CA1183280A - Integrated circuit chip carrier - Google Patents
Integrated circuit chip carrierInfo
- Publication number
- CA1183280A CA1183280A CA000394439A CA394439A CA1183280A CA 1183280 A CA1183280 A CA 1183280A CA 000394439 A CA000394439 A CA 000394439A CA 394439 A CA394439 A CA 394439A CA 1183280 A CA1183280 A CA 1183280A
- Authority
- CA
- Canada
- Prior art keywords
- base
- chip
- chip carrier
- holes
- tracks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Abstract
ABSTRACT OF THE DISCLOSURE
A leadless chip carrier, comprises a base of plastics material having a sidewall of plastics material connected to a top surface of the base and extending around the peri-phery of the chip carrier so as to define a chip mounting cavity on the base. A metallization pattern formed on the base comprises tracks of electrically conductive material extending from first connecting points in the chip mounting cavity to second connecting points on the periphery of the chip carrier.
A leadless chip carrier, comprises a base of plastics material having a sidewall of plastics material connected to a top surface of the base and extending around the peri-phery of the chip carrier so as to define a chip mounting cavity on the base. A metallization pattern formed on the base comprises tracks of electrically conductive material extending from first connecting points in the chip mounting cavity to second connecting points on the periphery of the chip carrier.
Description
~3328~
This invention relates to an integrated circuit chip carr;er. More particularly it relates to a chip carrier made from a plastics material.
Known forms of chip carrier consist of a usually rectangular base Or ceramic material. A central area on the base is provided on to which an integrated circuit chip or die is mounted and secured, for example using an epoxy resin adhesive. Leads are then connected between ,the appropriate points on the die to metal bonding pads provided on the carrier base. A preformed metallization pattern on the carrier base connects the bonding pads to -termina:l contacts formed around the periphery of the base.
A metal or ceramic lid is th'en secured over the base so as to enclose and protect the die. The ceramic c~ip carrier is thereafter mounted on a printed circuit board together with a series Or other chip carriers and electronic components that go to form the complete circuit.
.~ " ~- .
3'~
The use of ceramic material for the chip carrier is expensive and pro~lems can also arise when the ceramic base is later bonded to a conventional epoxy/
glass prin-ted circuit board, due to the differen-tial S expansion between the two ma-terials. In extreme envi.ronmen-tal condi-tions the ceramic chip carrier can break away from the printed circuit board.
According to the presen-t inven-tion we provide a ].eadless chip earrier which comprises a base of plastics material; a sidewall of plastics ma-terial connected -to a top sur.Eace o:~ the base and extending around the peri-phery of the chip carrier so as to deEine a chip mounting cavity on the base; and a me-talliza-tion pat-tern formed I.S on the hase ancl compris.ing a p]urali-ty o:E tracks of cl.f.~ct.r;Laali.~ eQnduc~t:Lve materi.a]. ex~end:ing Erom fi.rst connec~inc.5 po.l.nts in the ch:ip mounting cavity -to second eonnec~;i.n~ points on the per:i.phery o:E the ch:ip carr:ier.
~ccordincl to a feature of the invention, we also provide an array of chip carriers comprising a base of plastlcs materi.al; a plurality of holes e~tending through the base; and a metallization pa-ttern formed on the base and eompr:Ls:Lng a plurality of trac]cs of conductive matf3r:lal extend:Lng througll the holes; a gr:Ld oE plastics ~3~V
- 2a -material connected to the base and covering the holes, the grid forming sidewalls defining a plurality of chip mounting cavlties on the base; and the tracks extending frorn first connec-tion points in each of the cavities -to -the holes; the array being separable along the grid to form a plurality of individual chip carriers.
Also according to -the invention there is provided a method of forming a leadless chip carrier, comp.rising the steps o:E forming on a -top surface of a base of plastic~q mater.ial a metallization pattern comprising a plura:L:I.ty o:E tracks oE electrical:Ly conduc-ti.ve rna-terial;
and connectlng a sidewall -to the top surfacel the sidewall de:Ein:Lng a chip mounting cavity on the base.
