2004-06-22 | General Nanotechnology Llc | Method and apparatus for scanning in scanning probe microscopy and presenting results |
| US7196328B1 (en) | 2001-03-08 | 2007-03-27 | General Nanotechnology Llc | Nanomachining method and apparatus |
| US6802646B1 (en) * | 2001-04-30 | 2004-10-12 | General Nanotechnology Llc | Low-friction moving interfaces in micromachines and nanomachines |
| AU6061100A (en) * | 1999-07-01 | 2001-01-22 | General Nanotechnology, Llc | Object inspection and/or modification system and method |
| US6931710B2 (en) * | 2001-01-30 | 2005-08-23 | General Nanotechnology Llc | Manufacturing of micro-objects such as miniature diamond tool tips |
| US7253407B1 (en) | 2001-03-08 | 2007-08-07 | General Nanotechnology Llc | Active cantilever for nanomachining and metrology |
| US20020154871A1 (en) * | 2001-04-19 | 2002-10-24 | Autonetworks Technologies, Ltd. | Optical connector, shield casing, optical connector device |
| JP4695325B2 (en) * | 2001-09-17 | 2011-06-08 | キヤノン電子株式会社 | Magnetic detection element, method of manufacturing the same, and portable device using the element |
| US7053369B1 (en) | 2001-10-19 | 2006-05-30 | Rave Llc | Scan data collection for better overall data accuracy |
| US6813937B2 (en) | 2001-11-28 | 2004-11-09 | General Nanotechnology Llc | Method and apparatus for micromachines, microstructures, nanomachines and nanostructures |
| JP2005538855A (en) | 2002-09-09 | 2005-12-22 | ジェネラル ナノテクノロジー エルエルシー | Fluid delivery of a scanning probe microscope |
| US20050128927A1 (en) * | 2003-12-15 | 2005-06-16 | Hewlett-Packard Development Co., L.P. | Electrostatic actuator for contact probe storage device |
| US7436753B2 (en) | 2003-12-17 | 2008-10-14 | Mejia Robert G | Contact probe storage FET sensor |
| US7423954B2 (en) * | 2003-12-17 | 2008-09-09 | Hewlett-Packard Development Company, L.P. | Contact probe storage sensor pod |
| US7212487B2 (en) * | 2004-01-07 | 2007-05-01 | Hewlett-Packard Development Company, L.P. | Data readout arrangement |
| US7787350B2 (en) * | 2005-01-13 | 2010-08-31 | International Business Machines Corporation | Data storage device |
| US7212488B2 (en) | 2005-03-21 | 2007-05-01 | Hewlett-Packard Development Company, L.P. | Method and device enabling capacitive probe-based data storage readout |
| JP2007141414A (en) * | 2005-11-22 | 2007-06-07 | Lg Electronics Inc | Nano information saving/reproduction device using cantilever structure, and its manufacturing method |
| US8302456B2 (en) | 2006-02-23 | 2012-11-06 | Asylum Research Corporation | Active damping of high speed scanning probe microscope components |
| US7514942B2 (en) * | 2006-09-27 | 2009-04-07 | Intel Corporation | Probe based patterning of microelectronic and micromechanical devices |
| US7948337B2 (en) * | 2007-05-31 | 2011-05-24 | Seagate Technology Llc | Simultaneous rotational control using offset linear actuators |
| JP2009123421A (en) * | 2007-11-13 | 2009-06-04 | Canon Inc | Method of manufacturing air tight container |
| JP2011210431A (en) * | 2010-03-29 | 2011-10-20 | Canon Inc | Method for manufacturing hermetic container |
| JP5590935B2 (en) * | 2010-03-29 | 2014-09-17 | キヤノン株式会社 | Airtight container manufacturing method |
| JP2011210430A (en) * | 2010-03-29 | 2011-10-20 | Canon Inc | Method for manufacturing hermetic container |
| JP2012059401A (en) | 2010-09-06 | 2012-03-22 | Canon Inc | Method for manufacturing airtight container |
