CA1204919A - Photoflash array quick-cure laminating process - Google Patents
Photoflash array quick-cure laminating processInfo
- Publication number
- CA1204919A CA1204919A CA000410675A CA410675A CA1204919A CA 1204919 A CA1204919 A CA 1204919A CA 000410675 A CA000410675 A CA 000410675A CA 410675 A CA410675 A CA 410675A CA 1204919 A CA1204919 A CA 1204919A
- Authority
- CA
- Canada
- Prior art keywords
- printed circuit
- circuit board
- metallic
- quick
- laminating process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
- G03B15/03—Combinations of cameras with lighting apparatus; Flash units
- G03B15/04—Combinations of cameras with non-electronic flash apparatus; Non-electronic flash units
- G03B15/0442—Constructional details of the flash apparatus; Arrangement of lamps, reflectors, or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Abstract
PHOTOFLASH ARRAY QUICK-CURE LAMINATING PROCESS
ABSTRACT
A quick-cure laminating process for multi-lamp photoflash arrays includes the application of a curable adhesive to a metallic printed circuit, the positioning of the adhesive-covered printed circuit adjacent a deformable rubber material and a circuit board and the printed circuit and circuit board intermediate a pair of surfaces movable with respect to one another and the moving of said surfaces to exert a compressive force on said printed circuit and circuit board while being heated to a temperature and for a time sufficient to effect attachment of the printed circuit to the circuit board.
In another aspect, the circuit board may be of a deformable material, placed in contact with an adhesive-covered printed circuit, compressed and heated to effect attachment of the printed circuit to the circuit board.
ABSTRACT
A quick-cure laminating process for multi-lamp photoflash arrays includes the application of a curable adhesive to a metallic printed circuit, the positioning of the adhesive-covered printed circuit adjacent a deformable rubber material and a circuit board and the printed circuit and circuit board intermediate a pair of surfaces movable with respect to one another and the moving of said surfaces to exert a compressive force on said printed circuit and circuit board while being heated to a temperature and for a time sufficient to effect attachment of the printed circuit to the circuit board.
In another aspect, the circuit board may be of a deformable material, placed in contact with an adhesive-covered printed circuit, compressed and heated to effect attachment of the printed circuit to the circuit board.
Description
~ %(~4~
~L
PHOTOFLASH ARRAY QUICK-CURE LA~ TIUC PROC~SS
T~CH~ICAL FIgLD
This ;nvention relates tv multi-l~mp photoflash arrays and more partlcularly to a quick-cure laminating process for affix~ng a metallic circuit to a ctrcuit board.
BA~KGROU~D ART
In the manufacture of m~lti-lamp photoflash arrays, it is common practice to employ ~ circuit board ~hereon a metallic printed circuit i6 attached. Frequently this printed circuit ls of a material 6uch as aluminum foil and die-stamped to a desired ~onfi~uration. Moreover, the confi~ured aluminum foil is electrically conductive and provides the electrical conductive paths necessary to the energization of a multi-lamp photoflash array.
Ordinarily, a circuit board of a material ~uch as a ~lass-filled epoxy serves as a substrate and the metalllc printed circuit is affixed thereto. Usually an adhesive material is appli~d to one surface of the printed circuit and pressure and heat ar0 applied to the circuit and circuit board in an amount sufficient to cure the adhesive and effect attachment of the printed circuit to the circuit ~oard.
At the present time, it is not unexpected to find sircuit board material specifications which permit a board thickness variation in the range of about plu6 or minus ten percent. Because of such relatively ~reat variation in board thickness, it has been found that virtually every circuit board has one or more low spots whereat contact with the adhesive coverin~ the printed metallic circuit is not obtained. This lack of intimate contact between the adhesive-covered printed circuit and the circuit board has been found to ~reatly inhibit the rate of cure of the adhesive and, of course~ causes a ~reat extension of the time required for attachment between the printed circuit and tbe circuit board. As a result, it has become more or less standard in the lam;natin~ of photoflash arrays to compensate for this lack of intimate contact b0tween printed circuit and circuit board by employin~ a lar~e number of ` .
