CA2050456A1 - Fabrication of polycrystalline free-standing diamond films - Google Patents

Fabrication of polycrystalline free-standing diamond films

Info

Publication number
CA2050456A1
CA2050456A1 CA002050456A CA2050456A CA2050456A1 CA 2050456 A1 CA2050456 A1 CA 2050456A1 CA 002050456 A CA002050456 A CA 002050456A CA 2050456 A CA2050456 A CA 2050456A CA 2050456 A1 CA2050456 A1 CA 2050456A1
Authority
CA
Canada
Prior art keywords
substrate
temperature
substrate material
chemical vapor
vapor deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002050456A
Other languages
French (fr)
Inventor
Timothy J. Potter
Michael A. Tamor
Ching-Hsong Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Motor Company of Canada Ltd
Original Assignee
Ford Motor Company of Canada Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Motor Company of Canada Ltd filed Critical Ford Motor Company of Canada Ltd
Publication of CA2050456A1 publication Critical patent/CA2050456A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26Deposition of carbon only
    • C23C16/27Diamond only
    • C23C16/277Diamond only using other elements in the gas phase besides carbon and hydrogen; using other elements besides carbon, hydrogen and oxygen in case of use of combustion torches; using other elements besides carbon, hydrogen and inert gas in case of use of plasma jets
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/01Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes on temporary substrates, e.g. substrates subsequently removed by etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26Deposition of carbon only
    • C23C16/27Diamond only
    • C23C16/271Diamond only using hot filaments
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/04Diamond
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/107Melt

Abstract

Abstract of the Disclosure Method of fabricating free-standing diamond films by depositing and adhering polycrystalline diamond by hot filament chemical vapor deposition (1-100 Torr, filament temperature equal to or greater than 1900°C, substrate temperature of 650-950°C) onto a substrate meltable at a temperature slightly in excess of the deposition temperature; and (b) prior to cooling said polycrystalline diamond particles, increasing (50-300°C) the substrate temperature to melt at least a portion thereof while permitting such melt to emigrate from the diamond films.

Description

~O~JC)~5fi FABRICATION OF POLYCRYSTALLINE
FREE-STANDING DIAMOND FILMS

Backqround of the Inv~3ntion This invention relates to the technology of making diamond crystals, and more particularly to the art of making diamond films of such crystals in a 10 free-standing condition.

Discussion of the Prior Art The growth of diamond crystals, particularly thin films, from a vapor phase has been tried according 15 to several types of methods as delineated in U.S. patent 4,740,263. One of the most effective methods is that of chemical vapor deposition which comprises activating a gaseous mixture of a carbon containing gas mixture, usually methane and hydrogen, the activation being by a 20 varie~y of mechanisms such as microwave discharge (see U.S. patent 4,434,188), by dual ion beam activation of a methane/argon milcture (see U.S. patent 4,490,229), b~ use of a hot filament which may be comprised of tungsten (see U.S. patent 4,740,263~, or by any variety of thermal 25 techniques using heat, electron beam, light, DC
discharge, AC glow discharge, DC arc discharge, to excite a gas containing an organic compound (see U.S. patent 4,816,286). The substrates for deposition of diamond films have usually been quartz and silicon. None of 30 these techniques directly produce a free-standing diamond film because of its adherence to the substrate which is important to the nucleation process of the diamond film.
To obtain a free-standing diamond film, the prior art has conventionally turned to slicin~ of bulk 35 diamond crystals (natural or synthetic) which has proved - 2 - ~ ~5U4~i~

to be costly and difficult, especially for thin films.
The mechanical stress of such cutting as well as the induced thermal effects, cause stress which leads to cracking or shattering of the diamond crystals.
Another technique used by the prior art to obtain a free-standing film is that ~f extensive chemical/physical etching of silicon substrates after the chemical vapor deposition process is completed.
Essentially, the film and substrate are tipped over and the substrate removed by application of a strong acid which etches away the silicon substrate over an extremely long period of time. This process is complicated and time-consuming, and subjects the diamond film to thermal stress which leads to cracking or shattering.
Although the above represents known techniques for removing diamond from substrates upon which they have been deposited, there has been some attempt by the prior art to remove substrates from nondiamond films. In U.S.
patent 4,250,148, silicon ribbons, deposited on metal foil, were separated by stress developed after cooling;
in U.S. patent 4,537,651, a germanium semiconductor material was deposited on a salt (sodium chloride) substrate, which substrate was melted by an electron beam and the molten salt drawn away by the capillary action of another wettable material (such as a tungsten support).
Such techniques for nondiamond films have traditionally held out little hope with respect to diamond films which must be deposited on substrates which withstand chemical vapor at the extremely high temperatures of the deposition process itself and therefore are not readily removed at temperatures below which diamond is converted to graphite (1000-1200C).

