CA1140681A - Slotted heat sinks for high powered air cooled modules - Google Patents
Slotted heat sinks for high powered air cooled modulesInfo
- Publication number
- CA1140681A CA1140681A CA000360338A CA360338A CA1140681A CA 1140681 A CA1140681 A CA 1140681A CA 000360338 A CA000360338 A CA 000360338A CA 360338 A CA360338 A CA 360338A CA 1140681 A CA1140681 A CA 1140681A
- Authority
- CA
- Canada
- Prior art keywords
- heat sink
- heat
- air
- integrated circuit
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims abstract description 22
- 238000005219 brazing Methods 0.000 claims description 2
- 208000036366 Sensation of pressure Diseases 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 3
- 230000007246 mechanism Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003416 augmentation Effects 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S165/00—Heat exchange
- Y10S165/908—Fluid jets
Abstract
Slotted Heat Sinks For High Powered Air Cooled Modules Abstract An air cooled high density integrated circuit system wherein heat sink structures are located on one of the surfaces of the modules in the system. The heat sink is composed of a plurality of hollow or flat heat con-ductive bodies having an opening or openings extending from the module surface toward, but not reaching, the top of the hollow heat sink. Means are provided to direct air flow to the upper end of the body. The air flow will be from the top of the heat sink and out of the opening or openings to cool the heat sink and the module. The heat sink structure provides greater sur-face area and effects the breaking up of the boundary layer near the surface of the module for enhanced cooling.
Description
~(3~
.. `. 1 Descri~tion .. : ,.
Slotted Heat Sinks for Hi~h Powered Air Cooled Modules Technical Field _ This invention relates to heat transfer mechanisms, and more particularly, to an improved heat transfer mechanism for removing heat generated from high powered air cooled integrated circuit modules.
Back~round Art The dissipation of the heat generated by the circuits in integrated circuit devices may produce serious limitations in microminaturization. This is because the elevated temperatures could cause i5 electrical performance changes and degradation of materials leading to reduced reliability and device failure. The efficient removal of heat from integrated circuit modules for very large integrated circuit devices is a very difficult problem and is a restriction on the design of such integrated circuit modules.
One convenient way of removing heat from an integrated circuit device involves the direct contact to a semiconductor integrated circuit or module containing such integrated circuit of a heat s~nk structure. Examples of such structures are illustrated in the IBM* Technical Disclosure Bulletin ~ "Variable-Area Heat Sink ~evice" by P. M. Connors, ```~ Vol. 17 No. 4, September 1974, page 1016, and "Thermal Enhancement Technique for Large-Scale Integrated Circuit Chip Carriers" by R. N. Spaight, IBM Technical Disclosure Bulletin, Vol. 20, 1`1. 7, December 1977, page 261. These structures could alternatively have their heat sinks cooled by the *Registered Trade Mark .
`P6~
:- 2 - natural flow of air or by a purposefully applied cooling air past the heat sinks to reduce their temperature.
U.S. 3,843,910 uses a cooling system which includes an air movina device and air cooled in a heat exchanger under the influence of an external fan which opens into a multiplicity of secondary pipes or circuits, each terminating in a calibrated passage, which allows a predetermined flow rate of fluid to pass. The cooling fluid acts directly upon a component or indirectly upon a group of components by way of a fluid distribution plenum chamber. However, such a system does not necessarily provide a large degree of turbulence in the area of the object to be cooled and, in addition, is relatively complex in a configuration and the use of a heat exchanger for air cooling.
Cana~ia~ Patent Ap~lication 34~,132, filed ~rch en~itled "rlec~ronic Circuit~'~dule Cooling"
and assigned to the assignee of the present patent application describes an integrated circuit cooling system over which the present invention is an improvement. The patent application describes the mounting of a plurality of circuit modules on a large area circuit board assembly. An air plenum chamber is mounted adjacent to the board assembly with a plurality of openings therein over each integrated circuit module in the assembly. A
; parallel air flow of large volume is directed through the openings therein to impinge directly onto the integrated circuit modules. Each module ` has a plurality of solid pin-shaped heat sinks ;
attached to its covering member.
