CA2014235A1 - Micropump having a constant output - Google Patents
Micropump having a constant outputInfo
- Publication number
- CA2014235A1 CA2014235A1 CA002014235A CA2014235A CA2014235A1 CA 2014235 A1 CA2014235 A1 CA 2014235A1 CA 002014235 A CA002014235 A CA 002014235A CA 2014235 A CA2014235 A CA 2014235A CA 2014235 A1 CA2014235 A1 CA 2014235A1
- Authority
- CA
- Canada
- Prior art keywords
- pumping chamber
- micropump
- flexible wall
- wall
- stop
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005086 pumping Methods 0.000 claims abstract description 72
- 235000012431 wafers Nutrition 0.000 claims abstract description 69
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 21
- 239000010703 silicon Substances 0.000 claims abstract description 21
- 239000011521 glass Substances 0.000 claims abstract description 20
- 238000005530 etching Methods 0.000 claims abstract description 13
- 238000006073 displacement reaction Methods 0.000 claims abstract description 6
- 239000012530 fluid Substances 0.000 claims description 7
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000012528 membrane Substances 0.000 description 5
- 229910052681 coesite Inorganic materials 0.000 description 4
- 229910052906 cristobalite Inorganic materials 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 229910052682 stishovite Inorganic materials 0.000 description 4
- 229910052905 tridymite Inorganic materials 0.000 description 4
- 239000003814 drug Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 244000045947 parasite Species 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
- F04B43/046—Micropumps with piezoelectric drive
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M2205/00—General characteristics of the apparatus
- A61M2205/02—General characteristics of the apparatus characterised by a particular materials
- A61M2205/0244—Micromachined materials, e.g. made from silicon wafers, microelectromechanical systems [MEMS] or comprising nanotechnology
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M2205/00—General characteristics of the apparatus
- A61M2205/02—General characteristics of the apparatus characterised by a particular materials
- A61M2205/0272—Electro-active or magneto-active materials
- A61M2205/0294—Piezoelectric materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Reciprocating Pumps (AREA)
- Micromachines (AREA)
Abstract
ABSTRACT
A micropump comprising a pumping chamber, an inlet channel communicating with the pumping chamber by an inlet valve and an outlet channel communicating with the pumping chamber via an outlet valve, these elements being manufactured by etching a silicon wafer which is then sealed to glass wafers, the micropump also comprising a piezoelectric wafer to vary the volume of the pumping chamber by bending a wall forming part of the wall of this pumping chamber.
In accordance with the invention the pumping chamber has a stop which determines the amplitude of movement of the flexible wall. The variation in the volume of the chamber caused by the displacement of the flexible wall is precisely defined, thus making it possible to maintain the output of the micropump constant during normal operating conditions.
Figure 7A
A micropump comprising a pumping chamber, an inlet channel communicating with the pumping chamber by an inlet valve and an outlet channel communicating with the pumping chamber via an outlet valve, these elements being manufactured by etching a silicon wafer which is then sealed to glass wafers, the micropump also comprising a piezoelectric wafer to vary the volume of the pumping chamber by bending a wall forming part of the wall of this pumping chamber.
In accordance with the invention the pumping chamber has a stop which determines the amplitude of movement of the flexible wall. The variation in the volume of the chamber caused by the displacement of the flexible wall is precisely defined, thus making it possible to maintain the output of the micropump constant during normal operating conditions.
Figure 7A
Description
- 1 2~ 3~
~IC~OPUMP HAVING A CONSTANT OUTPUT
The present invention relates to a micropump in which at least part of the pump mechanism is made by machining a silicon 05 wafer using photolithographic technology.
Micropumps can be used in particular for the in situ administration of medicaments, the miniaturization of the pump making it possible to implant them permanently in the body.
Using these pumps, small quantities of liquid to be injected can be accurately metered.
Micropumps of this type are in particular described in the article "A piezoelectric micropump based on micromachining of silicon" by H. van Lintel et al. which appeared in Sensors and Actuators, No. 15, 1988, pages 153-157. These micropumps ]5 substantially comprise a stack of three wafers, i.e. a wafer of silicon arranged between two wafers of glass.
The wafer of silicon is etched to form a cavity which, together with one of the glass wafers, defines the pumping chamber, at least one inlet valve and at least one outlet valve enabling the pumping chamber to communicate with one inlet channel and one outlet channel respectively. The part of the glass wafer forming a wall of the pumping chamber can be bent by a control element composed, for example, of a piezoelectric disc. This is provided with two electrodes which, when connected to a source of electrical potential, cause the disc to bend and, S consequently bend the glass wafer, causing a variation in the volume of the pumping chamber. The flexible wall of the pumping chamber can therefore be displaced between a first position, in which it is relatively far from the opposing wall when the piezoelectric disc is not subjected to any electrical potential, ] and a second position in which it is closer to the opposite wall when a potential is applied between the electrodes of the piezoelectric disc.