SummarY of the Invention The invention is a method of fabricating - 3 - ~ 5~i free-standing diamond films for a large variety of applications, but is of particular interest to the automotive industry where ultra-thin diamond films may have potential use in finishes for chip resistance and in windshield coatings to prevent grit streaking from wipers. The method comprises (a) depositing and adhering diamond particles by hot ilament chemical vapor deposition onto a substrate selected to be meltable at a temperature slightly in excess of the temperature of the substrate during deposition; and (b) prior to cooling said diamond particles, increasing the substrate temperature to melt at least a portion of the substrate while permitting such melt to emigrate from the diamond particles.
It is preferable to utilize a small diameter hot filament (about .0010~) which is particularly comprised of tantalum or rhenium to facilitate such small diameter filaments; with such small diameter filament, deposition can be carried out at higher rates and with little destructive radiation effects upon the substrate or diamond film, the rates being in the range of 2-5 microns per hour.
Preferably, the parameters of the hot filament chemical vapor deposition comprise evacuating the deposition chamber to 1-100 Torr, activating the filament by an AC current without electrical bias to a temperature greater than 1900C, separately but simultaneously heating the substrate to a temperature in the range of 600-950C, flowing a carbon carrying gas mixture through the chamber at a rate of about 100-200 sccm, selecting the carbon carrying gas mixture to consist of virtually any hydrocarbon (typically methane, acetylene, or methanol) in combination with hydrogen gas, the hydrocarbon constituting .2-2% by volume of the gas mixture along with a limited amount of carbon monoxide to - 4 - ~ ~5~

favorably suppress the formation of graphite (the C0 being limited to restrict the oxygen/carbon ratio to .5-1.0), and, lastly, the time period for the chemical vapor deposition being adjusted to obtain the desired film thickness given the deposition determined by the conditions described.
Preferably, the substrate is a material that has a melting point about 50-300C in excess of the deposition temperature during hot filament chemical vapor deposition. Such substrate is preferably selected from the group consisting of copper, gold, beryllium, manganese, Al~Fe, Al/Cu, and Ni/Sn, and nonmetals consisting of A12F3, CdF2, or CrF2. Preferably, the period for melting the substrate is in the range of five minutes to two hours and the melt is emigrated either by tilting the substrate and allowing it to drain by gravity or by absorbing the melt into a support screen therebelow.
A second aspect o~ this invention is to continuously form a ribbon of free-standing diamond film, the method comprising: ~a) rotating a metallic drum constituted of a metal having a melting temperature greater than the melting temperature of the substrate for diamond deposition; (b) introducing molten substrate material to be carried by the rotating drum outer surface at a first position about the drum axis, the substrate material being meltable at a temperature slightly in excess of its temperature during deposition of the diamond crystals; (c) at a second location about such axis, where the substrate material has solidified thereon, depositing polycrystalline diamond particles by hot filament chemical vapor deposition while heating the drum in the region of such deposition to promote crystallization; and (d) at a third location about the axis, where the deposited polycrystalline diamond ~ 5 ~ .9 particles have merged to form a continuous film adhered to the solid substrate material, heating the substrate to at least its melting temperature, facilitating disadherence of the substrate material from the polycrystalline diamond film and permitting the diamond film to separate from the coated drum as a continuous diamond ribbon. If necessary, such continuous method may utilize a mechanical tongue to encourage the separation of the ribbon from the drum and the drum itself is contoured with a peripheral trough in its outer surface to contain the molten substrate material during the rotation of the drum. The surface tension inherent to the molten substrate material may be sufficient that it will remain as a li~uid film on the drum, thus eliminating the need for collection and recirculation of the material.