Summary of the Present Invention It is the principal object of the present invention to provide a heat transfer mechanism for a large scale integrated circuit module that will provide for even more efficient heat removal than the system described in the beforementioned patent application.
A more specific object of the invention is to provide a heat transfer mechanism for a high density integrated circuit module which uses impingement cooling of a directed air flow onto the given circuit module that has hollow or flat heat sinks with openings at the module covering surface so as to provide for more surface area and to break up the boundary air layer near the surface of the module covering surface.
The foregoing and other objects and advantages are accomplished by an air cooling system for high density integrated circuit modules which involve the presence of the module containing the integrated .
circuit chips and having a heat conductive covering surface to which is attached the hollow or flat heat sinks of a particular design. The heat sink is composed of a heat conductive material and having at least one opening therein extending from the surface of the covering body and extending toward the top opening of the hollow heat sinks.
; ~leans are provided for impingement air flow sub-stantially parallel to the opening in the heat sinks which causes air flow through the hollow sin~ body and out of ~the opening in the hollow heat sink.
Brief Description of the Drawings The drawings show the following:
FIG. 1 is a front perspective view, partially in section, of the integrated circuit module system of the present invention.
e , FIG 2 is a perspective view of a single module containing one form of hollow heat sink of the present invention showing the air flow for cooling of the module.
FIG. 3 is a schematic illustration o one type of the impingement cooling of one type of hollow heat sink according to the present invention.
FI~. 4 schematically illustrates the impingement air flow cooling of a straight fin heat sink structure of the present invention.
FIG. 5A and 5B schematically illustrate other hollow heat sink forms accordlng to the present invention.
. .
20 Disclosure of the- Invention Re~erxing to FIGURE 1, an air cooling system for high density integrated circuit modules is schematically illustrated. Large scale integrated circuit chips (not shown) are packaged in modules 10 25 The modules are in turn supported by printed circuit board number 11. The modules 10 each have a heat conduc~ive covering surface and attached to this covering surface is a plurality of heat sink devices 12~ An air plenum 15 is spaced a suitable distance from the top surface of the integrated cir~uit module. Associated with the air plenum chamber 15 is an air moving device 16. Internal to the air plenum 15 in the surface 17 facing the integrated circuit board assembly of modules are a plurality of openings 18. Underneath each opening l8 is \
.
~ FI9-79-030 `.
6~1~
preferably a module 10 having heat sink means 12 thereon. In the base of the assembly between the air plenum 15 and the circuit board 11 is slit 19 which permits the exhausted air to be exited from 5 the air cooling system.
FIGURE 2 is a perspective schematic view of one module in the air cooling system which is illustrative of the theory of operation of the cooling of the integrated circuit module assembly 10 of the present invention. Each of the heat sink members 12 are hollow in this embodiment. They are attached to the heat conductive covering surface 20 of module 10. Attachment is typically by brazing, soldering or other conventional 15 techniques. An opening or openings 22 in the hollow heat sink extend from the surface of the covering body 20 toward the top opening of the hollow heat sink.
FIGURE 3 is an enlargement of one of the 20 hollow heat sink members 12 of FIGURE 2. The cooling air is directed by the air moving device 16 into the plenum 15. The openings 18 in the side 17 cause a direct jet air impingement under the pressure of the air in the plenum to be directed 25 onto the hollow heat sinks 12 of the integrated circuit module 10. The air passing through the opening 18 impinges on the hollow heat sinks with portions of the air entering the heat sinks and between the heat sinks. The air which enters the 30 heat sinks will pass through and exit at the opening 22 a`t the bottom of the heat sink 12.
This flow of air at the bottom creates a flow ;~ counter to that of the air boundary layer near the Y surface of the covering surface 20 to tllereby 35 break up this air boundary layer. The break up of the air boundary layer due to this turbulence ~4~i8~L
reduces the heat resistance between the module and the cooling medium.
FIGURE 4 illustrates a second embodiment of the present invention wherein a straight fin heat sink 30 is utilized. In this embodiment the heat conductive - covering surface 20 of module 10 has attached thereto a straight finned heat sink which is composed of a heat conductive material. The straight finned heat sink contains slits or openings 32 along its length.
10 Air impingement flow is directed from openings 18 as described in the hollow tube initial embodiment of the present invention. The air flow is impinging downward between the straight finned heat sinks 30 and through the slits or openings 32 to cause the 15 turbulence necessary to reduce the air boundary layer to its lowest possible heat resistance characteristics.
There are other possible configurations for the hollow heat sinks of the present invention. Some `- of these are shown in FIGURES SA and 5B. The top 40 20 of the hollow heat sinks may be flared as shown in FIG. 5A to equal the heat sink spacing to direct more air into the pins. ~his structure also adds rigidity to the overall heat sink device. For parallel, rather than impingement air flow, flow 25 scoops 42 may be placed on the tops of the hollow heat sinks as shown in FIG. 5B to direct air into the top openings of the heat sinks. The scoop 42 being larger than the heat sink opening will force additional air through the heat sink, accelerating 30 it so that it exits at the bottom at a higher velocity than when entaring the top (Venturi effect).
This effect can be augmented further by employing ' inverted and truncated hollow cones with slots on the t sidewalls. Aforementioned and other shapes with 35 slots may be further enhanced by fluting the inside walls thus giving rise to air mixing and increased , local velocities. It should be realized that ' conventional augmentations such as fluting, etc.
.. ..
will appreciably improve heat transfer rates only with the presence of slots on sidewalls through increased wash-effect.
It is preferred to have a plurality of slits equidistant along the surface of the he~t sink as opposed to a single opening. The slits in both the FIGURE 3 and FIGURE 4 embodiments are preferred to extend more than one-half way from the covering body toward the top. The total opening area of the openings is between about one-third to one-half of the heat sink area. This ratio is further optimized for a given application as a function of the heat conduction required through the solid parts of the total heat sink. The amount of opening is important in making the inside surfaces of hollow tubes efficient in transferring heat.
Similarly in flat fins, the openings provide more efficient heat transfer through the wash-effect.
The following examples are included merely to aid in the understanding of the invention and variations may be made by one skilled in the art without departing from the spirit and scope of the invention.
Table I
Thermal Resistance Example Heat Sink in C/Watts 1 Solid Studs (25mm long) 181 of them on 63.5mm0.20
.. `. 1 Descri~tion .. : ,.
Slotted Heat Sinks for Hi~h Powered Air Cooled Modules Technical Field _ This invention relates to heat transfer mechanisms, and more particularly, to an improved heat transfer mechanism for removing heat generated from high powered air cooled integrated circuit modules.
Back~round Art The dissipation of the heat generated by the circuits in integrated circuit devices may produce serious limitations in microminaturization. This is because the elevated temperatures could cause i5 electrical performance changes and degradation of materials leading to reduced reliability and device failure. The efficient removal of heat from integrated circuit modules for very large integrated circuit devices is a very difficult problem and is a restriction on the design of such integrated circuit modules.
One convenient way of removing heat from an integrated circuit device involves the direct contact to a semiconductor integrated circuit or module containing such integrated circuit of a heat s~nk structure. Examples of such structures are illustrated in the IBM* Technical Disclosure Bulletin ~ "Variable-Area Heat Sink ~evice" by P. M. Connors, ```~ Vol. 17 No. 4, September 1974, page 1016, and "Thermal Enhancement Technique for Large-Scale Integrated Circuit Chip Carriers" by R. N. Spaight, IBM Technical Disclosure Bulletin, Vol. 20, 1`1. 7, December 1977, page 261. These structures could alternatively have their heat sinks cooled by the *Registered Trade Mark .
`P6~
:- 2 - natural flow of air or by a purposefully applied cooling air past the heat sinks to reduce their temperature.