The micropuMp operates in the following manner. When no electrical potential is applied to the piezoelectric disc, the ]5 inlet and outlet valves are in the closed position. When an electrical potential is applied, the pressure inside the pumping chamber increases, causing the outlet valve to open as soon as the pressure in the chamber is greater than the sum of the pressure in the outlet channel and the pressure created by the pre-tension o~ khe valve. The fluid contained in the pumping chamber is then forced towards the outlet channel by the displacement of the flexible wall from the first position towards the second position. During this phase the inlet valve is kept closed b~ the pressure prevailing in the pumping chamber.
In contrast, the pressure in ~he pumping chamber falls when the electrical potential is reduced. ~his closes the outlet valve as soon as the pressure in the pumping chamber is lower than the sum of the pressure in the outlet channel and the S pressure created by the pre-tension of the valve, and opens the inlet valve as soon as the sum of the pressure in the pumping chamber and the pressure created by the pre-tension of the valve is less than the pressure in the inlet channel. Fluid is then sucked into the pumping chamber via the inlet channel as a ] result of the displacement of the flexible wall from the second position towards the first position.
As has already been stated, these micropumps are used in particular for the administration of medicaments. It is therefore important for the output of the micropump to be well determined so that the medication to be injected can be metered in a very precise manner. However, conventional micropumps have certain defects in this respect.
The output of the micropump depends on the variation in the volume of the pumping chamber between the two positions of the flexible wall. This variation in volume depends on various parameters, including the electrical potential applied to the piezoelectric disc and the physical characteristics of the piezoelectric disc (thickness, diameter, dielectric constant) and of the flexible wall (material, thickness). The same electrical potential applied to seemingly identical micropumps could cause differing bending o~ the pumping chambe~s of these micropumps which would consequently have different outputs.
The output from one and the same micropump could, moreover, also change in the course of time due to ageing of the materials. Finally, the output of the micropump depends on the pressure in the outlet channel, since the outlet valve only 05 opens when the pressure in the pumping chamber is greater than the sum of the pressure in the outlet channel and the pressure created by the pre-tension of the valve.
In the above mentioned article, H. van Lintel et al.
describe a micropump provided with an additional valve which ]0 makes it possible to render the output less dependent on the pressure in the outlet channel. However, this micropump does not overcome the other disadvantages mentioned earlier.
It is the main object of the invention to overcome the above-mentioned disadvantages in order to ensure that the output lS of the micropump is as constant as possible and, in particular, independent of the manufacturing tolerances of the micropump, of the ageing thereof and of the pressure in the outlet channel.
The micropump of the invention comprises a plurality of wafers bonded to one another in a sealed manner in which are formed a pumping chamber defined by two bonded wafers defining a cavity obtained by etching at least one of these wafers, at least one inlet valve and at least one outlet valve enabling the 2 ~
pumping chamber to communicate with one inlet channel and one outlet channel respectively, this micropump comprising in addition a control element for resiliently bending the part of a wafer constituting one wall of the pumping chamber between a 05 first position in which this bent wall is further from the opposing wall of the pumping chamber and a second position in which this wall is relatively close to this opposing wall, the displacements of the flexible wall causing the suction or delivery of a fluid. According to the invention, this micropump ]0 is characterized in that the pumping chamber has a stop which determines the second position of the flexible wall.
This stop limits the movement of the flexible wall towards the opposing wall of the pumping chamber. This makes it possible to define the volume of the pumping chamber in a very precise ]5 manner at the end of the fluid delivery operation.
In addition, the presence of this stop means that it is no longer necessary for the electrical control potential of the piezoelectric disc, or more generally, the intensity of the signal applied to the bending control unit of the flexible wall, to have a precise value. It suffices if this potential is greater than that needed to effect a contact between the stop and the opposing wall of the pumping chamber.
Finally, the stop permits an output substantially independent of the pressure prevailing in the outlet channel since it is possible to impart a high potential to the piezoelectric disc, inducing a high pressure in the pumping 3 ~
chamber which is higher than the sum of the pressure prevailing in the outlet channel in normal conditions of use and the pressure created by the pre-tension of the outlet valve, without this latter being altered by an increase in the amplitude of S movement of the flexible wall which remains fixed by the stop.
This stop can in particular take the form of one or several projections which can be formed on the bottom of the cavity during the etching of the wafer in which this cavity is effected and/or provided by etching, bonding or the like on the flexible wall. The stop can also be simply composed of the bottom of the cavity itself provided the height of the pumping chamber is selected so that it is equal to the desired amplitude of the movement of the flexible wall.