:1.5 ~ pr~.~errecl embod:Lment o:E the invention will. now be clescrib~c~ by way of examp.l.e with reference to the accom-pany:Ln~ clraw;l.ncJs :Ln Wllich:
F:lcJure 1 is a plan view of part of an array of chip carriers before separation shown a-t approximately three times ac-tual size.
3;~
Figure 2 is an enlarged cross sectional view taken along the line A-A of Figure 1.
A series Or chip carriers embodying the invention are formed from a base sheet 10 of' a plastics 5 material, for example glass reinforced epoxy resin sut,h as is conventionally used in printed circuit board manuracture .
The base sheet 10 is rormed w;.th a series of rectangular arrays Or metal pads 12, each Or the arrays tdt-~.r:;n:lng arl incli.vidual ch;.p carrier. A series of holes are rorrned in t;~e sheet 10, one of which is shown at 14 in ~igure 2. A plated through metallization 16 formed ;n each of t,he holes 1ll connects each Or the pads :12 to a corrt?spon~ling pad :I..8 on the un(~e.rs;.de Or tile sheet 10.
'rhe pads :I.2 and 1~ and the plated-tl~rt)u~h nleta].lization 16 arce al:l.;~orlnt?cl by c~ollvt?nti.onc~ tc~ hniq-les uc,ed in prLrll.e~l t~,.i.xlcu:;.t board rnanu.racl,ure, antl are pref'erably ~ormed O.r copper plated with gold or a nickel-gold alloy.
A grid 20 formed Or the same material as the base 10, is bonded to the base 10~ the arrns 22 of the grid ext,ending over the lines Or holes 14 and over the port:;on o:E the metallization 16 formed on the upper ~,urrace Or the base 10.
A series of in-tegra-ted circuit dice 24 are then bonded on to base 10 in the centre of each of the arrays formed by the pads 12. Only a single die 24 is shown in Figure 1 but it is to be understood that a die will be mounted in each of the eight illustra-ted arrays. The die 24 is preferably bonded to the base 10 by means of an epoxy adhesive coT~patible with the material oF the base 10. Leads 26 are -then connected be-tween -the appropria-te points on -the die 24 and each of the pads 12,in a process known as n "wii~e bond:ing". Tl;~ number and di-,position of the pads 12 can be de-termined in advance so as -to correspond to the external connections on -the die 24.
I-t can be seen ~rom Figure 2 that each of -the dlce 2l~ is positioned in a cavity or depression formed by the arTns 22 o~ the ~rid 20. This cavity can be ;~illed with a layer of coa-ting ma-terial made o~ a 41astics material, which serves~-to enclose and pro-tec-t the d~.e 2l~. Therecl~ter a covcr sheet (not shown) prc~erab:Ly :tormed o~ -the same ma-terial as the base 10, may be secured over -the grid 20 to form a pro-tective cover (known as a "lid") for each of the chip carriers.
Alternatively, a fur-ther layer of the coa-ting ma-terial cou]d be applied ins-tead of a lid.
Once the dice 24 have been moun-ted and the 2S appropriate pro-tective covering has been applied~ -the ~ 3,~
whole array is then separa-ted to form the individual chip carriers. This is done by cutting with a diamond saw along the centre lines of the arms 22 of the grid 20, on the axis X-X shown in Figure 2. The resulting individual, leadless chip carriers can be mounted on prin-ted circuit boards, to~e-ther with other circuit components, using the pads 18 to interconnec-t to a preformed me-tallization pattern on the circuit board in lcnown manner.
It can be seen -tha-t as the chip carrier can be made of conventional printed circui-t board ma-terial eg, glass/epoxy, it would be possible in some cases for the chip carrier to be formed in-tegrally with a printed circuit board. In such a case, -the grid 20 w~ulcl be in tlle ~orm of a single rec-tangle moun-ted on t~e upper surface of -the prin-ted circui-t board.