| JP5627370B2 (en) | 2010-09-27 | 2014-11-19 | キヤノン株式会社 | Depressurized airtight container and image display device manufacturing method |
| US9383388B2 (en) | 2014-04-21 | 2016-07-05 | Oxford Instruments Asylum Research, Inc | Automated atomic force microscope and the operation thereof |
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| US4575822A (en) * | 1983-02-15 | 1986-03-11 | The Board Of Trustees Of The Leland Stanford Junior University | Method and means for data storage using tunnel current data readout |
| FR2559297B1 (en) * | 1984-02-03 | 1990-01-12 | Commissariat Energie Atomique | NEW FLIGHT SKATE FOR MAGNETIC RECORDING HEADS |
| DE3679319D1 (en) * | 1986-05-27 | 1991-06-20 | Ibm | STORAGE UNIT WITH DIRECT ACCESS. |
| US4916688A (en) * | 1988-03-31 | 1990-04-10 | International Business Machines Corporation | Data storage method using state transformable materials |
| JPH01290598A (en) * | 1988-05-17 | 1989-11-22 | Res Dev Corp Of Japan | Production of fine multiprobe |
| JP2896794B2 (en) * | 1988-09-30 | 1999-05-31 | キヤノン株式会社 | Scanning tunnel current detector, scanning tunnel microscope, and recording / reproducing device |
| US5015850A (en) * | 1989-06-20 | 1991-05-14 | The Board Of Trustees Of The Leland Stanford Junior University | Microfabricated microscope assembly |
| US5187367A (en) * | 1990-08-14 | 1993-02-16 | Canon Kabushiki Kaisha | Cantilever type probe, scanning tunneling microscope and information processing device equipped with said probe |
| JP3030574B2 (en) * | 1990-08-16 | 2000-04-10 | キヤノン株式会社 | Micro-displacement information detecting probe element, scanning tunnel microscope, atomic force microscope, and information processing apparatus using the same |
| JP2741629B2 (en) * | 1990-10-09 | 1998-04-22 | キヤノン株式会社 | Cantilever probe, scanning tunneling microscope and information processing apparatus using the same |
| JP2802828B2 (en) * | 1990-10-19 | 1998-09-24 | キヤノン株式会社 | Information record carrier and information processing apparatus using the same |
| US5216631A (en) * | 1990-11-02 | 1993-06-01 | Sliwa Jr John W | Microvibratory memory device |
| JPH0575047A (en) * | 1991-03-08 | 1993-03-26 | Hitachi Ltd | Storage device |
| JP2930447B2 (en) * | 1991-05-15 | 1999-08-03 | キヤノン株式会社 | Information processing device |
| US5329122A (en) * | 1991-08-29 | 1994-07-12 | Canon Kabushiki Kaisha | Information processing apparatus and scanning tunnel microscope |
-
1992
- 1992-12-21 JP JP4340754A patent/JP3025120B2/en not_active Expired - Fee Related
-
1993
- 1993-12-16 US US08/167,140 patent/US5426631A/en not_active Expired - Lifetime
- 1993-12-17 DE DE69328012T patent/DE69328012T2/en not_active Expired - Fee Related
- 1993-12-17 EP EP93120440A patent/EP0603770B1/en not_active Expired - Lifetime
- 1993-12-17 AT AT93120440T patent/ATE190424T1/en not_active IP Right Cessation
- 1993-12-17 CA CA002111770A patent/CA2111770C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0603770A3 (en) | 1995-12-13 |
| EP0603770B1 (en) | 2000-03-08 |
| CA2111770A1 (en) | 1994-06-22 |
| DE69328012T2 (en) | 2000-08-03 |
| ATE190424T1 (en) | 2000-03-15 |
| US5426631A (en) | 1995-06-20 |
| DE69328012D1 (en) | 2000-04-13 |
| JP3025120B2 (en) | 2000-03-27 |
| EP0603770A2 (en) | 1994-06-29 |
| JPH06195773A (en) | 1994-07-15 |
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