The characteristics and advantages of the invention are better illustrated by the following description, given for purposes of example and which is not limiting, with reference to the accompanying drawings, in which:
- Figure 1A shows a section along the line I-I of a pumping chamber of a micropump according to the invention in which the flexible wall is shown in the first position, - Figure 1B shows a plan view of the pumping chamber shown in Figure 1A, 2 ~
- Figure 2 shows a section along the line I-I of the pumping chamber of Figures 1A and As in which the flexible wall is in the second position, - Figures 3A and 3B respectively show a section along the 05 line III-III and a plan view of an embodiment of a pumping chamber for a micropump according to the invention, - Figure 4 is a transverse section of another embodiment of a pumping chamber for a micropump according to the invention in which the flexible wall is in the first position, - Figure 5 shows, in transverse section, the pumping chamber of Figure 4 in which the flexible wall is in the second position, - Figures 6A and 6B respectively show a section along the line VI-VI and a plan view of a micropump of the invention, - Figures 7A and 7s respectively show a section along the line VII-VII and a plan view of another micropump of the invention, and - Figure 8 is a diagram illustrating the output of a micropump as a function of the pressure in the outlet channel for a micropump having two valves of conventional t~pe for a micropump according to the invention.
A first embodiment of a pumping chamber for a micropump according to the invention will be described with reference to Figures 1A, 1B, 1C. This pumping chamber is determined by the wafers 2, 4 sealed to each other, for example by anodic welding or by adhesion. These wafers are generally of the order of a few tenths of a millimetre thick. The cavity 6 defining the pumping chamber as well as an inlet channel 8 and an outlet channel 10 are obtained by etching the wafer 2 using conventional photolithographic techniques, such as wet etching. The diameter S of the cavity is of the order of 1 cm and it is between 5 and 200 micrometres high~ The wafer 2 is of a material which can be easily etched, such as monocrystalline silicon; the wafer 4 is for example of glass.
A control element such as, for example, a piezoelectric disc 1 n 12 is bonded to the outside face of the wafer 4 at the level of the cavity 6. Each face of this piezoelectric disc is covered by an electrode connected to a source of potential (not shown).
Figures 1A and 2 respectively illustrate the position of the wafer 4 in which no electrical potential is applied to the piezoelectric disc 12 (first position) or in which an electrical potential is applied to this piezoelectric disc (second position).
According to the invention the pumping chamber is provided with a stop 14 which, in limiting the amplitude of the movement of the flexible wall 13 of the wafer 4, precisely defines the second position of this flexible wall. As a result, the volume of the pumping chamber at the end of the delivery operation-, i.e. when the flexible wall 13 is in the second position, has a value that is precisely definable and reproducible.
When the flexible wall is in the first position the distance between the stop and the opposing wall of the chamber is of the order of 10~um or less. This distance clearly depends on the dimensions of the pumping chamber and on the fluid output 05 desired.
In the embodiment shown in Figur~s 1A, 1s and 2, the piezoelectric disc 12 is fixed to the glass wafer 4. It is of course possible to fix the pie~oelectric disc 12 onto the silicon wafer 2. A pumping chamber of this type is shown in section along the line III-III and in plan view in Figures 3A
and 3s respectively.
In these figures the elements identical to those shown in Figures 1A, 1B and 2 have the same reference numerals. When the silicon wafer 2 supports the piezoelectric disc 12~ a layer 16 of SiO2 is interposed between the disc 2 and the piezoelectric disc 12 for purposes of electrical insulation. Finally, it should be noted that, in this embodiment, the diameter of the stop 14 must be substantially lower than that of the piezoelectric disc so as not to excessively restrict the flexibility of the w fer 2.
In the two first described embodiments, the stop 14 is composed of a stop which extends from one wall of the pumping chamber. This protection is provided in the silicon wafer 2 during the etching of the cavity and of the inlet and outlet channels. The upper surface 18 of the projection, against which the opposing wall of the pumping chamber impinges when the 2 ~ 3 ~
- 10 ~
piezoelectric disc is subjected to an electrical potential is preferably planar. This makes it possible to define the second position of the flexible wall more precisely.
It is also possible to use the bottom of the cavity itself 05 as the stop. This is the case when a cavity is provided, the height of which is equal to the desired amplitude of movement of the flexible wall. Figures 4 and 5 show transverse sections through a pumping chamber of this kind in the first and second positions respectively of the flexible wafer 4. In these figures, the pumping chamber is defined by a cavity 6 linked to an inlet channel ~ and an outlet channel (not shown). This pumping chamber is composed of a silicon wafer 2 and a glass wafer 4 as in the previous figures. The piezoelectric disc is disposed on the glass wafer 4; this wafer 12 may of course also be disposed on the silicon disc 2, as in Figures 3A and 3B.
The advantage of using the bottom 20 of the cavity 6 as a stop for the flexible wall is that it reduces the number of operations needed to etch the silicon wafer 2 in comparison to the previous embodiments in which the stop is composed of a projection. Moreover, as shown in Figure 5, the volume of the chamber at the end of the delivery phase is very small. This ensures effective pumping, even if the liquid contains many gas bubbles (provided the parasite volume between the valves and the chamber itself is also very small). On the other hand, if the volume of the pumping chamber remains relatively large at the end of the delivery phase, and this is generally the case when 2/~6~
the stop is a projection, the gas bubbles can be compressed without being expelled from the pumping chamber.
In contradistinction it should be noted that the resistance to fluid flow is greater with a pumping chamber as shown in 05 Figure 4 which is thus particularly suitable for very low output micropumps.