~L%~
~tructures cured for a relatively long period of time, ~uch ~c a ~lnl- Im of about 15 minute~, for example. However, ~t is ob that efficiency and economy are sacrificed when ~uch ~anufacturin~
technlques are required.
In another aspect, the attachment of an adhesive-c~vered printed circuit to 8 circuit board utilizin~ a compression force tends to cause an undesired excess adhesive ~ischar~e. Thus, it is not uncommon to ~mploy a kraft paper as a blotter to absorb this excess Adhe~ive dischar~e. However, blotter material is an ~dded cost, especially when replacement is necessary for aach curin~ cycle~ and obviously deleterious to an economical manufacturing operation.
OBJECTS A~D SU~HARY OF THE INV~TIO~
An object of the present invention is to provide an improve~
multi-lamp photoflash array. Anothèr object of the invention is to reduce the time required to fsbricate a multi-lamp photoflash array. Still another object of the invention is to enhance the manufacture of multi-lamp photoflash arrays. A further ob~ect of the invention is to reduce the time required to laminate a metallic printed circuit and a circuit board utilized in a photoflash array.
These and other objects, ad~anta~es and capabilities are achieved in one aspect of the invention by a quick-cure laminatin~
process wherein an adhesive is applied to a metallic printed circuit, the printed circuit and a circuit board are positioned intermediate a pair of ~urfaces with the surface adjacent the printed circuit bein~ an elastomeric material, com*ressed and heated for a time and at a temperature ~ufficient to cure the adhesive and affix the printed circuit to the board.
In another aspect of the invention an adhesive is applled to a metallic printed circuit which, alon~ with a circuit board of elastomeric material, is positioned intermediate a pair of movable surfaces. The movable surfaces compress the printed circuit ~nd circuit board at a pressure and temperature and for a time sufficient to cure the adhesive and affix the printed circuit to the circuit board.
~2~
BRI~F DESCRIPTIO~ OF TH~ DRAWI~GS
FIG. 1 i~ an exploded view o a multi-lamp photoflash arr~y utilizing a laminated printed circuit configurat~on;
FIG. 2 is an exploded illu~trstion of a preferred laminatin~
proce~s utilizin~ heat and compression for fabricatin~ a circuit board with an affixed printed circuit; an~
FIG. 3 is sn alternate laminatin~ process for fabricatin~
printed circuit boards.
BEST 2~ODE FOR CARRYII~G OIJT THE IUVE~TIO~
For a better under6tandin~ of the present invent~n~ together with other and further ob3ects, advants~es and ~apabilities thereof, reference is ~ade to the followin~ disclosure ~nd appended claims in conjunction with the accompanyin~ drawin~s.
Ref~rring to the drawin~s, FIG. 1 illustrates a multi-lamp photoflash array. Therein, a circuit board 5 has a metallic printed circuit 7 ~ffixed thereto and is positioned immediately adjacent a reflector ~nit 9. The reflector unit 9 includes a plurality of sli~ned cavitie~ 11, e~ch havin~ a reflective surf~ce 13 and a pair of conductor receiving apertures 15.
A photoflash lamp 17 havin~ a pair of electrical conductors 19 is di~posed within each one of the cavities 11 ~ith the electrical conductors 19 extending ther~throu~h and contactin~ the metallic printed circuit 7. A li~ht transmittable plastic housin~ member 21 encloses the reflector unit 9 and photoflash ~amps ~7, and is affixed to the circuit board 5. Thus~ the printed circuit 7, the reflector unit 9 and the flashlamps 17 are contained lnterme~iate the circuit board 5 and the housin~ member 21.
A~ previously me~tioned, commonly ~nown techniques for the manufacture of the above-mentioned and other circuit boards and affixed printed circuit~ are relatively slow, require added materials such as blotter materials and are, there~ore, expensive and lacking in efficiency. However, the deficiencies of the above technique are overcome by the followin~ enhanced quick-cure laminating process for multi-lamp photoflash arrays.
~ ,;
~2~
. ~
Ref~rrin~ to FIG. 2, a quick-cure lam~nat~ng proces~ includes therein a metalllc printed circuit 23 such as may be obtain~d in a die-stamp oper~tion utilizin~ an æll in- foil. Obviously, othsr materi~ls and other technique~ for derivin~ the printed circuit from the material are equally appropriate. Also, a curable adhesive 25 is applied to one surface of the printed circult 23.
Immediately adjacent the curable adhesive 25 applied to the printed circuit 23 is a printed circuit board 27. The printed circuit board 27 may be of a moldable resin material, a resin-filled ~lacs epoxy or numerous other materials well-~nown in the printed circuit board field. ~oreover, the printed circuit 23 having the curable adhesive 25 thereon and the printed circuit board 27 are all positioned intermediate a pair of ~urfaces 29 and 31 movable with respect to one another. Noreover, the surfaces 29 and 31 are connected to a heating ~ource (not shown) and to a source of compres~ive force (not shown).
Rositioned on one of the pair of surfaces 29 snd 31 and adjacent the printed circuit 23 is a deformable material layer 33. This deformable material layer 33 is of a material ruch as silicon rubber and, more ~pecificslly, of a material such as a fiberglass fabric hi~h temperature elastomeric composite material known as Grade 5539~RO45 (Trade Hark), available from the ~eene Corporation, Chase-Foster Divi~ion, Bear, Delaware l9~Ol. ~oreover, the above-mentioned elastomeric material is recl -nded for temperatures up to sbout 500 F for a limited period of time.
~ ore specifically, the laminating process includes the applicativn of a curable adhesive 25 to one ~urface of the metallic printed circuit 23. The adhesive-covered printed circuit 23 is positioned with the sdhesive 25 adjacent a circuit board 27.
Thereafter, the printed circuit 23 and circuit board 27 are lo~ated intermediate the pair of surfaces 29 and 31 which are movable with respect to one another. In addition, the layer of elastomeric material 33 positioned on the surface 31 of the pair of surfaces 29 and 31 is adjacent ~he printed cirruit 23.
Thereafter, the surfaces 29 and 31 are mo~ed toward one another in an amount sufficient to exert 8 compressive force in the range of about lOO to 500 pounds per squ~re inch on the printed circuit 23 ~ .
.i .
~2C~
and circuit board 27. Simultaneou61y, the pr~nte~ circuit 23 having the adhesive 25 thereon and the circuit board 27 are heate~ in an amount and for a time sufficient to cause t~e printed circuit 23 to become affixed to the circuit bo~rd 27.
Preferably, the printed circuit 23 and circult board 27 are heated to a temperature in the range of sbout 360 to 550 P.
Noreover, the heatin~ of the printed circuit 23 and circuit boar~ 27 i~ effected or a period not ~reater than about 30 seconds and preferably Por a period in the ran~e of about 4 to 20 ~econds.
~hus, the printed circuit 23 and circuit board 27 are subjected to compressiYe force in the ran~e of about 100 to 500 pounds per square inch, a temperature in the ran~e of about 360 to 550 F, ~nd for a period not ~reater than about 30 ~econds.
Alternatively, PIG. 3 illustrates a quick-cure laminating process for multi-lamp photoflash arrays wherein the above-mentioned elastomeric material layer 33 of FIG. 2 is not require~. Herein, an adhecive is applied to a surface of 8 printed circuit 35, and the printed circuit 35 i~ ~ositioned adjacent a circuit board 37 of a deformable material. A preferred deformable material circuit board 37 is known as "Duroid" (Trade ~ark), manufactured by the Rogers Corporation of Ro~ers, Connecticut 06263.
Thereafter, the printed circuit 35 and circuit board 37 of defonmable material are located intermediate a pair of surfaces 39 and 41 which are movable with respect to one another. The surfaces 39 and 41 are activated to exert a compressive force on the printed ~ircuit 35 and circuit board 37 in the ran~e of about 100 to 500 pounds per ~quare inch. Simultaneously, heat is applied to the printed cireuit 35 and circuit board 37 in an amount ~nd for a ti~e suficient to cure the adhesive and effect attachment therebetween.
Specifically, the simultaneous application to the printed circuit 35 and circuit board 37 of compressive force in the range of about 100 to 500 pounds per square inch, at a temperature in the ran~e of about 360 to 500~ F and for a period not ~reater than about 30 seconds is sufficient to effect the desired attachment.
Horeover, the circuit board 37 of deformable material serves to contain the adhesive intermediste the printed circuit 35 and circuit board 37 thereby eliminat~ng the need for a blotter or other form~
of adheslve absorbent.
~ hile there has been shown and described what is at present con~idered the preferred embodiments of the invention, it ~ e obvious to those skilled in the art that ~arious changes and mGdifications may be ~ade therein without departin~ from the invention 85 defined by the appended claims.
INDUSTRIAL APPLICABILITY
An enhanced quick-cure laminating process for multi-lamp photoflash arrays has been provided wherein a metallic printed circuit i~ attachable to a circuit board in a period of less than about 30 6econds. The process not only provides a very ~reat reduction in cycle time required to effect such a printed circuit-circuit board nttar' - t, but also provi~es an obvious i~p~v~c t in manufacture and manufacturing cost. ~oreover, the utilization of a deformable material in the msnufacturing process virtl~ally eliminates the need for blotter materials for absorbing excess adhe~ives which, in turn, further reduces materials snd 20 material costs.
~L
PHOTOFLASH ARRAY QUICK-CURE LA~ TIUC PROC~SS
T~CH~ICAL FIgLD
This ;nvention relates tv multi-l~mp photoflash arrays and more partlcularly to a quick-cure laminating process for affix~ng a metallic circuit to a ctrcuit board.
BA~KGROU~D ART
In the manufacture of m~lti-lamp photoflash arrays, it is common practice to employ ~ circuit board ~hereon a metallic printed circuit i6 attached. Frequently this printed circuit ls of a material 6uch as aluminum foil and die-stamped to a desired ~onfi~uration. Moreover, the confi~ured aluminum foil is electrically conductive and provides the electrical conductive paths necessary to the energization of a multi-lamp photoflash array.
Ordinarily, a circuit board of a material ~uch as a ~lass-filled epoxy serves as a substrate and the metalllc printed circuit is affixed thereto. Usually an adhesive material is appli~d to one surface of the printed circuit and pressure and heat ar0 applied to the circuit and circuit board in an amount sufficient to cure the adhesive and effect attachment of the printed circuit to the circuit ~oard.
At the present time, it is not unexpected to find sircuit board material specifications which permit a board thickness variation in the range of about plu6 or minus ten percent. Because of such relatively ~reat variation in board thickness, it has been found that virtually every circuit board has one or more low spots whereat contact with the adhesive coverin~ the printed metallic circuit is not obtained. This lack of intimate contact between the adhesive-covered printed circuit and the circuit board has been found to ~reatly inhibit the rate of cure of the adhesive and, of course~ causes a ~reat extension of the time required for attachment between the printed circuit and tbe circuit board. As a result, it has become more or less standard in the lam;natin~ of photoflash arrays to compensate for this lack of intimate contact b0tween printed circuit and circuit board by employin~ a lar~e number of ` .
~L%~
~tructures cured for a relatively long period of time, ~uch ~c a ~lnl- Im of about 15 minute~, for example. However, ~t is ob that efficiency and economy are sacrificed when ~uch ~anufacturin~
technlques are required.
In another aspect, the attachment of an adhesive-c~vered printed circuit to 8 circuit board utilizin~ a compression force tends to cause an undesired excess adhesive ~ischar~e. Thus, it is not uncommon to ~mploy a kraft paper as a blotter to absorb this excess Adhe~ive dischar~e. However, blotter material is an ~dded cost, especially when replacement is necessary for aach curin~ cycle~ and obviously deleterious to an economical manufacturing operation.
OBJECTS A~D SU~HARY OF THE INV~TIO~
An object of the present invention is to provide an improve~
multi-lamp photoflash array. Anothèr object of the invention is to reduce the time required to fsbricate a multi-lamp photoflash array. Still another object of the invention is to enhance the manufacture of multi-lamp photoflash arrays. A further ob~ect of the invention is to reduce the time required to laminate a metallic printed circuit and a circuit board utilized in a photoflash array.
These and other objects, ad~anta~es and capabilities are achieved in one aspect of the invention by a quick-cure laminatin~
process wherein an adhesive is applied to a metallic printed circuit, the printed circuit and a circuit board are positioned intermediate a pair of ~urfaces with the surface adjacent the printed circuit bein~ an elastomeric material, com*ressed and heated for a time and at a temperature ~ufficient to cure the adhesive and affix the printed circuit to the board.
In another aspect of the invention an adhesive is applled to a metallic printed circuit which, alon~ with a circuit board of elastomeric material, is positioned intermediate a pair of movable surfaces. The movable surfaces compress the printed circuit ~nd circuit board at a pressure and temperature and for a time sufficient to cure the adhesive and affix the printed circuit to the circuit board.
~2~
BRI~F DESCRIPTIO~ OF TH~ DRAWI~GS
FIG. 1 i~ an exploded view o a multi-lamp photoflash arr~y utilizing a laminated printed circuit configurat~on;
FIG. 2 is an exploded illu~trstion of a preferred laminatin~
proce~s utilizin~ heat and compression for fabricatin~ a circuit board with an affixed printed circuit; an~
FIG. 3 is sn alternate laminatin~ process for fabricatin~
printed circuit boards.
BEST 2~ODE FOR CARRYII~G OIJT THE IUVE~TIO~
For a better under6tandin~ of the present invent~n~ together with other and further ob3ects, advants~es and ~apabilities thereof, reference is ~ade to the followin~ disclosure ~nd appended claims in conjunction with the accompanyin~ drawin~s.
Ref~rring to the drawin~s, FIG. 1 illustrates a multi-lamp photoflash array. Therein, a circuit board 5 has a metallic printed circuit 7 ~ffixed thereto and is positioned immediately adjacent a reflector ~nit 9. The reflector unit 9 includes a plurality of sli~ned cavitie~ 11, e~ch havin~ a reflective surf~ce 13 and a pair of conductor receiving apertures 15.
A photoflash lamp 17 havin~ a pair of electrical conductors 19 is di~posed within each one of the cavities 11 ~ith the electrical conductors 19 extending ther~throu~h and contactin~ the metallic printed circuit 7. A li~ht transmittable plastic housin~ member 21 encloses the reflector unit 9 and photoflash ~amps ~7, and is affixed to the circuit board 5. Thus~ the printed circuit 7, the reflector unit 9 and the flashlamps 17 are contained lnterme~iate the circuit board 5 and the housin~ member 21.
A~ previously me~tioned, commonly ~nown techniques for the manufacture of the above-mentioned and other circuit boards and affixed printed circuit~ are relatively slow, require added materials such as blotter materials and are, there~ore, expensive and lacking in efficiency. However, the deficiencies of the above technique are overcome by the followin~ enhanced quick-cure laminating process for multi-lamp photoflash arrays.
~ ,;
~2~
. ~
Ref~rrin~ to FIG. 2, a quick-cure lam~nat~ng proces~ includes therein a metalllc printed circuit 23 such as may be obtain~d in a die-stamp oper~tion utilizin~ an æll in- foil. Obviously, othsr materi~ls and other technique~ for derivin~ the printed circuit from the material are equally appropriate. Also, a curable adhesive 25 is applied to one surface of the printed circult 23.
Immediately adjacent the curable adhesive 25 applied to the printed circuit 23 is a printed circuit board 27. The printed circuit board 27 may be of a moldable resin material, a resin-filled ~lacs epoxy or numerous other materials well-~nown in the printed circuit board field. ~oreover, the printed circuit 23 having the curable adhesive 25 thereon and the printed circuit board 27 are all positioned intermediate a pair of ~urfaces 29 and 31 movable with respect to one another. Noreover, the surfaces 29 and 31 are connected to a heating ~ource (not shown) and to a source of compres~ive force (not shown).
Rositioned on one of the pair of surfaces 29 snd 31 and adjacent the printed circuit 23 is a deformable material layer 33. This deformable material layer 33 is of a material ruch as silicon rubber and, more ~pecificslly, of a material such as a fiberglass fabric hi~h temperature elastomeric composite material known as Grade 5539~RO45 (Trade Hark), available from the ~eene Corporation, Chase-Foster Divi~ion, Bear, Delaware l9~Ol. ~oreover, the above-mentioned elastomeric material is recl -nded for temperatures up to sbout 500 F for a limited period of time.
~ ore specifically, the laminating process includes the applicativn of a curable adhesive 25 to one ~urface of the metallic printed circuit 23. The adhesive-covered printed circuit 23 is positioned with the sdhesive 25 adjacent a circuit board 27.
Thereafter, the printed circuit 23 and circuit board 27 are lo~ated intermediate the pair of surfaces 29 and 31 which are movable with respect to one another. In addition, the layer of elastomeric material 33 positioned on the surface 31 of the pair of surfaces 29 and 31 is adjacent ~he printed cirruit 23.
Thereafter, the surfaces 29 and 31 are mo~ed toward one another in an amount sufficient to exert 8 compressive force in the range of about lOO to 500 pounds per squ~re inch on the printed circuit 23 ~ .
.i .
~2C~
and circuit board 27. Simultaneou61y, the pr~nte~ circuit 23 having the adhesive 25 thereon and the circuit board 27 are heate~ in an amount and for a time sufficient to cause t~e printed circuit 23 to become affixed to the circuit bo~rd 27.
Preferably, the printed circuit 23 and circult board 27 are heated to a temperature in the range of sbout 360 to 550 P.
Noreover, the heatin~ of the printed circuit 23 and circuit boar~ 27 i~ effected or a period not ~reater than about 30 seconds and preferably Por a period in the ran~e of about 4 to 20 ~econds.
~hus, the printed circuit 23 and circuit board 27 are subjected to compressiYe force in the ran~e of about 100 to 500 pounds per square inch, a temperature in the ran~e of about 360 to 550 F, ~nd for a period not ~reater than about 30 ~econds.
Alternatively, PIG. 3 illustrates a quick-cure laminating process for multi-lamp photoflash arrays wherein the above-mentioned elastomeric material layer 33 of FIG. 2 is not require~. Herein, an adhecive is applied to a surface of 8 printed circuit 35, and the printed circuit 35 i~ ~ositioned adjacent a circuit board 37 of a deformable material. A preferred deformable material circuit board 37 is known as "Duroid" (Trade ~ark), manufactured by the Rogers Corporation of Ro~ers, Connecticut 06263.
Thereafter, the printed circuit 35 and circuit board 37 of defonmable material are located intermediate a pair of surfaces 39 and 41 which are movable with respect to one another. The surfaces 39 and 41 are activated to exert a compressive force on the printed ~ircuit 35 and circuit board 37 in the ran~e of about 100 to 500 pounds per ~quare inch. Simultaneously, heat is applied to the printed cireuit 35 and circuit board 37 in an amount ~nd for a ti~e suficient to cure the adhesive and effect attachment therebetween.
Specifically, the simultaneous application to the printed circuit 35 and circuit board 37 of compressive force in the range of about 100 to 500 pounds per square inch, at a temperature in the ran~e of about 360 to 500~ F and for a period not ~reater than about 30 seconds is sufficient to effect the desired attachment.
Horeover, the circuit board 37 of deformable material serves to contain the adhesive intermediste the printed circuit 35 and circuit board 37 thereby eliminat~ng the need for a blotter or other form~
of adheslve absorbent.
~ hile there has been shown and described what is at present con~idered the preferred embodiments of the invention, it ~ e obvious to those skilled in the art that ~arious changes and mGdifications may be ~ade therein without departin~ from the invention 85 defined by the appended claims.
INDUSTRIAL APPLICABILITY
An enhanced quick-cure laminating process for multi-lamp photoflash arrays has been provided wherein a metallic printed circuit i~ attachable to a circuit board in a period of less than about 30 6econds. The process not only provides a very ~reat reduction in cycle time required to effect such a printed circuit-circuit board nttar' - t, but also provi~es an obvious i~p~v~c t in manufacture and manufacturing cost. ~oreover, the utilization of a deformable material in the msnufacturing process virtl~ally eliminates the need for blotter materials for absorbing excess adhe~ives which, in turn, further reduces materials snd 20 material costs.
Claims (12)
1. A quick-cure laminating process for a multi-lamp photoflash array comprising the steps of applying a curable adhesive to one surface of a metallic printed circuit;
positioning said metallic printed circuit and a printed circuit board intermediate a pair of spaced surfaces movable with respect to one another, said surface adjacent said metallic printed circuit being a layer of fiberglass fabric high temperature elastomeric composite material deformable to conform to said metallic printed circuit configuration;
moving said spaced surfaces to provide intimate contact between said metallic printed circuit and said printed circuit board with said composite material deforming and containing said metallic printed circuit intermediate thereto and said printed circuit board;
and heating said contacting metallic printed circuit and said printed circuit board to a temperature and for a time sufficient to sure said adhesive and affix said metallic printed circuit to said printed circuit board.
positioning said metallic printed circuit and a printed circuit board intermediate a pair of spaced surfaces movable with respect to one another, said surface adjacent said metallic printed circuit being a layer of fiberglass fabric high temperature elastomeric composite material deformable to conform to said metallic printed circuit configuration;
moving said spaced surfaces to provide intimate contact between said metallic printed circuit and said printed circuit board with said composite material deforming and containing said metallic printed circuit intermediate thereto and said printed circuit board;
and heating said contacting metallic printed circuit and said printed circuit board to a temperature and for a time sufficient to sure said adhesive and affix said metallic printed circuit to said printed circuit board.
2. The quick-cure laminating process of Claim 1 wherein said heating of said metallic printed circuit and said printed circuit board is at a temperature in the range of about 360 to 550° F.
3. The quick-cure laminating process of Claim 1 wherein said heating of said metallic printed circuit and said printed circuit board is for a period not greater than about 30 seconds.
4. The quick-cure laminating process of Claim 1 wherein said heating of said metallic printed circuit and said printed circuit board is at a pressure in the range of about 100 to 500 pounds per square inch.
5. The quick-cure laminating process of Claim 1 wherein said printed circuit board is of a deformable material and said surface adjacent said metallic printed circuit is of a non-deformable material.
6. The quick-cure laminating process of Claim 1 wherein said heating of said metallic printed circuit and said printed circuit board is at a temperature in the range of about 360 to 550° F for a period not greater than about 30 seconds and under pressure in the range of about 100 to 500 pounds per square inch.
7. In a quick-cure laminating process wherein a metallic circuit has an adhesive on one surface and a printed circuit board with an uneven surface is positioned adjacent said adhesive-coated surface of said metallic circuit, the improvement comprising positioning said circuit and circuit board intermediate a pair of surfaces movable with respect to one another with one of said pair of surfaces adjacent said metallic circuit being a layer of resilient rubber, moving said surfaces to exert a pressure between said printed circuit board and said metallic circuit and heating said metallic circuit and printed circuit board under said pressure to a temperature and for a period not greater than about 30 seconds to cure said adhesive and affix said metallic circuit to said printed circuit board.
8. The improvement of Claim 7 wherein said metallic circuit and printed circuit board are heated to a temperature in the range of about 360 to 550° F.
9. The improvement of Claim 7 wherein said pressure exerted on said metallic circuit and printed circuit board during said heating is in the range of about 100 to 500 pounds per square inch.
10. The improvement of Claim 7 wherein said pressure exerted on said metallic circuit and printed circuit board is in the range of about 100 to 500 pounds per square inch, and said temperature is in the range of about 360 to 550° F.
11. The improvement of Claim 7 wherein said surface adjacent said metallic circuit is a non-deformable surface and said printed circuit board is a deformable material.