Brief Description of the Drawinas The novel features of the invention are set forth with particularity in the appended claims. The invention itself, however, both as to its organization and method of operation, together with further objects and advantages thereof, may best be understood by reference to the following description taken in conjunction with the accompanying drawings, in which:
Figure 1 is a schematic illustration of the overall apparatus used to carry out the method of this invention relating to batch deposition;
Figure 2 is a schematic illustration of a heated 3~ substrate during the melting step using gravit~ to withdraw che substrate melt;
Figure 3 is an alternative schematic illustration of another mannerism for emigrating the substrate melt using an absorbent mesh;
Figure 4 is a central sectional elevational view - 6 - ~ 5 ~

of an apparatus for carrying out the continuous aspect of this invention; and Figure S is a sectional view, taken substantially along line 5-5 of Figure 4.

Detailed Descrietion and Best Mode As shown in Figure 1, an apparatus for carrying out this invention in a hatch mode includes a reactor assembly 10 having a reaction chamber 11 within which is positioned a heater component 12 effective to act as a support for a substrate 13 upon which diamond films 14 are to be deposited. In the chamber is a filament 15 effective to activate the gaseous mixture which is introduced to the chamber 11 surrounding the substrate and filament. The gas mi~ture is introduced preferably by a common inlet 16 which draws pure hydrogen from a cylinder 17 and a carbon carrying gas in H2 from a cylinder 18. The carbon carrying gas may be methane, acetylene, or methanol and is restricted to a percentage of about .2-2.0~ by volume of the misture. The gases flow from their cylinders and are admitted by way of on-off valves 19, 20 and electronic mass flow controllers 21, 22 which regulate the flow to a desired flow rate, which is in the range of 0-200 sccm. The pressure of the reaction chamber is controlled by use of a vacuum pump 23 which is in turn controlled by use of a pressure control valve 24 operated in response to the degree of vacuum indicated by the gage. The pressure is preferably maintained within the range of 1-100 Torr and optimally 30 i8 regulated to about 50 Torr. The gas misture additionally will contain a small amount of oxygen compound such as carbon monoxide which is introduced to the misture in a strictly controlled amount so that the osygen to carbon ratio is .5-1Ø
The conditions for stimulating the nucleation of - 7 ~ 5~

polycrystalline diamond particles include a temperature for the filament 15 of at least 1900C, the absence of an electrical bias, a temperature for the substrate 13 in the range of 600-950C, and a deposition time in the range of three minutes to four hours depending upon the desired thickness of the diamond particles 14.
The filament 15 itself is preferably of a small diameter wire of about .005-0.02a inches and is constituted of tantalum or rhenium permitting long operation lifetimes at high temperature. A small diameter hot filament limits the destructive effects of radiation on the substrate and particles and permits hot filament activation to effect a greater number of gas molecules. Hot filament chemical vapor deposition is desired for this invention because it permits an extremely high rate o~ diamond deposition in the range of 2-5 microns per hour while facilitating the unique separation concept herein.
The filament 15 is spaced from the substrate a distance within the range of 3/16 inch, plus or minus 1/16 inch. It is supplied with electrical current from a power supply which senses the light emitted by the filament through a pyrometer 29.
The heater 12 supporting the substrate 13 is preferably comprised of a molybdenum metal shell within which is embedded a series of resistance wires (powered from an electrical supply 30 controlled by a temperature control 30a) that will permit the surface temperature and therefore the substrate temperature to be raised to the critical range of 600-950C during chemical vapor deposition. Such heater must also be capable of selectively raising the substrate even further to a range of 50-300C above the deposition temperature of the diamond particles, which is usually in the range of 1000-1100C. Raising the temperature of the substrate to ~S~aS~;