One embodiment of a micropump of the invention is shown in section along the line VI-VI and in plan view in Figures 6A and 6B respectively. This micropump mainly comprises a silicon wafer 10 22 disposed between glass wafers 2~ and 26. The wafer 22 is etched on one face to form a cavity 28 defining the pumping chamber and on the other face to regulate the thickness of the part of the wafer 22 which constitutes the flexible wall 30 of the pumping chamber. This thickness is for example 150 ~m.
]5 The two faces of the wafer 22 are in addition engraved to form a membrane 32 and an annular rib 34 of an inlet valve, a membrane 36 and an annular rib 38 of an outlet valve, and an inlet channel 40a, 40b and an outlet channel 42a, 42b. To prevent the valves adhering to the glass wafers, the former are 20 covered with a fine layer 35, 39 of SiO2.
The piezoelectric disc 44 which controls the movement of the flexible wall 30 is bonded using cyano acrylate glue after the flexible wall has been covered with a fine layer 46 of SiO2 to provide electrical insulation. The piezoelectric disc 44 can be of the PXE-5 type, manufactured by Philips, 10 mm in diameter and 0.20 mm thick.
~ d~
Since the flexible wall 30 and the membranes 32, 36 are formed in the silicon wafer 22, the latter is preferably a wafer of monocrystalline silicon of <100> orientation with good mechanical properties and which is very suitable for etching.
05 This disc can be 5 cm in diameter and be of the order of 300 micrometres thick.
The wafers 24 and 26 are of polished glass. They are 5 cm in diameter and 1 mm thick. The wafer 24 is pierced by an inlet hole 4~ and an outlet hole 50. The wafers 24 and 26 are sealed ~ to the wafer 22 using the technique known as anodic welding.
In the embodiment shown in Figures 6A and 6B, the height of the pumping chamber, that is the distance between the flexible wall 30 and the wafer 26 when no electrical potential is applied to the piezoelectric disc 44, is selected (during etching of the wafer 22) so that the stop is formed by the surface of the wafer 26. The pumping chamber is thus similar to that described with reference to Figures 4 and 5, the only difference being that the piezoelectric disc is fixed onto the silicon wafer instead of onto the glass wafer.
Figures 7A and 7B respectively show a section along the line VII-VII and a plan view of a micropump according to another embodiment of the invention. This micropump is more compact than the micropump shown in Figures 6A and 6B. This is achieved by placing the inlet valve of the micropump directly onto one of the walls of the pumping chamber. It wo~ld be possible also to place a part of the outlet valve thereon.
2 ~9 ~ 13 ~
This micropump is composed of a silicon wafer 52 disposed between two glass wafers 54 and 56. One face of the wafer 52 is etched to form a cavity 58, defining the pumping chamber and during this etching operation a projection 60 is formed to 05 constitute a stop according to the invention. The two faces of the silicon wafer 52 are also etched to form a membrane 62 and an annular rib 64 of an inlet valve, and an inlet channel 70 and an outlet channel 72a, 72b. Layers 65, 67 of SiO2 are formed on the annular ribs 64, 68 to prevent the valves adhering to the glass wafers.
The inlet valve is preferably centered on the cavity 58. In this case, the projection 60, also centered in relation to the cavity 58 and to the inlet valve, is in the form of a ring. The valves can be provided with an amplitude limiter to reduce the risk of breakage of the membrane. In the case of the outlet valve, this limiter is composed of an annular rib 69; in the ; case of the inlet valve, it is the projection 60 which acts as the limiter. Channels 71, 73 are preferably provided in the amplitude limiters of the valves to permit flow of li~uid when these limiters are in contact with the glass wafers 54, 56.
After the etching operations, the glass wafers 54 and 56 are sealed by anodic welding to the silicon wafer 52, the glass wafer 54 being provided with an inlet opening 74 and an outlet opening 76. The flexible wall 78 of the pumping chamber is composed of part of the glass wafer 56; its thickness is of the order of 200 ~m.
~ ~ ~ L~
A piezoelectric disc 80 is bonded to this wall 78 to control its movement. In accordance with the invention the annular projection 60 limits the amplitude of movement of the flexible wall which makes it possible to precisely define the volume of S the pumping chamber at the end of the delivery operation.
This stop also makes it possible to keep the output of the micropump constant under normal use. As may be seen from the diagram of Figure 8, the output 0 of a conventional two-valve micropump is a linear function of the pressure p prevailing at the outlet of the micropump (curve A). In contrast, the output 0 of a micropump of the invention is substantially constant in the normal operating pressure range (curve B). This is because, for a pressure below the maximum operating pressure, the variation in volume caused by displacement of the flexible wall is limited. The output is thus virtually the same as that corresponding to the maximum operating pressure.
~IC~OPUMP HAVING A CONSTANT OUTPUT
The present invention relates to a micropump in which at least part of the pump mechanism is made by machining a silicon 05 wafer using photolithographic technology.
Micropumps can be used in particular for the in situ administration of medicaments, the miniaturization of the pump making it possible to implant them permanently in the body.
