CA2110892A1 - Electrical Interconnection Method and Apparatus Utilizing Raised Connecting Means - Google Patents
Electrical Interconnection Method and Apparatus Utilizing Raised Connecting MeansInfo
- Publication number
- CA2110892A1 CA2110892A1 CA2110892A CA2110892A CA2110892A1 CA 2110892 A1 CA2110892 A1 CA 2110892A1 CA 2110892 A CA2110892 A CA 2110892A CA 2110892 A CA2110892 A CA 2110892A CA 2110892 A1 CA2110892 A1 CA 2110892A1
- Authority
- CA
- Canada
- Prior art keywords
- projections
- bump
- circuit
- connecting means
- electrical interconnection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16104—Disposition relative to the bonding area, e.g. bond pad
- H01L2224/16105—Disposition relative to the bonding area, e.g. bond pad the bump connector connecting bonding areas being not aligned with respect to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81194—Lateral distribution of the bump connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Abstract
A pair of electrical circuits (20, 22), which may be both flexible or one flexible and one rigid, are interconnected by projections, such as bumps (24) and rings (26). The projections are formed from substantially inelastic dielectric material, such as an epoxy, defining bumps (34) and rings (36), which are plated with copper (38). Projections (24, 26) of one circuit are disposed to interconnect with mating projections on the other circuit, the interconnection being bump to bump, bump to ring, or bump to pad. The projections may be formed on a copper-clad substrate (42) or on plated-through holes (72) on a printed wiring board (70).
Alternately, polygonal pads (94) on a circuit (90) may be joined to a projection. Further, a plurality of bump projections (106), electrically connected to the same or different circuits, may collectively interconnect with a single oval ring projection (108).
Alternately, polygonal pads (94) on a circuit (90) may be joined to a projection. Further, a plurality of bump projections (106), electrically connected to the same or different circuits, may collectively interconnect with a single oval ring projection (108).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US990,475 | 1992-12-14 | ||
US07/990,475 US5342207A (en) | 1992-12-14 | 1992-12-14 | Electrical interconnection method and apparatus utilizing raised connecting means |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2110892A1 true CA2110892A1 (en) | 1994-06-15 |
CA2110892C CA2110892C (en) | 1997-03-25 |
Family
ID=25536187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002110892A Expired - Fee Related CA2110892C (en) | 1992-12-14 | 1993-12-07 | Electrical interconnection method and apparatus utilizing raised connecting means |
Country Status (5)
Country | Link |
---|---|
US (2) | US5342207A (en) |
EP (1) | EP0602610B1 (en) |
JP (1) | JP2716354B2 (en) |
CA (1) | CA2110892C (en) |
DE (1) | DE69301531T2 (en) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5499924A (en) * | 1993-07-12 | 1996-03-19 | Kel Comporation | Butt joint connector assembly |
CA2135241C (en) * | 1993-12-17 | 1998-08-04 | Mohi Sobhani | Cavity and bump interconnection structure for electronic packages |
WO1997027490A1 (en) * | 1996-01-25 | 1997-07-31 | General Dynamics Information Systems, Inc. | Performing an operation on an integrated circuit |
US5938455A (en) * | 1996-05-15 | 1999-08-17 | Ford Motor Company | Three-dimensional molded circuit board having interlocking connections |
US5738530A (en) * | 1996-05-28 | 1998-04-14 | Packard Hughes Interconnect Company | Contact pad having metallically anchored elastomeric electrical contacts |
JPH1027952A (en) | 1996-07-09 | 1998-01-27 | Sharp Corp | Printed wiring board and manufacture thereof |
US6552563B1 (en) | 1996-11-14 | 2003-04-22 | Si Diamond Technology, Inc. | Display panel test device |