this elevated range facilitates the melting of the substrate or at least melting a portion thereof which will quickly separate from the diamond film due to the high thermal expansion difference between the solid diamond film and the fluidized substrate material.
To carry out hot filament chemical vapor deposition within this invention, the substrate 13 must be a material selected with a melting temperature that is slightly in excess of the deposition temperature of the substrate during chemical vapor deposition. This typically will be a material that has a melting point 50-300C in excess of the deposition temperature and thus in the range of 950-1000C. Metals which meet this criteria include copper, gold, beryllium, manganese, aluminum/iron, aluminum/copper, nickel/tin, and includes nonmetal such as A12F3, CdF2, or CrF2. Each of these materials have high differential thermal expansion characteristics when compared to diamond particles. Each of these materials are also stable at the chemical vapor deposition temperature.
The support for the substrate is a material that has a melting temperature in e~cess of those of the substrates used and is preferably molybdenum.
The method for carrying out the steps with the apparatus in Figure 1, comprise: (a) depositing adhering polycrystalline diamond particles by hot filament chemical vapor deposition onto a substrate, the substrate being meltable at a temperature slightly in e~cess of the temperature of the substrate attained during chemical vapor deposition; and (b) prior to cooling the diamond films, increasing the temperature of the substrate to melt at least a portion thereof while permitting the melt to emigrate from the diamond films.
Emigration may be facilitated by tilting the supporting molybdenum heater, as shown in Figure 2, an angle 30 of about 30, allowing the melt 31 to flow to one side and be collected in a trough 32. The polycrystalline diamond film 14 will immediately detach from the melted substrate (i.e., copper) and remain on the heated support 12 resulting in a free-standing film of diamond.
Alternatively, the support may additionally comprise a molybdenum mesh fabric 33 secured to the top surface of the heater 12, the mesh ~abric having a multiple of interstices 34 into which the melted substrate 13 (i.e., copper) emigrates as shown i~ Figure 3. In this alternative situation, the entire amount of copper need not be raised to the same high temperature since slight fluidation of the copper will cause it to be absorbed by capillary action into the molybdenum fabric 33.

Cohtinuous Ribbon As shown in Figures 4-5, the apparatus may be alternatively constructed to possess a metallic drum 35 rotatable about an axis 36, the drum being constituted of a metal having a melting temperature in excess of the substrate material itself (such as molybdenum). The drum is supported for rotation within a closed treatment chamber 37 which has an inlet 38 for introducing a carbon carrying gaseous mixture, ports 39 for the admittance of electrical connectors to the various heaters 60, 61, 62 for carrying out the procsss within the chamber, and a port 40 for evacuating the chamber.
Molten substrate material 41 ~such as copper) is introduced such as by being poured from a spout onto the rotating drum at a first position 42 about the drum axis 36, preferably at a two o'clock position as shown in Figure 4. As the molten copper engages the outer surface of the rotating drum ~in the counter-clockwise direction), the copper will be solidified rapidly creating a copper ribbon 43 which is rotated past the chemical vapor deposition station 44 located essentially at a 12 o'clock position with reference to the rotating drum. At this station, a heater 45 (powered by supply 61~ beneath the rotating drum raises the temperature of the solidified copper ribbon to a temperature in the range of 900-1000C and the hot ilament 46 (powered by supply 60) is energized to its desirable temperature greater than 1900C (as in the apparatus embodiment for the batch mode) an~ is constituted of similar filament material. The gaseous mixture admitted to chamber contains the same type of gas mixture which preferably contains methane acetylene or methanol in an amount of .2-2% by volume of the gas mixture, the remainder being essentially hydrogen with a small amount of carbon mono~ide.
The solid copper ribbon 43 with the deposited ribbon 47 of polycrystallin~ diamond particles thereon is then carried to a third position 48 relative to the axis of the rotating drum (such as at a position of about nine o'clock) where the substrate is heated to its melting temperature (50-300 in excess of the chemical vapor deposition temperature) by another heater 49 (powered by supply 62) facilitating immediate disadherence of the substrate ribbon 43 from the diamond particles and permitting the fluidized substrate material to drip at 50 (emigrate) into a collecting tube 51 for immediate return to the molten supply of substrate material from which this process started. ~he now free-standing ribbon 52 of diamond is encouraged to be separated by a mechanical tongue 53 so as to be appropriately segregated or coiled as a film for ultimate use to be subsequently assembled or fabricated onto some component.
As shown in Figure 5, the rotating drum 35 may have defined therein a trough 54 in its outer surface 55 to contain the molten substrate material as it is introduced to the drum for chilling. The depth of the trough determines the thickness of the meltable substrate material; such trough dep~h should be preferably in the range of 1/2-1/8 inch.

While particular embodiments of the invention have been illustrated and described, it will be obvious to those skilled in the art that various changes and modifications may be made without departing from the invention, and it is intended to cover in the appended claims all such modifications and equivalents as fall within the true spirit and scope of this invention.

Claims (15)

1. A method of fabricating free-standing diamond films, comprising (a) depositing and adhering polycrystalline diamond film by hot filament chemical vapor deposition onto a substrate meltable at a temperature slightly in excess of the deposition temperature; and (b) prior to cooling said polycrystalline diamond films, increasing the substrate temperature to melt at least a portion thereof while permitting such melt to emigrate from the diamond films.
2. The method as in claim 1, in which step (a) is carried out at a diamond film deposition rate in the range of 2-5 microns per hour.
3. The method as in claim 1, in which said hot filament chemical vapor deposition is carried out with a hot filament at a temperature greater than 1900°C, supplied by an alternating current without electrical bias and spaced from the substrate a distance in the range of 3/16 inch, plus or minus 1/16 inch, the substrate being heated to a temperature in the range of 600-950°C, and the carbon carrying gas and hydrogen mixture for said chemical vapor deposition being introduced at a rate of 100-200 sccm.
4. The method as in claim 3, in which the gas mixture for said hot filament chemical vapor deposition is comprised of a carbon carrying gas selected from the group consisting of methane, acetylene, and methanol, said selected gas being present in the gas mixture in an amount of .2-2% by volume and the remainder of said gas being hydrogen and a small amount of carbon monoxide.
5. The method as in claim 4, in which the carbon monoxide is present in said gas mixture in an amount so that the ratio of oxygen to carbon is restricted to .5-1Ø
6. The method as in claim 5, in which the hot filament chemical vapor deposition step is carried out within a time period of three minutes to four hours.
7. The method as in claim 1, in which the substrate material is selected to have a melting temperature which is 50-300°C in excess of the chemical vapor deposition temperature of said substrate.
8. The method as in claim 1, in which the substrate material is selected from the group consisting of copper, gold, beryllium, manganese, aluminum/iron, aluminum/copper, and nickel/tin, and from nonmetals including A12F3, CdF2, CrF2.
9. The method as in claim 1, in which step (b) is carried out within a time period of five minutes to two hours
10. The method as in claim 1, in which step (b) emigrates the substrate material therefrom by use of gravity and tilting of the support for the substrate material.
11. The method as in claim 1, in which in step (b) the melt is emigrated therefrom by use of a screen fabric acting as a support thereof, which screen support absorbs the melt by capillary action during step (b), said screen being constituted of a material having a higher melting temperature than said substrate material.
12. A method of continuously fabricating ribbons of free-standing polycrystalline diamond films, comprising:
(a) rotating a metallic drum constituted of a metal having a melting temperature in excess of a substrate material to be deposited thereon;
(b) introducing said substrate material in a molten form to the rotating drum outer surface at a first position about the drum axis;
(c) at a second location about said drum axis, where said substrate material has solidified thereon, depositing polycrystalline diamond films by hot filament chemical vapor deposition while heating said drum in the region of deposition to the temperature range of 600-950°C; and (d) at a third location about said axis, where the deposited polycrystalline diamond particles have adhered to the solid substrate material, heating said substrate to its melting temperature facilitating disadherence of the substrate material from the polycrystalline diamond film and thereby permitting the diamond particles to separate as a continuous ribbon of free-standing diamond films.
13. The method as in claim 12, in which said drum is rotated at a speed about one inch per hour circumference velocity.
14. The method as in claim 12, in which in step (d) said separation is facilitated by mechanically using a tongue for said separation.
15. The method as in claim 12, in which in step (b) said drum is contoured with an annular trough to receive and contain the molten substrate material during solidification.
CA002050456A 1990-10-29 1991-08-30 Fabrication of polycrystalline free-standing diamond films Abandoned CA2050456A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/604,692 1990-10-29
US07/604,692 US5183529A (en) 1990-10-29 1990-10-29 Fabrication of polycrystalline free-standing diamond films

Publications (1)

Publication Number Publication Date
CA2050456A1 true CA2050456A1 (en) 1992-04-30

Family

ID=24420629

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002050456A Abandoned CA2050456A1 (en) 1990-10-29 1991-08-30 Fabrication of polycrystalline free-standing diamond films

Country Status (2)

Country Link
US (1) US5183529A (en)
CA (1) CA2050456A1 (en)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310512A (en) * 1990-11-15 1994-05-10 Norton Company Method for producing synthetic diamond structures
JP3028660B2 (en) * 1991-10-21 2000-04-04 住友電気工業株式会社 Manufacturing method of diamond heat sink
JPH0558785A (en) * 1991-08-30 1993-03-09 Sumitomo Electric Ind Ltd Diamond film and method for synthesizing the same
US5536193A (en) 1991-11-07 1996-07-16 Microelectronics And Computer Technology Corporation Method of making wide band gap field emitter
US5543684A (en) 1992-03-16 1996-08-06 Microelectronics And Computer Technology Corporation Flat panel display based on diamond thin films
US5763997A (en) 1992-03-16 1998-06-09 Si Diamond Technology, Inc. Field emission display device
US6127773A (en) 1992-03-16 2000-10-03 Si Diamond Technology, Inc. Amorphic diamond film flat field emission cathode
US5675216A (en) 1992-03-16 1997-10-07 Microelectronics And Computer Technololgy Corp. Amorphic diamond film flat field emission cathode
US5449970A (en) 1992-03-16 1995-09-12 Microelectronics And Computer Technology Corporation Diode structure flat panel display
US5686791A (en) 1992-03-16 1997-11-11 Microelectronics And Computer Technology Corp. Amorphic diamond film flat field emission cathode
US5679043A (en) 1992-03-16 1997-10-21 Microelectronics And Computer Technology Corporation Method of making a field emitter
US5443032A (en) * 1992-06-08 1995-08-22 Air Products And Chemicals, Inc. Method for the manufacture of large single crystals
US5314652A (en) * 1992-11-10 1994-05-24 Norton Company Method for making free-standing diamond film
US6068070A (en) * 1997-09-03 2000-05-30 Baker Hughes Incorporated Diamond enhanced bearing for earth-boring bit
US6209185B1 (en) 1993-04-16 2001-04-03 Baker Hughes Incorporated Earth-boring bit with improved rigid face seal
US5423475A (en) * 1993-10-06 1995-06-13 Westinghouse Electric Corporation Diamond coatings for aluminum alloys
CA2172803A1 (en) 1993-11-04 1995-05-11 Nalin Kumar Methods for fabricating flat panel display systems and components
US5397396A (en) * 1993-12-27 1995-03-14 General Electric Company Apparatus for chemical vapor deposition of diamond including thermal spreader
RU95106478A (en) * 1994-04-29 1997-01-20 Моторола Arrangement and method for degradation of chemical compounds
US5527559A (en) * 1994-07-18 1996-06-18 Saint Gobain/Norton Industrial Ceramics Corp. Method of depositing a diamond film on a graphite substrate
US6204834B1 (en) 1994-08-17 2001-03-20 Si Diamond Technology, Inc. System and method for achieving uniform screen brightness within a matrix display
US5531880A (en) * 1994-09-13 1996-07-02 Microelectronics And Computer Technology Corporation Method for producing thin, uniform powder phosphor for display screens
US5628659A (en) * 1995-04-24 1997-05-13 Microelectronics And Computer Corporation Method of making a field emission electron source with random micro-tip structures
US6296740B1 (en) 1995-04-24 2001-10-02 Si Diamond Technology, Inc. Pretreatment process for a surface texturing process
JP3737221B2 (en) * 1996-09-06 2006-01-18 英樹 松村 Thin film forming method and thin film forming apparatus
JP3619058B2 (en) * 1998-06-18 2005-02-09 キヤノン株式会社 Manufacturing method of semiconductor thin film
US7148079B1 (en) 2002-11-01 2006-12-12 Advanced Micro Devices, Inc. Diamond like carbon silicon on insulator substrates and methods of fabrication thereof
US7833581B2 (en) * 2006-09-11 2010-11-16 The Hong Kong University Of Science And Technology Method for making a highly stable diamond film on a substrate
ITMI20112273A1 (en) * 2011-12-15 2013-06-16 St Microelectronics Srl METHOD FOR THE PRODUCTION OF A SLICE OF SILICON CARBIDE AND ITS EQUIPMENT
CN103276265B (en) * 2013-06-09 2015-04-01 北京科技大学 Method for preparing free-standing diamond film-diamond particles-metallic composite material
CN104465341B (en) * 2014-12-05 2017-05-17 北京科技大学 Method for forming P-N junction in selected region on surface of diamond film through diffusion
CN105695831B (en) * 2016-03-21 2017-10-31 中南大学 A kind of continuous diamond framework enhancing composite of super-high heat-conductive and preparation method
US10475673B2 (en) 2016-09-28 2019-11-12 Stmicroelectronics S.R.L. Apparatus for manufacturing a silicon carbide wafer
CN108396308B (en) * 2018-05-03 2023-06-09 广东鼎泰高科精工科技有限公司 CVD diamond coating equipment with a plurality of hot wire devices
US11309177B2 (en) 2018-11-06 2022-04-19 Stmicroelectronics S.R.L. Apparatus and method for manufacturing a wafer
IT201900015416A1 (en) 2019-09-03 2021-03-03 St Microelectronics Srl APPARATUS FOR GROWING A SLICE OF SEMICONDUCTOR MATERIAL, IN PARTICULAR SILICON CARBIDE, AND ASSOCIATED MANUFACTURING PROCESS
JP7440346B2 (en) * 2020-06-01 2024-02-28 株式会社アルバック Manufacturing method and manufacturing device for energizing heating wire