Using these pumps, small quantities of liquid to be injected can be accurately metered.
Micropumps of this type are in particular described in the article "A piezoelectric micropump based on micromachining of silicon" by H. van Lintel et al. which appeared in Sensors and Actuators, No. 15, 1988, pages 153-157. These micropumps ]5 substantially comprise a stack of three wafers, i.e. a wafer of silicon arranged between two wafers of glass.
The wafer of silicon is etched to form a cavity which, together with one of the glass wafers, defines the pumping chamber, at least one inlet valve and at least one outlet valve enabling the pumping chamber to communicate with one inlet channel and one outlet channel respectively. The part of the glass wafer forming a wall of the pumping chamber can be bent by a control element composed, for example, of a piezoelectric disc. This is provided with two electrodes which, when connected to a source of electrical potential, cause the disc to bend and, S consequently bend the glass wafer, causing a variation in the volume of the pumping chamber. The flexible wall of the pumping chamber can therefore be displaced between a first position, in which it is relatively far from the opposing wall when the piezoelectric disc is not subjected to any electrical potential, ] and a second position in which it is closer to the opposite wall when a potential is applied between the electrodes of the piezoelectric disc.
The micropuMp operates in the following manner. When no electrical potential is applied to the piezoelectric disc, the ]5 inlet and outlet valves are in the closed position. When an electrical potential is applied, the pressure inside the pumping chamber increases, causing the outlet valve to open as soon as the pressure in the chamber is greater than the sum of the pressure in the outlet channel and the pressure created by the pre-tension o~ khe valve. The fluid contained in the pumping chamber is then forced towards the outlet channel by the displacement of the flexible wall from the first position towards the second position. During this phase the inlet valve is kept closed b~ the pressure prevailing in the pumping chamber.
In contrast, the pressure in ~he pumping chamber falls when the electrical potential is reduced. ~his closes the outlet valve as soon as the pressure in the pumping chamber is lower than the sum of the pressure in the outlet channel and the S pressure created by the pre-tension of the valve, and opens the inlet valve as soon as the sum of the pressure in the pumping chamber and the pressure created by the pre-tension of the valve is less than the pressure in the inlet channel. Fluid is then sucked into the pumping chamber via the inlet channel as a ] result of the displacement of the flexible wall from the second position towards the first position.
As has already been stated, these micropumps are used in particular for the administration of medicaments. It is therefore important for the output of the micropump to be well determined so that the medication to be injected can be metered in a very precise manner. However, conventional micropumps have certain defects in this respect.
The output of the micropump depends on the variation in the volume of the pumping chamber between the two positions of the flexible wall. This variation in volume depends on various parameters, including the electrical potential applied to the piezoelectric disc and the physical characteristics of the piezoelectric disc (thickness, diameter, dielectric constant) and of the flexible wall (material, thickness). The same electrical potential applied to seemingly identical micropumps could cause differing bending o~ the pumping chambe~s of these micropumps which would consequently have different outputs.
The output from one and the same micropump could, moreover, also change in the course of time due to ageing of the materials. Finally, the output of the micropump depends on the pressure in the outlet channel, since the outlet valve only 05 opens when the pressure in the pumping chamber is greater than the sum of the pressure in the outlet channel and the pressure created by the pre-tension of the valve.
In the above mentioned article, H. van Lintel et al.
describe a micropump provided with an additional valve which ]0 makes it possible to render the output less dependent on the pressure in the outlet channel. However, this micropump does not overcome the other disadvantages mentioned earlier.
It is the main object of the invention to overcome the above-mentioned disadvantages in order to ensure that the output lS of the micropump is as constant as possible and, in particular, independent of the manufacturing tolerances of the micropump, of the ageing thereof and of the pressure in the outlet channel.
The micropump of the invention comprises a plurality of wafers bonded to one another in a sealed manner in which are formed a pumping chamber defined by two bonded wafers defining a cavity obtained by etching at least one of these wafers, at least one inlet valve and at least one outlet valve enabling the 2 ~
pumping chamber to communicate with one inlet channel and one outlet channel respectively, this micropump comprising in addition a control element for resiliently bending the part of a wafer constituting one wall of the pumping chamber between a 05 first position in which this bent wall is further from the opposing wall of the pumping chamber and a second position in which this wall is relatively close to this opposing wall, the displacements of the flexible wall causing the suction or delivery of a fluid. According to the invention, this micropump ]0 is characterized in that the pumping chamber has a stop which determines the second position of the flexible wall.
This stop limits the movement of the flexible wall towards the opposing wall of the pumping chamber. This makes it possible to define the volume of the pumping chamber in a very precise ]5 manner at the end of the fluid delivery operation.
In addition, the presence of this stop means that it is no longer necessary for the electrical control potential of the piezoelectric disc, or more generally, the intensity of the signal applied to the bending control unit of the flexible wall, to have a precise value. It suffices if this potential is greater than that needed to effect a contact between the stop and the opposing wall of the pumping chamber.