US5897335A (en) * | 1997-02-04 | 1999-04-27 | Integrated Device Technology, Inc. | Flip-chip bonding method |
US5796050A (en) * | 1997-02-05 | 1998-08-18 | International Business Machines Corporation | Flexible board having adhesive in surface channels |
US5831788A (en) * | 1997-06-27 | 1998-11-03 | Quantum Corporation | Circuit connector |
US5924875A (en) * | 1997-07-01 | 1999-07-20 | Trw Inc. | Cryogenic flex cable connector |
US6245444B1 (en) | 1997-10-02 | 2001-06-12 | New Jersey Institute Of Technology | Micromachined element and method of fabrication thereof |
US6036502A (en) * | 1997-11-03 | 2000-03-14 | Intercon Systems, Inc. | Flexible circuit compression connector system and method of manufacture |
US6118080A (en) * | 1998-01-13 | 2000-09-12 | Micron Technology, Inc. | Z-axis electrical contact for microelectronic devices |
JP3250216B2 (en) * | 1998-08-13 | 2002-01-28 | ソニーケミカル株式会社 | Flexible printed wiring board and method of manufacturing the same |
TW403252U (en) * | 1998-12-28 | 2000-08-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
JP3205548B2 (en) * | 1999-10-01 | 2001-09-04 | ソニーケミカル株式会社 | Multi-layer flexible wiring board |
JP3694825B2 (en) * | 1999-11-18 | 2005-09-14 | 日本航空電子工業株式会社 | Conductive pattern forming method and connector, flexible printed wiring board, anisotropic conductive member |
DE19957789A1 (en) | 1999-12-01 | 2001-06-21 | Leoni Bordnetz Sys Gmbh & Co | Contact system for two circuit boards |
JP4444435B2 (en) * | 2000-03-06 | 2010-03-31 | ソニーケミカル&インフォメーションデバイス株式会社 | Printed wiring board and method for manufacturing printed wiring board |
US7059868B1 (en) * | 2000-03-07 | 2006-06-13 | Western Digital (Fremont), Inc. | Connection of trace circuitry in a computer disk drive system |
US7230339B2 (en) * | 2003-03-28 | 2007-06-12 | Intel Corporation | Copper ring solder mask defined ball grid array pad |
WO2006033315A1 (en) * | 2004-09-24 | 2006-03-30 | Ibiden Co., Ltd. | Plating method and plating apparatus |
JP4328970B2 (en) * | 2005-08-02 | 2009-09-09 | セイコーエプソン株式会社 | Semiconductor device |
JP5105736B2 (en) * | 2005-10-31 | 2012-12-26 | 株式会社東芝 | Printed circuit board, electronic device, and printed circuit board manufacturing method |
US20070219521A1 (en) * | 2006-03-17 | 2007-09-20 | The Procter & Gamble Company | Absorbent article comprising a synthetic polymer derived from a renewable resource and methods of producing said article |
JP4273356B2 (en) * | 2007-02-21 | 2009-06-03 | セイコーエプソン株式会社 | Manufacturing method of semiconductor device |
JP5197156B2 (en) * | 2007-06-19 | 2013-05-15 | キヤノン株式会社 | Wiring board |
JP4548459B2 (en) * | 2007-08-21 | 2010-09-22 | セイコーエプソン株式会社 | Electronic component mounting structure |
KR100951456B1 (en) * | 2007-12-26 | 2010-04-28 | 아이볼타(주) | system for electric connection |
US8194355B1 (en) | 2008-05-08 | 2012-06-05 | Western Digital Technologies, Inc. | Head stack assembly with a laminated flexure having a snap-through feature |
US8230592B2 (en) * | 2008-08-19 | 2012-07-31 | International Business Machines Corporation | Method for via stub elimination |
US8136240B2 (en) * | 2008-08-19 | 2012-03-20 | International Business Machines Corporation | Method of forming a substrate having a plurality of insulator layers |
CN101740916B (en) * | 2008-11-19 | 2012-04-18 | 富士康(昆山)电脑接插件有限公司 | Electric couplers and component thereof |
US8279560B1 (en) | 2009-03-04 | 2012-10-02 | Western Digital Technologies, Inc. | Head stack assembly with suspension tail bond alignment by solder pin |
JP4949507B2 (en) * | 2010-08-20 | 2012-06-13 | シャープ株式会社 | Ion generator and electrical equipment |
US8611052B1 (en) | 2012-03-27 | 2013-12-17 | Western Digital Technologies, Inc. | Systems and methods for aligning components of a head stack assembly of a hard disk drive |
US9832887B2 (en) * | 2013-08-07 | 2017-11-28 | Invensas Corporation | Micro mechanical anchor for 3D architecture |