12. The improvement of Claim 7 including the step of preheating said printed circuit board prior to said exertion of pressure on and heating of said metallic circuit and printed circuit board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US298,864 | 1981-09-03 | ||
| US06/298,864 US4935090A (en) | 1981-09-03 | 1981-09-03 | Photoflash array quick-cure laminating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1204919A true CA1204919A (en) | 1986-05-27 |
Family
ID=23152296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000410675A Expired CA1204919A (en) | 1981-09-03 | 1982-09-02 | Photoflash array quick-cure laminating process |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4935090A (en) |
| EP (1) | EP0074065A3 (en) |
| JP (1) | JPS5882595A (en) |
| CA (1) | CA1204919A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5470644A (en) * | 1994-04-21 | 1995-11-28 | Durant; David | Apparatus and method for fabrication of printed circuit boards |
| US5607538A (en) * | 1995-09-07 | 1997-03-04 | Ford Motor Company | Method of manufacturing a circuit assembly |
| US6059917A (en) * | 1995-12-08 | 2000-05-09 | Texas Instruments Incorporated | Control of parallelism during semiconductor die attach |
| JPH09289360A (en) * | 1996-04-19 | 1997-11-04 | Matsushita Electric Ind Co Ltd | Wiring between and manufacturing method thereof |
| US5882954A (en) * | 1997-10-06 | 1999-03-16 | Ford Motor Company | Method for adhering a metallization to a substrate |
| US5903440A (en) * | 1998-01-30 | 1999-05-11 | Delco Electronics Corporaiton | Method of forming assemblies of circuit boards in different planes |
| DE10118866A1 (en) * | 2001-04-18 | 2002-10-24 | Swoboda Gmbh Geb | Radar antenna with metal foil coating is made by separate injection molding of plastic part and electroforming of metal foil and joining them with adhesive |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2957227A (en) * | 1955-07-15 | 1960-10-25 | Benjamin B Scott | Method of making electrical resistance cards |
| US2969300A (en) * | 1956-03-29 | 1961-01-24 | Bell Telephone Labor Inc | Process for making printed circuits |
| DE1082046B (en) * | 1958-06-04 | 1960-05-19 | Henkel & Cie Gmbh | Process for improving the water tolerance of aminotriazine-aldehyde condensates |
| US3059320A (en) * | 1958-06-23 | 1962-10-23 | Ibm | Method of making electrical circuit |
| FR1260273A (en) * | 1960-05-11 | 1961-05-05 | Ici Ltd | Cushions for presses applicable to the manufacture of laminated articles by hot or cold pressing |
| CH475846A (en) * | 1965-07-05 | 1969-07-31 | Dynamit Nobel Ag | Polyamide plate or tube intended as a carrier for copper layers |
| US3547724A (en) * | 1967-02-07 | 1970-12-15 | Rogers Corp | Method of and apparatus for producing printed circuits |
| US3962520A (en) * | 1973-06-20 | 1976-06-08 | Sumitomo Bakelite Company, Limited | Adhesive composition for flexible printed circuit and method for using the same |
| US3940534A (en) * | 1973-11-07 | 1976-02-24 | G. T. Schjeldahl Company | Electrical laminate |
| US3969177A (en) * | 1974-06-24 | 1976-07-13 | International Business Machines Corporation | Laminating method |
| US4159921A (en) * | 1975-08-06 | 1979-07-03 | Sharp Kabushiki Kaisha | Method of connecting an element having multiple terminals and a multi-lead flexible connector |
| US4016021A (en) * | 1976-03-29 | 1977-04-05 | Fleur Lee | Heat sealing unit and method of making same |
| US4078962A (en) * | 1976-11-05 | 1978-03-14 | Seal Incorporated | Vacuum press |
| US4302794A (en) * | 1979-09-04 | 1981-11-24 | Gte Products Corporation | Linear multilamp photoflash unit |
| US4320572A (en) * | 1980-03-19 | 1982-03-23 | Gte Products Corporation | Die-stamped circuit board assembly having relief means-method of making |
| US4325771A (en) * | 1980-03-19 | 1982-04-20 | Gte Products Corporation | Method of making a die-stamped circuit board assembly for photoflash devices |
-
1981
- 1981-09-03 US US06/298,864 patent/US4935090A/en not_active Expired - Fee Related
-
1982
- 1982-08-31 EP EP82108010A patent/EP0074065A3/en not_active Withdrawn
- 1982-09-02 CA CA000410675A patent/CA1204919A/en not_active Expired
- 1982-09-03 JP JP57152890A patent/JPS5882595A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0074065A2 (en) | 1983-03-16 |
| EP0074065A3 (en) | 1984-02-22 |
| US4935090A (en) | 1990-06-19 |
| JPS5882595A (en) | 1983-05-18 |
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| MKEX | Expiry |