Finally, the stop permits an output substantially independent of the pressure prevailing in the outlet channel since it is possible to impart a high potential to the piezoelectric disc, inducing a high pressure in the pumping 3 ~
chamber which is higher than the sum of the pressure prevailing in the outlet channel in normal conditions of use and the pressure created by the pre-tension of the outlet valve, without this latter being altered by an increase in the amplitude of S movement of the flexible wall which remains fixed by the stop.
This stop can in particular take the form of one or several projections which can be formed on the bottom of the cavity during the etching of the wafer in which this cavity is effected and/or provided by etching, bonding or the like on the flexible wall. The stop can also be simply composed of the bottom of the cavity itself provided the height of the pumping chamber is selected so that it is equal to the desired amplitude of the movement of the flexible wall.
The characteristics and advantages of the invention are better illustrated by the following description, given for purposes of example and which is not limiting, with reference to the accompanying drawings, in which:
- Figure 1A shows a section along the line I-I of a pumping chamber of a micropump according to the invention in which the flexible wall is shown in the first position, - Figure 1B shows a plan view of the pumping chamber shown in Figure 1A, 2 ~
- Figure 2 shows a section along the line I-I of the pumping chamber of Figures 1A and As in which the flexible wall is in the second position, - Figures 3A and 3B respectively show a section along the 05 line III-III and a plan view of an embodiment of a pumping chamber for a micropump according to the invention, - Figure 4 is a transverse section of another embodiment of a pumping chamber for a micropump according to the invention in which the flexible wall is in the first position, - Figure 5 shows, in transverse section, the pumping chamber of Figure 4 in which the flexible wall is in the second position, - Figures 6A and 6B respectively show a section along the line VI-VI and a plan view of a micropump of the invention, - Figures 7A and 7s respectively show a section along the line VII-VII and a plan view of another micropump of the invention, and - Figure 8 is a diagram illustrating the output of a micropump as a function of the pressure in the outlet channel for a micropump having two valves of conventional t~pe for a micropump according to the invention.
A first embodiment of a pumping chamber for a micropump according to the invention will be described with reference to Figures 1A, 1B, 1C. This pumping chamber is determined by the wafers 2, 4 sealed to each other, for example by anodic welding or by adhesion. These wafers are generally of the order of a few tenths of a millimetre thick. The cavity 6 defining the pumping chamber as well as an inlet channel 8 and an outlet channel 10 are obtained by etching the wafer 2 using conventional photolithographic techniques, such as wet etching. The diameter S of the cavity is of the order of 1 cm and it is between 5 and 200 micrometres high~ The wafer 2 is of a material which can be easily etched, such as monocrystalline silicon; the wafer 4 is for example of glass.
A control element such as, for example, a piezoelectric disc 1 n 12 is bonded to the outside face of the wafer 4 at the level of the cavity 6. Each face of this piezoelectric disc is covered by an electrode connected to a source of potential (not shown).
Figures 1A and 2 respectively illustrate the position of the wafer 4 in which no electrical potential is applied to the piezoelectric disc 12 (first position) or in which an electrical potential is applied to this piezoelectric disc (second position).
According to the invention the pumping chamber is provided with a stop 14 which, in limiting the amplitude of the movement of the flexible wall 13 of the wafer 4, precisely defines the second position of this flexible wall. As a result, the volume of the pumping chamber at the end of the delivery operation-, i.e. when the flexible wall 13 is in the second position, has a value that is precisely definable and reproducible.
When the flexible wall is in the first position the distance between the stop and the opposing wall of the chamber is of the order of 10~um or less. This distance clearly depends on the dimensions of the pumping chamber and on the fluid output 05 desired.
In the embodiment shown in Figur~s 1A, 1s and 2, the piezoelectric disc 12 is fixed to the glass wafer 4. It is of course possible to fix the pie~oelectric disc 12 onto the silicon wafer 2. A pumping chamber of this type is shown in section along the line III-III and in plan view in Figures 3A
and 3s respectively.
In these figures the elements identical to those shown in Figures 1A, 1B and 2 have the same reference numerals. When the silicon wafer 2 supports the piezoelectric disc 12~ a layer 16 of SiO2 is interposed between the disc 2 and the piezoelectric disc 12 for purposes of electrical insulation. Finally, it should be noted that, in this embodiment, the diameter of the stop 14 must be substantially lower than that of the piezoelectric disc so as not to excessively restrict the flexibility of the w fer 2.
In the two first described embodiments, the stop 14 is composed of a stop which extends from one wall of the pumping chamber. This protection is provided in the silicon wafer 2 during the etching of the cavity and of the inlet and outlet channels. The upper surface 18 of the projection, against which the opposing wall of the pumping chamber impinges when the 2 ~ 3 ~
- 10 ~
piezoelectric disc is subjected to an electrical potential is preferably planar. This makes it possible to define the second position of the flexible wall more precisely.
It is also possible to use the bottom of the cavity itself 05 as the stop. This is the case when a cavity is provided, the height of which is equal to the desired amplitude of movement of the flexible wall. Figures 4 and 5 show transverse sections through a pumping chamber of this kind in the first and second positions respectively of the flexible wafer 4. In these figures, the pumping chamber is defined by a cavity 6 linked to an inlet channel ~ and an outlet channel (not shown). This pumping chamber is composed of a silicon wafer 2 and a glass wafer 4 as in the previous figures. The piezoelectric disc is disposed on the glass wafer 4; this wafer 12 may of course also be disposed on the silicon disc 2, as in Figures 3A and 3B.
The advantage of using the bottom 20 of the cavity 6 as a stop for the flexible wall is that it reduces the number of operations needed to etch the silicon wafer 2 in comparison to the previous embodiments in which the stop is composed of a projection. Moreover, as shown in Figure 5, the volume of the chamber at the end of the delivery phase is very small. This ensures effective pumping, even if the liquid contains many gas bubbles (provided the parasite volume between the valves and the chamber itself is also very small). On the other hand, if the volume of the pumping chamber remains relatively large at the end of the delivery phase, and this is generally the case when 2/~6~
the stop is a projection, the gas bubbles can be compressed without being expelled from the pumping chamber.
In contradistinction it should be noted that the resistance to fluid flow is greater with a pumping chamber as shown in 05 Figure 4 which is thus particularly suitable for very low output micropumps.
One embodiment of a micropump of the invention is shown in section along the line VI-VI and in plan view in Figures 6A and 6B respectively. This micropump mainly comprises a silicon wafer 10 22 disposed between glass wafers 2~ and 26. The wafer 22 is etched on one face to form a cavity 28 defining the pumping chamber and on the other face to regulate the thickness of the part of the wafer 22 which constitutes the flexible wall 30 of the pumping chamber. This thickness is for example 150 ~m.
]5 The two faces of the wafer 22 are in addition engraved to form a membrane 32 and an annular rib 34 of an inlet valve, a membrane 36 and an annular rib 38 of an outlet valve, and an inlet channel 40a, 40b and an outlet channel 42a, 42b. To prevent the valves adhering to the glass wafers, the former are 20 covered with a fine layer 35, 39 of SiO2.
The piezoelectric disc 44 which controls the movement of the flexible wall 30 is bonded using cyano acrylate glue after the flexible wall has been covered with a fine layer 46 of SiO2 to provide electrical insulation. The piezoelectric disc 44 can be of the PXE-5 type, manufactured by Philips, 10 mm in diameter and 0.20 mm thick.
~ d~
Since the flexible wall 30 and the membranes 32, 36 are formed in the silicon wafer 22, the latter is preferably a wafer of monocrystalline silicon of <100> orientation with good mechanical properties and which is very suitable for etching.
05 This disc can be 5 cm in diameter and be of the order of 300 micrometres thick.
The wafers 24 and 26 are of polished glass. They are 5 cm in diameter and 1 mm thick. The wafer 24 is pierced by an inlet hole 4~ and an outlet hole 50. The wafers 24 and 26 are sealed ~ to the wafer 22 using the technique known as anodic welding.
In the embodiment shown in Figures 6A and 6B, the height of the pumping chamber, that is the distance between the flexible wall 30 and the wafer 26 when no electrical potential is applied to the piezoelectric disc 44, is selected (during etching of the wafer 22) so that the stop is formed by the surface of the wafer 26. The pumping chamber is thus similar to that described with reference to Figures 4 and 5, the only difference being that the piezoelectric disc is fixed onto the silicon wafer instead of onto the glass wafer.
Figures 7A and 7B respectively show a section along the line VII-VII and a plan view of a micropump according to another embodiment of the invention. This micropump is more compact than the micropump shown in Figures 6A and 6B. This is achieved by placing the inlet valve of the micropump directly onto one of the walls of the pumping chamber. It wo~ld be possible also to place a part of the outlet valve thereon.
2 ~9 ~ 13 ~
This micropump is composed of a silicon wafer 52 disposed between two glass wafers 54 and 56. One face of the wafer 52 is etched to form a cavity 58, defining the pumping chamber and during this etching operation a projection 60 is formed to 05 constitute a stop according to the invention. The two faces of the silicon wafer 52 are also etched to form a membrane 62 and an annular rib 64 of an inlet valve, and an inlet channel 70 and an outlet channel 72a, 72b. Layers 65, 67 of SiO2 are formed on the annular ribs 64, 68 to prevent the valves adhering to the glass wafers.
The inlet valve is preferably centered on the cavity 58. In this case, the projection 60, also centered in relation to the cavity 58 and to the inlet valve, is in the form of a ring. The valves can be provided with an amplitude limiter to reduce the risk of breakage of the membrane. In the case of the outlet valve, this limiter is composed of an annular rib 69; in the ; case of the inlet valve, it is the projection 60 which acts as the limiter. Channels 71, 73 are preferably provided in the amplitude limiters of the valves to permit flow of li~uid when these limiters are in contact with the glass wafers 54, 56.