US9330695B1 (en) | 2013-12-10 | 2016-05-03 | Western Digital Technologies, Inc. | Disk drive head suspension tail with a noble metal layer disposed on a plurality of structural backing islands |
US8934199B1 (en) | 2014-03-31 | 2015-01-13 | Western Digital Technologies, Inc. | Disk drive head suspension tail with bond pad edge alignment features |
US10468363B2 (en) * | 2015-08-10 | 2019-11-05 | X-Celeprint Limited | Chiplets with connection posts |
US11495560B2 (en) * | 2015-08-10 | 2022-11-08 | X Display Company Technology Limited | Chiplets with connection posts |
JP2019176043A (en) * | 2018-03-29 | 2019-10-10 | ファナック株式会社 | Circuit board and manufacturing method thereof |
US11316086B2 (en) | 2020-07-10 | 2022-04-26 | X Display Company Technology Limited | Printed structures with electrical contact having reflowable polymer core |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4125310A (en) * | 1975-12-01 | 1978-11-14 | Hughes Aircraft Co | Electrical connector assembly utilizing wafers for connecting electrical cables |
US4453795A (en) * | 1975-12-01 | 1984-06-12 | Hughes Aircraft Company | Cable-to-cable/component electrical pressure wafer connector assembly |
US4116517A (en) * | 1976-04-15 | 1978-09-26 | International Telephone And Telegraph Corporation | Flexible printed circuit and electrical connection therefor |
US4268956A (en) * | 1977-10-13 | 1981-05-26 | Bunker Ramo Corporation | Method of fabricating an interconnection cable |
US4403272A (en) * | 1980-06-02 | 1983-09-06 | Oak Industries Inc. | Membrane switch interconnect tail and printed circuit board connection |
JPS61141787U (en) * | 1985-02-25 | 1986-09-02 | ||
US4902606A (en) * | 1985-12-20 | 1990-02-20 | Hughes Aircraft Company | Compressive pedestal for microminiature connections |
US4740700A (en) * | 1986-09-02 | 1988-04-26 | Hughes Aircraft Company | Thermally insulative and electrically conductive interconnect and process for making same |
US4813129A (en) * | 1987-06-19 | 1989-03-21 | Hewlett-Packard Company | Interconnect structure for PC boards and integrated circuits |
US5129142A (en) * | 1990-10-30 | 1992-07-14 | International Business Machines Corporation | Encapsulated circuitized power core alignment and lamination |
US5207585A (en) * | 1990-10-31 | 1993-05-04 | International Business Machines Corporation | Thin interface pellicle for dense arrays of electrical interconnects |
US5172050A (en) * | 1991-02-15 | 1992-12-15 | Motorola, Inc. | Micromachined semiconductor probe card |
US5158466A (en) * | 1991-03-04 | 1992-10-27 | Hughes Aircraft Company | Metallically encapsulated elevated interconnection feature |
US5147208A (en) * | 1991-06-28 | 1992-09-15 | Rogers Corporation | Flexible printed circuit with raised contacts |
JP2731471B2 (en) * | 1991-11-05 | 1998-03-25 | アルプス電気株式会社 | Electrical connection structure |
JP3368435B2 (en) * | 1993-04-22 | 2003-01-20 | 富士通株式会社 | Manufacturing method of electrical connection device |
-
1992
- 1992-12-14 US US07/990,475 patent/US5342207A/en not_active Expired - Lifetime
-
1993
- 1993-12-07 CA CA002110892A patent/CA2110892C/en not_active Expired - Fee Related
- 1993-12-14 EP EP93120155A patent/EP0602610B1/en not_active Expired - Lifetime
- 1993-12-14 JP JP5313866A patent/JP2716354B2/en not_active Expired - Lifetime
- 1993-12-14 DE DE69301531T patent/DE69301531T2/en not_active Expired - Fee Related
-
1994
- 1994-02-22 US US08/200,037 patent/US5415555A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH06237059A (en) | 1994-08-23 |
US5415555A (en) | 1995-05-16 |
EP0602610B1 (en) | 1996-02-07 |
CA2110892C (en) | 1997-03-25 |
US5342207A (en) | 1994-08-30 |
JP2716354B2 (en) | 1998-02-18 |
EP0602610A1 (en) | 1994-06-22 |
DE69301531T2 (en) | 1996-06-27 |
DE69301531D1 (en) | 1996-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |