CA2034738A1 - Intrinsically conductive moulding compound - Google Patents

Intrinsically conductive moulding compound

Info

Publication number
CA2034738A1
CA2034738A1 CA002034738A CA2034738A CA2034738A1 CA 2034738 A1 CA2034738 A1 CA 2034738A1 CA 002034738 A CA002034738 A CA 002034738A CA 2034738 A CA2034738 A CA 2034738A CA 2034738 A1 CA2034738 A1 CA 2034738A1
Authority
CA
Canada
Prior art keywords
matrix polymer
process according
catalyst
monomers
intrinsically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002034738A
Other languages
French (fr)
Inventor
Ronald M. A. M. Schellekens
Hans K. Van Dijk
Marcus J. H. Bulters
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke DSM NV
Original Assignee
Stamicarbon BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL9000321A external-priority patent/NL9000321A/en
Application filed by Stamicarbon BV filed Critical Stamicarbon BV
Publication of CA2034738A1 publication Critical patent/CA2034738A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F6/00Post-polymerisation treatments
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124Intrinsically conductive polymers
    • H01B1/127Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides

Abstract

(9) AE 6612 A B S T R A C T

The invention relates to a process for the preparation of an intrinsically conductive moulding compound obtained by in situ polymerization of monomers which form an intrinsically conductive polymer after polymerization, in the presence of a matrix polymer and a catalyst, the matrix polymer being dissolved in an essentially solvent free monomer, after which the solution obtained is brought into the desired form and the monomers are polymerized in situ in the presence of a catalyst.
Moulding compounds obtained with the process according to the invention can be used in batteries, electronic components (diodes, transistors), electrical wiring, coatings and in EMI-shielding attributes.

Description

2 ~ 3 ~

CJS/LLB/Alli/ag (6205) -1- (9) AE 6612 INTRINSICALLY CONDUCTIVE MOULDING COMPOUND

The invention relates to a process for the preparation of an intrinsically conductive moulding compound obtained by in situ polymerization of monomers which form an intrinsically conductive polymer after polymerization, in the presence of a matrix polymer and a catalyst.
Suoh a process is known from EP~ 314311. In the process according to this patent specification a thermo-plastic matrix polymer is dissolved in a solvent, afterwhich the solution is brought into a desired form and then gelled. Next, acetylene gas and a catalyst solution are added. The acetylene is polymerized to polyacetylene, following which an intrinsically conductive moulding compound is obtained after dvping. The moulding compound has to be subjected to several additional treatments, for instance for removal of the solvent and the catalyst.
A drawback of the process as described in EP-A-314311 is the use cf large quantities of solvent Eor the matrix polymer. ~his solvent, for instance decalin, has to be removed from the ultimate moulding compound with an extra treatment. The solvent thus has an adverse effect on ; the speed of the manufacturing process.
The object of the invention is to provide a process for the preparation of an intrinsically conductive moulding compound which possesses good conductive properties in combination with excellent dimensional stability, in which no separate solvent for the matrix polymer is used.
The process according to the invention is characterized in that the matrix polymer is dissolved in an essentially solvenk free monomer, after which the solution obtained is brought into the desired form and the monomers are polymerized in situ in the presence of a catalyst.

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~ C3 -2- (9) AE 6612 By an essentially solvent free monomer is meant a liquid in which more than 90 wt.% monomers and/or oligomers is present, preferably more than 95 wt.~, more in particular more than 98 wt.%.
The invention is particularly effective if the monomers, which will orm an intrinsically conductive polymer after polymerization, are chosen from the group:
pyrrole, thiophene, benzene, furan, aniline and derivatives of these monomers. More in particular pyrrole and/or thiophene. Pyrrole and thiophene as monomers are already liquid at room temperature, which considerably simplifies processing with the process accordiny to the invention.
The process according to the invention is not restricted to the use of one monomer, combinations of monomers being also possible. Combinations of pyrrole and substituted pyrrole are effective for instance. ~he essentially solvent free monomer phase preerably contains at least one heterocyclic aromatic.
~; Any polymer which is soluble in the essentially solvent free monomer can in principle be chosen as matrix polymer. The matrix polymer is required in order to effectuate the shaping of an intrinsically conductive moulding compound. Moreover, the coherence of the moulding compound is highly improved. Examples of suitable matrix ~ polymers are: poly(vinyl alcohol); polyethylene, for }~ instance UHMWPE (ultrahigh molecular weight polyethylene);
poly(ethylene oxide); poly(vinyl acetate); polystyrene and the like. Mixtures of these polymers are also suitable The ~ ~ molecular weight depends on the chosen matrix polymer and ¦ ~ the application, but is preferably at least 100,000 ( ~). In ~ particular at least 500,000, more in particular at least ! ~ l,ooo,ooo g/mol.
The quantity of matrix polymer added in part~ by weight preferably is less than the quantity of monomers. By preference the quantity of matrix polymer is less than 40%
of the quantity of monomers. In particular less than 25%.
Higher concentrations of matrix polymer may result in lower . ~ .

(~,. , :

, ~ . . : ~ - . . .

'I ~ ' .' ' ' --3-- t 9 ) AE 6612 conductivity of the ultimate moulding compound.
An important parameter for the optimum concentration of the matrix polymer is the molecular weight ( ~) and the degree of branching of the matrix polymer. If the matrix polymer is high molecular (for instance > 1,000 kg/mol) and linear, concentrations of 0.2 wt.% are already sufficient. If the matrix polymer is high molecular but branched, the optimum concentration will be more than 2 wt.%. By preference a high molecular, substantially unbranched matrix polymer is used.
The quantity of matrix polymer is also dependent on the desired final product. If a moulding compound is wanted, with a surface that is free during the processing, then the quantity of added matrix polymer will depend on the processability of the solution. Examples of such moulding compounds are fibres, tapes, sheets, films and the lilce. The processability of the mixture obtained after addition of a catalyst will have to be sufficient to allow of manufacture of a wire of at least 5 mm at a stretching rate of 500 mm/min. Preferably 7 mm, more in particular 10 mm.
Determination of the processability in such a way is ~ described in ~ammann G., Tampke R., z. Anorg. Allg. Chemie, 1 25 Bd. 162 (1927), pp. 1-16.
If desired, polymers other than the matrix polymer, ionomers and/or fillers may be added to the essentially solvent free monomer up to a concentration of 60 wt.%. The addltion may be e~fected prior to, during or after dissolving of the matrix polymer in the essentially solvent free monomerO Polymers to be added are for instance elastomers, like, for example EPDM-rubbers; ionomers to be added are for instance copolymers of ethylene and ~, ; methacrylic acid. Such ionomers are preferably added if the desired inal product is a film. Examples of fillers to be : added are talcum, kaolin, wollastonite, glass.
! ` Other additives, which are allowed to be added to the essentially solvent free monomer (up to 60 wt.%), are, for instance, flameproofing agents or flame retardants, .

, ' ~ '' .~ ' :' ' ~1 ~J~ 7 3 ~
-4- (9) AE 6612 pigments, antioxidation agents, stabilizing agents and the like.
The catalyst added for initiation of the polymerization preferably is a salt comprising a transition metal, in particular Fe, Co, Ru, Cu or Sn, and a halogen.
Particularly effective is an iron~III)chloride solution in water or tin(IV)chloride~ If a catalyst solution is used, a quantity of matrix polymer may be mixed with the catalyst solution prior to addition of the catalyst solution in order to enhance the miscibility of the catalyst solution with the monomer mixture.
The catalyst is preferably added during or after the shaping of the mixture. ~owever, it is also possible to block the catalyst, so that a latent catalyst is obtained, which is added prior to the shaping and becomes active after deblocking. The catalyst is preferably added in an excess quantity.
~0 It has been found that the process according to the invention provides a moulding sompound which possesses very good conductive properties. Using the process according to the invention makes it possible to produce moulding compounds with a conductivity of at least 0.1 S/cm. The method according to the invention lends itself eminently for continuous manufacture of fibres and films. With the process according to the invention, moulding compounds are very easy to handle for stretching during moulding. Such moulding compounds are by preference additionally afterstretched, which can give improved mechanical and conductive properties as well as improved dimensional stability. Working without a separate solvent for the matrix polymer means that the number of required processing steps is reduced.
A~ter forming of the end product and polymerization of the monomer mixture, catalyst residues can be removed by extraction if desired. It is also possible, in addition, to deform, for instance stretch, the end product mechanically ~ before or after extraction, which can give improved j mechanical and conductive properties.

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-5- (9) AE 6612 Depending on the intrinsically conductive polymer obtained, the process according to the invention may be extended with a doping step after polymerization. The doping may be either oxidative or reductive, with utilization of known doping reagents and techniques, which are summarized in the 'Handbook of conducting polymers', by T.A. Skotheim (Marcel Dekker Inc., New York, USA (1986)~.
A pre~erred embodiment of the process according to the invention is characterized in that (a~ a matrix polymer is dissolved in the monomer, the quantity of matrix polymer relative to the monomer being at most 95 wt.%;
(b) the mixture obtained is then brought into the desired form;
(c) the monomers are polymerized in the presence of a catalyst, consisting of a salt of a halogen and a transition metal;
(d) this is followed by a doping step, if desired, after which an intrinsically conductive moulding compound is obtained.
The process according to the invention is highly suitable for continuous manufacture of a fibre. To that end, a solution of the matrix polymer in the monomer mixture and a catalyst are brought together in a very short mixing time ; (for example < 5 seconds), after which a fibre is continuously spun from the solution. For the manufacture of a highly conductive fibre, minimum quantities of matrix polymer are used by preference. More in particular less than 15 parts by wt. to 100 parts by wt. monomer.
The conductive properties of a formed end product can be determined by means of so-called four-point measurement. This method is completely described in i 35 EP-A-0314311 and in H.H. Wieder, Laboratory Notes on !, Electrical and Galvanomagnetic Measurements. With this method the specific conductivity is measured:

a = L/A * 1/R, :
'.'~`

? . : .: ~ :

2 ~ 3 ~
-6- (9) AE 6612 in which a = specific conductivity, S/cm;
L = distance between two inner ~lectrodes, in cm;
R = resistance ~= V/I), in ohm, and A = cross-sectional surface, in cm2.

Polyacetylene conducts very well (~ = 1,S x 105 S/cm), but is not commercially practicable owing to the high thermal instability of the polymer~ Polypyrrole and polythiophene are less conductive (0.1~100 S/cm) but are very stable, while their conductivity is suficient for many kinds of applications.
Moulding compounds obtained with the process according to the invention can be used in batteries, electronic components ~diodes, transistors), electrical wiring, coatings and in EMI-shielding attributes.
The process according to the invention will be elucidated with the following examples, without being restricted thereto.
:
Example I
A) 10 g polyvinyl acetate (MV 1,100,000 g/mol) was dissolved at room temperature in 100 mI liquld pyrrole (Merc~)j which before use had been purified once again by means of vacuum distillation. The dissolving took place with continuous stirring. The polymer concentration of the obtained solution (A) was 9.4 wt.~. .
B) A bar (chromium/nickel, diameter 0.2 mm) was stuck into 40 ml of the solution A to a depth of 0.5 mm.
With a constant speed of 500 mm/min the bar was subsequently drawn out of the solution. The wire broke at a length (i.e.
the distance between the tip of the bar and the solution) of 90 mm.
C) Fibres were spun from a part of the solution A.
To that end the solution was introduced into a cylinder. By means of a piston coupled to a motor with a variable speed l of rotation the solution was pressed through a capillary ~!
:,~

~ ~ .

~7~ 3 &
--7-- ( 9 ) AE 6612 (diameter 0,5 mm) with a flow rate of 130 ml/h, at a temperature of 21C. It appeared to be possible to wind the spun filament onto a bobbin with winding rates between 3.6 and 54 m/min. The distance between the spinning capillary and the bobbin was 15 cm.
D) A second solution ~B) was obtained by dissolving 90 g FeCl3.6 H2O in 100 ml water at room temperature. With a spreading knife (opening 0.5 mm) 28.2 g of solution A was spread out on a MylarR film (polyethylene/terephthalate film). A liquid film of 0.5 * 50 * 50 mm was obtained. The liquid film was immediately submerged in 38 ml of solution ~. The temperature was 21C. The originally transparent film rapidly turned black, indicating the formation of polypyrrole.
After 60 minutes the dimensions of the coherently black film obtained still were 0.5 * 50 * 50 mm. The film was washed with ethanol and then with water and dried.
The conductivity of ~he film determined by means of four-point measurement, was 1.5 S/cm.

Examples II - IV
~.
The procedure of example ID was repeated, but with varying residence time of the liquid film in solution B.
The results are summarized in table 1.

Examples Residence time Specific conductivity (min.) (S/cm) II 10 1.4 III 5 1.1 These examples il~ustrate, that with the process according to the invention intrinsically conductive moulding compounds, which possess good conductive properties, can be obtained. These moulding compounds also have excellent dimensional stability.

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,~
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Claims (9)

1. Process for the preparation of an intrinsically conductive moulding compound obtained by in situ polymerization of monomers, which form an intrinsically conductive polymer after polymerization, in the presence of a matrix polymer and a catalyst, characterized in that the matrix polymer is dissolved in an essentially solvent free monomer, after which the solution obtained is brought into the desired form and the monomers are polymerized in situ in the presence of a catalyst.
2. Process according to claim 1, characterized in that the quantity of matrix polymer relative to the monomer is at most 95 wt.%.
3. Process according to claim 1 or 2, characterized in that the catalyst consists of a salt of a halogen and a transition metal.
4. Process acoording to any one of the claims 1-3, characterized in that the polymerization of the monomers is followed by a doping step.
5. Process according to any one of the claims 1-4, characterized in that from the solution of monomers, matrix polymer and catalyst a filament of at least 5 mm is spun with a drawing rate of 500 mm/min.
6. Process according to any one of the claims 1-5, characterized in that the monomer phase consists of pyrrole, thiophene, benzene, aniline, furan and/or derivatives of said monomers.
7. Process according to any one of the claims 1-6, characterized in that the matrix polymer has a molecular weight (MW) of at least 100,000 g/mole.
8. Process according to any one of the claims 1-7, characterized in that the matrix polymer is substantially unbranched.
9. Fibre, film or moulding compound obtained by means of the process according to any one of the claims 1-8.
CA002034738A 1990-01-24 1991-01-22 Intrinsically conductive moulding compound Abandoned CA2034738A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
NL9000167 1990-01-24
NL9000167 1990-01-24
NL9000321A NL9000321A (en) 1990-02-10 1990-02-10 Intrinsically conductive moulding cpd. prepn. - comprising in-situ polymerisation of monomers in presence of matrix polymer and catalyst, pref. halogen salt and transition metal
NL9000321 1990-02-10

Publications (1)

Publication Number Publication Date
CA2034738A1 true CA2034738A1 (en) 1991-07-25

Family

ID=26646644

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002034738A Abandoned CA2034738A1 (en) 1990-01-24 1991-01-22 Intrinsically conductive moulding compound

Country Status (7)

Country Link
US (1) US5186861A (en)
EP (1) EP0442547B1 (en)
JP (1) JPH04213301A (en)
KR (1) KR910014408A (en)
AT (1) ATE155153T1 (en)
CA (1) CA2034738A1 (en)
DE (1) DE69126716D1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9118599D0 (en) * 1991-08-30 1991-10-16 Moulded Circuits Ltd Manufacturing method for electrical circuit board
US5670742A (en) * 1994-02-04 1997-09-23 Threshold Technologies, Inc. EMI protected aircraft
WO1996014642A1 (en) * 1994-11-04 1996-05-17 Nkt Research Center A/S Semiconducting polymers and methods for the production of these
ES2156664B1 (en) * 1998-03-24 2001-12-01 Fundacion Cidetec THERMOFUSIBLE COMPOUNDS BASED ON POLYPIRROL, PROCEDURE FOR PREPARATION AND USE AS ADHESIVE.
DE10244197A1 (en) 2002-09-23 2004-04-08 Infineon Technologies Ag Composition which forms an electrically conductive lacquer layer and a method for structuring a photoresist using the lacquer layer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4705645A (en) * 1983-11-23 1987-11-10 Gte Laboratories Incorporated Method for preparing an electrically conductive polymer blend
US4604427A (en) * 1984-12-24 1986-08-05 W. R. Grace & Co. Method of forming electrically conductive polymer blends
US4769115A (en) * 1985-08-12 1988-09-06 Kao Corporation Process for preparing electrically conductive polymer
US4617353A (en) * 1985-10-07 1986-10-14 The B. F. Goodrich Company Electrically conductive polymer blend
US4828756A (en) * 1986-11-21 1989-05-09 The Standard Oil Company Electrically conductive composites of polyacetylene and high-nitrile resins and method thereof
JP2534873B2 (en) * 1987-08-05 1996-09-18 東海ゴム工業株式会社 Conductive resin composition
JP2521110B2 (en) * 1987-10-12 1996-07-31 東海ゴム工業株式会社 Method for producing conductive resin composition
JPH0832815B2 (en) * 1988-06-09 1996-03-29 日本石油株式会社 Polymer composition

Also Published As

Publication number Publication date
EP0442547B1 (en) 1997-07-09
US5186861A (en) 1993-02-16
KR910014408A (en) 1991-08-31
DE69126716D1 (en) 1997-08-14
ATE155153T1 (en) 1997-07-15
JPH04213301A (en) 1992-08-04
EP0442547A2 (en) 1991-08-21
EP0442547A3 (en) 1991-10-02

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Legal Events

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FZDE Discontinued