A~ter?natively, where -the board.is of multilayer laM.in~ted constructlon, the -top layer of the board may be formed with a cut-ou-t portion and -the me-tallization ,~ 20 pads 12 are formed on the next layer down such -that when the top layer is laMina-ted onto the rest of -the board, the chip carrier i.s defined by a cavity in -the upper surface of the board. The me-tallization pads 12 would be integral with -the me-tallization pat-tern on -the rest of -the prin-ted circui-t board and -the plated--through metalliz,atiorl 16 and pads 18 would be dispensed with.
~3~
I-t can be appreciated that the mounting of t'ne circuit dice 24 and -the subsequen-t processing up to the point at which the individual chip carriers are separated i5 carried out with an array whi,ch is much easier -to handle than are the individual chip carriers, and which can readily be processed by au-toma-tic assembly appara-tus. In addition the formation of -the base 10 and the grid 20 from conventional glass/epoxy printed circuit board material allows well tried and -tested techniques to be used and also greatly reduces the cos-t of the ~i.nal item.
The chip carriers in which -the circuit dice are pro-tec-ted as described have exhibited high reliabili-ty :;n concli.-tior~of high humidi-ty. Complete packages have bcen successfully -tes-ted at 90% rela-tive humidity ancl 110C for 2,00() hours.
This invention relates to an integrated circuit chip carr;er. More particularly it relates to a chip carrier made from a plastics material.
Known forms of chip carrier consist of a usually rectangular base Or ceramic material. A central area on the base is provided on to which an integrated circuit chip or die is mounted and secured, for example using an epoxy resin adhesive. Leads are then connected between ,the appropriate points on the die to metal bonding pads provided on the carrier base. A preformed metallization pattern on the carrier base connects the bonding pads to -termina:l contacts formed around the periphery of the base.
A metal or ceramic lid is th'en secured over the base so as to enclose and protect the die. The ceramic c~ip carrier is thereafter mounted on a printed circuit board together with a series Or other chip carriers and electronic components that go to form the complete circuit.
.~ " ~- .
3'~
The use of ceramic material for the chip carrier is expensive and pro~lems can also arise when the ceramic base is later bonded to a conventional epoxy/
glass prin-ted circuit board, due to the differen-tial S expansion between the two ma-terials. In extreme envi.ronmen-tal condi-tions the ceramic chip carrier can break away from the printed circuit board.
According to the presen-t inven-tion we provide a ].eadless chip earrier which comprises a base of plastics material; a sidewall of plastics ma-terial connected -to a top sur.Eace o:~ the base and extending around the peri-phery of the chip carrier so as to deEine a chip mounting cavity on the base; and a me-talliza-tion pat-tern formed I.S on the hase ancl compris.ing a p]urali-ty o:E tracks of cl.f.~ct.r;Laali.~ eQnduc~t:Lve materi.a]. ex~end:ing Erom fi.rst connec~inc.5 po.l.nts in the ch:ip mounting cavity -to second eonnec~;i.n~ points on the per:i.phery o:E the ch:ip carr:ier.
~ccordincl to a feature of the invention, we also provide an array of chip carriers comprising a base of plastlcs materi.al; a plurality of holes e~tending through the base; and a metallization pa-ttern formed on the base and eompr:Ls:Lng a plurality of trac]cs of conductive matf3r:lal extend:Lng througll the holes; a gr:Ld oE plastics ~3~V
- 2a -material connected to the base and covering the holes, the grid forming sidewalls defining a plurality of chip mounting cavlties on the base; and the tracks extending frorn first connec-tion points in each of the cavities -to -the holes; the array being separable along the grid to form a plurality of individual chip carriers.
Also according to -the invention there is provided a method of forming a leadless chip carrier, comp.rising the steps o:E forming on a -top surface of a base of plastic~q mater.ial a metallization pattern comprising a plura:L:I.ty o:E tracks oE electrical:Ly conduc-ti.ve rna-terial;
and connectlng a sidewall -to the top surfacel the sidewall de:Ein:Lng a chip mounting cavity on the base.
:1.5 ~ pr~.~errecl embod:Lment o:E the invention will. now be clescrib~c~ by way of examp.l.e with reference to the accom-pany:Ln~ clraw;l.ncJs :Ln Wllich:
F:lcJure 1 is a plan view of part of an array of chip carriers before separation shown a-t approximately three times ac-tual size.
3;~
Figure 2 is an enlarged cross sectional view taken along the line A-A of Figure 1.
A series Or chip carriers embodying the invention are formed from a base sheet 10 of' a plastics 5 material, for example glass reinforced epoxy resin sut,h as is conventionally used in printed circuit board manuracture .
The base sheet 10 is rormed w;.th a series of rectangular arrays Or metal pads 12, each Or the arrays tdt-~.r:;n:lng arl incli.vidual ch;.p carrier. A series of holes are rorrned in t;~e sheet 10, one of which is shown at 14 in ~igure 2. A plated through metallization 16 formed ;n each of t,he holes 1ll connects each Or the pads :12 to a corrt?spon~ling pad :I..8 on the un(~e.rs;.de Or tile sheet 10.
'rhe pads :I.2 and 1~ and the plated-tl~rt)u~h nleta].lization 16 arce al:l.;~orlnt?cl by c~ollvt?nti.onc~ tc~ hniq-les uc,ed in prLrll.e~l t~,.i.xlcu:;.t board rnanu.racl,ure, antl are pref'erably ~ormed O.r copper plated with gold or a nickel-gold alloy.
A grid 20 formed Or the same material as the base 10, is bonded to the base 10~ the arrns 22 of the grid ext,ending over the lines Or holes 14 and over the port:;on o:E the metallization 16 formed on the upper ~,urrace Or the base 10.
A series of in-tegra-ted circuit dice 24 are then bonded on to base 10 in the centre of each of the arrays formed by the pads 12. Only a single die 24 is shown in Figure 1 but it is to be understood that a die will be mounted in each of the eight illustra-ted arrays. The die 24 is preferably bonded to the base 10 by means of an epoxy adhesive coT~patible with the material oF the base 10. Leads 26 are -then connected be-tween -the appropria-te points on -the die 24 and each of the pads 12,in a process known as n "wii~e bond:ing". Tl;~ number and di-,position of the pads 12 can be de-termined in advance so as -to correspond to the external connections on -the die 24.
I-t can be seen ~rom Figure 2 that each of -the dlce 2l~ is positioned in a cavity or depression formed by the arTns 22 o~ the ~rid 20. This cavity can be ;~illed with a layer of coa-ting ma-terial made o~ a 41astics material, which serves~-to enclose and pro-tec-t the d~.e 2l~. Therecl~ter a covcr sheet (not shown) prc~erab:Ly :tormed o~ -the same ma-terial as the base 10, may be secured over -the grid 20 to form a pro-tective cover (known as a "lid") for each of the chip carriers.
Alternatively, a fur-ther layer of the coa-ting ma-terial cou]d be applied ins-tead of a lid.
Once the dice 24 have been moun-ted and the 2S appropriate pro-tective covering has been applied~ -the ~ 3,~
whole array is then separa-ted to form the individual chip carriers. This is done by cutting with a diamond saw along the centre lines of the arms 22 of the grid 20, on the axis X-X shown in Figure 2. The resulting individual, leadless chip carriers can be mounted on prin-ted circuit boards, to~e-ther with other circuit components, using the pads 18 to interconnec-t to a preformed me-tallization pattern on the circuit board in lcnown manner.
It can be seen -tha-t as the chip carrier can be made of conventional printed circui-t board ma-terial eg, glass/epoxy, it would be possible in some cases for the chip carrier to be formed in-tegrally with a printed circuit board. In such a case, -the grid 20 w~ulcl be in tlle ~orm of a single rec-tangle moun-ted on t~e upper surface of -the prin-ted circui-t board.
A~ter?natively, where -the board.is of multilayer laM.in~ted constructlon, the -top layer of the board may be formed with a cut-ou-t portion and -the me-tallization ,~ 20 pads 12 are formed on the next layer down such -that when the top layer is laMina-ted onto the rest of -the board, the chip carrier i.s defined by a cavity in -the upper surface of the board. The me-tallization pads 12 would be integral with -the me-tallization pat-tern on -the rest of -the prin-ted circui-t board and -the plated--through metalliz,atiorl 16 and pads 18 would be dispensed with.
~3~
I-t can be appreciated that the mounting of t'ne circuit dice 24 and -the subsequen-t processing up to the point at which the individual chip carriers are separated i5 carried out with an array whi,ch is much easier -to handle than are the individual chip carriers, and which can readily be processed by au-toma-tic assembly appara-tus. In addition the formation of -the base 10 and the grid 20 from conventional glass/epoxy printed circuit board material allows well tried and -tested techniques to be used and also greatly reduces the cos-t of the ~i.nal item.
The chip carriers in which -the circuit dice are pro-tec-ted as described have exhibited high reliabili-ty :;n concli.-tior~of high humidi-ty. Complete packages have bcen successfully -tes-ted at 90% rela-tive humidity ancl 110C for 2,00() hours.
Claims (10)
1. A leadless chip carrier, comprising:
a base of plastics material;
a sidewall of plastics material connected to a top surface of said base and extending around the periphery of said chip carrier so as to define a chip mounting cavity on said base; and a metallization pattern formed on said base and com-prising a plurality of tracks of electrically conductive material extending from first connecting points in said chip mounting cavity to second connecting points on the periphery of said chip carrier.
a base of plastics material;
a sidewall of plastics material connected to a top surface of said base and extending around the periphery of said chip carrier so as to define a chip mounting cavity on said base; and a metallization pattern formed on said base and com-prising a plurality of tracks of electrically conductive material extending from first connecting points in said chip mounting cavity to second connecting points on the periphery of said chip carrier.
2. A leadless chip carrier as claimed in claim 1, wherein said base forms part of a printed circuit board and wherein said second connecting points are connected directly to tracks of conductive material formed on said printed circuit board.
3. A leadless chip carrier as claimed in claim l, wherein said second connecting points are formed on the underside of said base and wherein said tracks of conductive material extend through plated-through holes formed in said base.
4. A leadless chip carrier as claimed in claim 1 or 3, wherein said plastics material has a thermal expan-sion coefficient at least approximately equal to that of a printed circuit board.
5. A leadless chip carrier as claimed in claim 1, including a chip mounted in said cavity, and a plastics material filling residual space in said cavity around said chip.
6. A leadless chip carrier as claimed in claim 5, including a lid covering said cavity.
7. A leadless chip carrier as claimed in claim 6, wherein said base, said sidewall and said chip are made of the same plastics material.
8. An array of chip carriers, comprising:
a base of plastics material;
a plurality of holes extending through said base;
and a metallization pattern formed on said base and com-prising a plurality of tracks of conductive material extend-ing through said holes;
a grid of plastics material connected to said base and covering said holes, said grid forming sidewalls de-fining a plurality of chip mounting cavities on said base;
and said tracks extending from first connection points in each of said cavities to said holes;
said array being separable along said grid to form a plurality of individual chip carriers.
a base of plastics material;
a plurality of holes extending through said base;
and a metallization pattern formed on said base and com-prising a plurality of tracks of conductive material extend-ing through said holes;
a grid of plastics material connected to said base and covering said holes, said grid forming sidewalls de-fining a plurality of chip mounting cavities on said base;
and said tracks extending from first connection points in each of said cavities to said holes;
said array being separable along said grid to form a plurality of individual chip carriers.
9. A method of forming a leadless chip carrier, com-prising the steps of:
forming on a top surface of a base of plastics material a metallization pattern comprising a plurality of tracks of electrically conductive material; and connecting a sidewall to said top surface, said sidewall defining a chip mounting cavity on said base.
forming on a top surface of a base of plastics material a metallization pattern comprising a plurality of tracks of electrically conductive material; and connecting a sidewall to said top surface, said sidewall defining a chip mounting cavity on said base.
10. A method as claimed in claim 9, which includes forming holes through said base, extending said tracks through said holes, providing said sidewall as part of a grid onto said base over said holes and defining a plurality of chip mounting cavities, and separating said base sheet and said grid into a plurality of individual chip carriers by cutting along lines extending along said grid.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8103840 | 1981-02-09 | ||
| GB8103840 | 1981-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1183280A true CA1183280A (en) | 1985-02-26 |
Family
ID=10519540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000394439A Expired CA1183280A (en) | 1981-02-09 | 1982-01-19 | Integrated circuit chip carrier |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US4448306A (en) |
| EP (1) | EP0058068B1 (en) |
| AU (1) | AU559141B2 (en) |
| CA (1) | CA1183280A (en) |
| DE (1) | DE3280266D1 (en) |
| IE (1) | IE56411B1 (en) |
| NZ (1) | NZ199549A (en) |
| ZA (1) | ZA82368B (en) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1183280A (en) * | 1981-02-09 | 1985-02-26 | Francis N. Sinnadurai | Integrated circuit chip carrier |
| FR2521350B1 (en) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | SEMICONDUCTOR CHIP HOLDER |
| AU598253B2 (en) * | 1986-05-07 | 1990-06-21 | Digital Equipment Corporation | System for detachably mounting semi-conductors on conductor substrates |
| US5131535A (en) * | 1986-06-27 | 1992-07-21 | Symtek Systems, Inc. | Electrical device transport medium |
| US4837050A (en) * | 1986-09-30 | 1989-06-06 | Asahi Chemical Research Laboratory Co., Ltd. | Method for producing electrically conductive circuits on a base board |
| US4681221A (en) * | 1986-10-30 | 1987-07-21 | International Business Machines Corporation | Holder for plastic leaded chip carrier |
| US4931906A (en) * | 1988-03-25 | 1990-06-05 | Unitrode Corporation | Hermetically sealed, surface mountable component and carrier for semiconductor devices |
| DE3931634A1 (en) * | 1989-09-22 | 1991-04-04 | Telefunken Electronic Gmbh | SEMICONDUCTOR COMPONENT |
| US5148265A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
| US7198969B1 (en) * | 1990-09-24 | 2007-04-03 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
| FR2675632B1 (en) * | 1991-04-18 | 1997-04-30 | Texas Instruments France | INTEGRATED CIRCUIT CONDITIONING DEVICE |
| US5483421A (en) * | 1992-03-09 | 1996-01-09 | International Business Machines Corporation | IC chip attachment |
| US5203452A (en) * | 1992-03-13 | 1993-04-20 | Illinois Tool Works, Inc. | Shipping tray |
| US5246129A (en) * | 1992-03-13 | 1993-09-21 | Illinois Tool Works, Inc. | Shipping tray and cover strip |
| JP3541491B2 (en) * | 1994-06-22 | 2004-07-14 | セイコーエプソン株式会社 | Electronic components |
| JP2688664B2 (en) * | 1994-09-07 | 1997-12-10 | シノン電気産業株式会社 | Tray for semiconductor device |
| US5832600A (en) * | 1995-06-06 | 1998-11-10 | Seiko Epson Corporation | Method of mounting electronic parts |
| US5938956A (en) * | 1996-09-10 | 1999-08-17 | Micron Technology, Inc. | Circuit and method for heating an adhesive to package or rework a semiconductor die |
| US6426484B1 (en) | 1996-09-10 | 2002-07-30 | Micron Technology, Inc. | Circuit and method for heating an adhesive to package or rework a semiconductor die |
| US6229323B1 (en) | 1998-04-23 | 2001-05-08 | Micron Technology, Inc. | Automated multi-chip module handler, method of module handling, and module magazine |
| JP3877454B2 (en) | 1998-11-27 | 2007-02-07 | 三洋電機株式会社 | Manufacturing method of semiconductor device |
| US7112305B2 (en) * | 2001-01-31 | 2006-09-26 | Agilent Technologies, Inc. | Automation-optimized microarray package |
| US20040105244A1 (en) * | 2002-08-06 | 2004-06-03 | Ilyas Mohammed | Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions |
| JP6485776B2 (en) * | 2016-05-31 | 2019-03-20 | 大口マテリアル株式会社 | Wiring member for multi-row type semiconductor device and manufacturing method thereof |
| JP6485777B2 (en) * | 2016-05-31 | 2019-03-20 | 大口マテリアル株式会社 | Wiring member for multi-row type semiconductor device and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3349481A (en) * | 1964-12-29 | 1967-10-31 | Alpha Microelectronics Company | Integrated circuit sealing method and structure |
| US3441853A (en) * | 1966-06-21 | 1969-04-29 | Signetics Corp | Plug-in integrated circuit package and carrier assembly and including a test fixture therefor |
| US3454154A (en) * | 1968-05-07 | 1969-07-08 | Us Air Force | Integrated circuit carrier |
| US3673543A (en) * | 1970-04-27 | 1972-06-27 | Thomas & Betts Corp | Micro-circuit pack receptacle |
| US4099615A (en) * | 1974-08-22 | 1978-07-11 | Amp, Incorporated | Carrier strip mounted electrical components |
| US3940849A (en) * | 1974-09-09 | 1976-03-02 | Minter Jerry B | Method for handling connectors |
| US4026412A (en) * | 1974-09-26 | 1977-05-31 | Henson Richard D | Electronic circuit carrier and test fixture |
| GB1515160A (en) * | 1975-11-28 | 1978-06-21 | Plessey Co Ltd | Electrically integrated circuit package protectors |
| JPS5384681A (en) * | 1976-12-29 | 1978-07-26 | Mitsumi Electric Co Ltd | Method of producing leadless package |
| JPS53114067A (en) * | 1977-03-15 | 1978-10-05 | Tokyo Shibaura Electric Co | Electronic part device and method of producing same |
| US4227298A (en) * | 1978-09-05 | 1980-10-14 | Motorola, Inc. | Method for interconnecting photovoltaic devices |
| US4223368A (en) * | 1978-09-14 | 1980-09-16 | Dattilo Donald P | Electrostatic discharge protection device |
| FR2439438A1 (en) * | 1978-10-19 | 1980-05-16 | Cii Honeywell Bull | RIBBON CARRYING ELECTRIC SIGNAL PROCESSING DEVICES, MANUFACTURING METHOD THEREOF AND APPLICATION THEREOF TO A SIGNAL PROCESSING ELEMENT |
| US4329642A (en) * | 1979-03-09 | 1982-05-11 | Siliconix, Incorporated | Carrier and test socket for leadless integrated circuit |
| CA1183280A (en) * | 1981-02-09 | 1985-02-26 | Francis N. Sinnadurai | Integrated circuit chip carrier |
-
1982
- 1982-01-19 CA CA000394439A patent/CA1183280A/en not_active Expired
- 1982-01-20 ZA ZA82368A patent/ZA82368B/en unknown
- 1982-01-21 AU AU79709/82A patent/AU559141B2/en not_active Expired
- 1982-01-22 NZ NZ199549A patent/NZ199549A/en unknown
- 1982-01-25 US US06/342,358 patent/US4448306A/en not_active Expired - Lifetime
- 1982-02-04 IE IE247/82A patent/IE56411B1/en not_active IP Right Cessation
- 1982-02-08 EP EP82300596A patent/EP0058068B1/en not_active Expired - Lifetime
- 1982-02-08 DE DE8282300596T patent/DE3280266D1/en not_active Expired - Lifetime
-
1983
- 1983-12-20 US US06/563,622 patent/US4595096A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| ZA82368B (en) | 1983-01-26 |
| IE56411B1 (en) | 1991-07-31 |
| AU7970982A (en) | 1982-08-19 |
| AU559141B2 (en) | 1987-02-26 |
| NZ199549A (en) | 1985-01-31 |
| IE820247L (en) | 1982-08-09 |
| EP0058068B1 (en) | 1990-10-31 |
| EP0058068A3 (en) | 1982-09-08 |
| DE3280266D1 (en) | 1990-12-06 |
| US4448306A (en) | 1984-05-15 |
| US4595096A (en) | 1986-06-17 |
| EP0058068A2 (en) | 1982-08-18 |
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