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4250148A (en) * 1978-07-18 1981-02-10 Motorola, Inc. Apparatus and method for producing polycrystalline ribbon
US4345967A (en) * 1980-03-04 1982-08-24 Cook Melvin S Method of producing thin single-crystal sheets
US4308028A (en) * 1980-04-14 1981-12-29 Elkins Carlos D Device and method for the chemical testing and microscopic examination of liquid specimens
US4323419A (en) * 1980-05-08 1982-04-06 Atlantic Richfield Company Method for ribbon solar cell fabrication
US4303463A (en) * 1980-09-29 1981-12-01 Cook Melvin S Method of peeling thin films using directional heat flow
US4537651A (en) * 1981-05-22 1985-08-27 United Technologies Corporation Method for removing semiconductor layers from salt substrates
US4434188A (en) * 1981-12-17 1984-02-28 National Institute For Researches In Inorganic Materials Method for synthesizing diamond
JPS60221395A (en) * 1984-04-19 1985-11-06 Yoshio Imai Manufacture of diamond thin film and its use
US4490229A (en) * 1984-07-09 1984-12-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Deposition of diamondlike carbon films
WO1987003307A1 (en) * 1985-11-25 1987-06-04 Showa Denko Kabushiki Kaisha Process for synthesizing diamond
US4935303A (en) * 1987-10-15 1990-06-19 Canon Kabushiki Kaisha Novel diamond-like carbon film and process for the production thereof
JPH01111707A (en) * 1987-10-22 1989-04-28 Seiko Instr & Electron Ltd Production of fine diamond particles
JP2610505B2 (en) * 1988-12-15 1997-05-14 東洋鋼鈑株式会社 Gas phase synthesis of diamond

Also Published As

Publication number Publication date
US5183529A (en) 1993-02-02

Similar Documents

Publication Publication Date Title
US5183529A (en) Fabrication of polycrystalline free-standing diamond films
US4740263A (en) Process for preparing thin film and p-type diamond semiconductor
US4421592A (en) Plasma enhanced deposition of semiconductors
US4237150A (en) Method of producing hydrogenated amorphous silicon film
US4846926A (en) HcCdTe epitaxially grown on crystalline support
JP4574852B2 (en) Method for growing SiC single crystal
RU2160327C2 (en) MONOCRYSTAL SiC AND METHOD OF ITS PRODUCTION
EP0272418B1 (en) Apparatus and process to condensate diamond
JPH05132665A (en) Method and apparatus for manufacturing diamond grit and abrasive medium
CA2185217A1 (en) Process to produce diamond films
EP0348026B1 (en) Diamond growth on a substrate using microwave energy
EP0687753A1 (en) A synthesis process of diamond, synthesis apparatus and synthetic diamond
JP3491436B2 (en) Method for producing silicon carbide single crystal
US4255463A (en) Method of deposition of silicon in fine crystalline form
JPH08151295A (en) Production of substrate for vapor synthesis of single crystal diamond film
JPS6156162B2 (en)
US7022191B2 (en) Method of crystallizing amorphous silicon layer and crystallizing apparatus thereof
JP2978023B2 (en) Manufacturing method of synthetic diamond film
WO1994016125A1 (en) Process for vapor-phase diamond synthesis
GB1569652A (en) Manufacture of silicon rods or tubes by deposition
US4609424A (en) Plasma enhanced deposition of semiconductors
JPH0748200A (en) Production of single crystal
EP1090167B1 (en) Process and apparatus for preparation of silicon crystals with reduced metal content
Münzinger et al. Growth of homoepitaxial diamond films on superpolished substrates in a pulsed microwave plasma
EP0179851A1 (en) A METHOD OF SYNTHESIZING THIN, SINGLE CRYSTAL LAYERS OF SILVER THIOGALLATE (AgGaS2).

Legal Events

Date Code Title Description
EEER Examination request
FZDE Discontinued