After the etching operations, the glass wafers 54 and 56 are sealed by anodic welding to the silicon wafer 52, the glass wafer 54 being provided with an inlet opening 74 and an outlet opening 76. The flexible wall 78 of the pumping chamber is composed of part of the glass wafer 56; its thickness is of the order of 200 ~m.
~ ~ ~ L~
A piezoelectric disc 80 is bonded to this wall 78 to control its movement. In accordance with the invention the annular projection 60 limits the amplitude of movement of the flexible wall which makes it possible to precisely define the volume of S the pumping chamber at the end of the delivery operation.
This stop also makes it possible to keep the output of the micropump constant under normal use. As may be seen from the diagram of Figure 8, the output 0 of a conventional two-valve micropump is a linear function of the pressure p prevailing at the outlet of the micropump (curve A). In contrast, the output 0 of a micropump of the invention is substantially constant in the normal operating pressure range (curve B). This is because, for a pressure below the maximum operating pressure, the variation in volume caused by displacement of the flexible wall is limited. The output is thus virtually the same as that corresponding to the maximum operating pressure.
Claims (10)
1. A micropump comprising a plurality of wafers sealed to one another so as to form a pumping chamber defined by two bonded wafers defining a cavity formed by etching at least one of these wafers, at least one inlet valve and at least one outlet valve enabling the pumping chamber to communicate with one inlet channel and one outlet channel respectively, said micropump also comprising a control element to resiliently bend the part of a wafer constituting a wall of the pumping chamber between a first position in which said flexible wall is relatively far from the opposing wall of the pumping chamber and a second position in which said flexible wall is closer to said opposing wall, the displacements of the flexible wall causing suction of a fluid into the pumping chamber or the delivery thereof, said micropump being characterized in that said pumping chamber comprises a stop which defines said second position of the flexible wall.
2. A micropump according to claim 1, wherein the stop is a projection formed on an inner face of the pumping chamber.
3. A micropump according to claim 2 wherein the surface of the stop which comes into contact with an inner face of the pumping chamber when the flexible wall assumes the second position is planar.
4. A micropump according to either of claim 2 or claim 3 wherein the projection is formed in the bottom of the cavity during the etching thereof.
5. A micropump according to claim 1 wherein the stop is composed of the inner face of the wall of the pumping chamber located facing the flexible wall.
6. A micropump according to any one of claims 1 to 5 wherein one of the wafers defining the pumping chamber is of silicon and the other of glass, the cavity and the stop being formed by etching the silicon wafer.
7. A micropump according to claim 6 wherein the flexible wall is one part of the silicon wafer.
8. A micropump according to any one of claims 6 and 7 wherein the silicon wafer is of monocrystalline silicon.
9. A micropump according to any one of claims 1 to 8 wherein one inlet valve is disposed in the wall of the pumping chamber opposite the flexible wall and wherein at least one part of this valve constitutes the stop.
10. A micropump according to any one of claims 1 to 7 in which the control element comprises a piezoelectric disc fixed to the flexible wall.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1369/89A CH679555A5 (en) | 1989-04-11 | 1989-04-11 | |
CH01369/89-0 | 1989-04-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2014235A1 true CA2014235A1 (en) | 1990-10-11 |
Family
ID=4208807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002014235A Abandoned CA2014235A1 (en) | 1989-04-11 | 1990-04-10 | Micropump having a constant output |
Country Status (8)
Country | Link |
---|---|
US (1) | US5085562A (en) |
EP (1) | EP0392978A1 (en) |
JP (1) | JPH03505771A (en) |
AU (1) | AU628153B2 (en) |
CA (1) | CA2014235A1 (en) |
CH (1) | CH679555A5 (en) |
PT (1) | PT93712A (en) |
WO (1) | WO1990012209A1 (en) |
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-
1989
- 1989-04-11 CH CH1369/89A patent/CH679555A5/fr not_active IP Right Cessation
-
1990
- 1990-04-04 US US07/503,977 patent/US5085562A/en not_active Expired - Lifetime
- 1990-04-05 EP EP90810272A patent/EP0392978A1/en not_active Withdrawn
- 1990-04-05 JP JP2504870A patent/JPH03505771A/en active Pending
- 1990-04-05 WO PCT/CH1990/000093 patent/WO1990012209A1/en unknown
- 1990-04-10 CA CA002014235A patent/CA2014235A1/en not_active Abandoned
- 1990-04-10 PT PT93712A patent/PT93712A/en not_active Application Discontinuation
- 1990-04-10 AU AU53034/90A patent/AU628153B2/en not_active Ceased
Also Published As
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AU5303490A (en) | 1990-10-18 |
JPH03505771A (en) | 1991-12-12 |
EP0392978A1 (en) | 1990-10-17 |
CH679555A5 (en) | 1992-03-13 |
WO1990012209A1 (en) | 1990-10-18 |
AU628153B2 (en) | 1992-09-10 |
PT93712A (en) | 1992-01-31 |
US5085562A (en) | 1992-02-04 |
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EEER | Examination request | ||
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