U.S. 3,843,910 uses a cooling system which includes an air movina device and air cooled in a heat exchanger under the influence of an external fan which opens into a multiplicity of secondary pipes or circuits, each terminating in a calibrated passage, which allows a predetermined flow rate of fluid to pass. The cooling fluid acts directly upon a component or indirectly upon a group of components by way of a fluid distribution plenum chamber. However, such a system does not necessarily provide a large degree of turbulence in the area of the object to be cooled and, in addition, is relatively complex in a configuration and the use of a heat exchanger for air cooling.
Cana~ia~ Patent Ap~lication 34~,132, filed ~rch en~itled "rlec~ronic Circuit~'~dule Cooling"
and assigned to the assignee of the present patent application describes an integrated circuit cooling system over which the present invention is an improvement. The patent application describes the mounting of a plurality of circuit modules on a large area circuit board assembly. An air plenum chamber is mounted adjacent to the board assembly with a plurality of openings therein over each integrated circuit module in the assembly. A
; parallel air flow of large volume is directed through the openings therein to impinge directly onto the integrated circuit modules. Each module ` has a plurality of solid pin-shaped heat sinks ;
attached to its covering member.
Summary of the Present Invention It is the principal object of the present invention to provide a heat transfer mechanism for a large scale integrated circuit module that will provide for even more efficient heat removal than the system described in the beforementioned patent application.
A more specific object of the invention is to provide a heat transfer mechanism for a high density integrated circuit module which uses impingement cooling of a directed air flow onto the given circuit module that has hollow or flat heat sinks with openings at the module covering surface so as to provide for more surface area and to break up the boundary air layer near the surface of the module covering surface.
The foregoing and other objects and advantages are accomplished by an air cooling system for high density integrated circuit modules which involve the presence of the module containing the integrated .
circuit chips and having a heat conductive covering surface to which is attached the hollow or flat heat sinks of a particular design. The heat sink is composed of a heat conductive material and having at least one opening therein extending from the surface of the covering body and extending toward the top opening of the hollow heat sinks.
; ~leans are provided for impingement air flow sub-stantially parallel to the opening in the heat sinks which causes air flow through the hollow sin~ body and out of ~the opening in the hollow heat sink.
Brief Description of the Drawings The drawings show the following:
FIG. 1 is a front perspective view, partially in section, of the integrated circuit module system of the present invention.
e , FIG 2 is a perspective view of a single module containing one form of hollow heat sink of the present invention showing the air flow for cooling of the module.
FIG. 3 is a schematic illustration o one type of the impingement cooling of one type of hollow heat sink according to the present invention.
FI~. 4 schematically illustrates the impingement air flow cooling of a straight fin heat sink structure of the present invention.
FIG. 5A and 5B schematically illustrate other hollow heat sink forms accordlng to the present invention.
. .
20 Disclosure of the- Invention Re~erxing to FIGURE 1, an air cooling system for high density integrated circuit modules is schematically illustrated. Large scale integrated circuit chips (not shown) are packaged in modules 10 25 The modules are in turn supported by printed circuit board number 11. The modules 10 each have a heat conduc~ive covering surface and attached to this covering surface is a plurality of heat sink devices 12~ An air plenum 15 is spaced a suitable distance from the top surface of the integrated cir~uit module. Associated with the air plenum chamber 15 is an air moving device 16. Internal to the air plenum 15 in the surface 17 facing the integrated circuit board assembly of modules are a plurality of openings 18. Underneath each opening l8 is \
.
~ FI9-79-030 `.
6~1~
preferably a module 10 having heat sink means 12 thereon. In the base of the assembly between the air plenum 15 and the circuit board 11 is slit 19 which permits the exhausted air to be exited from 5 the air cooling system.
FIGURE 2 is a perspective schematic view of one module in the air cooling system which is illustrative of the theory of operation of the cooling of the integrated circuit module assembly 10 of the present invention. Each of the heat sink members 12 are hollow in this embodiment. They are attached to the heat conductive covering surface 20 of module 10. Attachment is typically by brazing, soldering or other conventional 15 techniques. An opening or openings 22 in the hollow heat sink extend from the surface of the covering body 20 toward the top opening of the hollow heat sink.
FIGURE 3 is an enlargement of one of the 20 hollow heat sink members 12 of FIGURE 2. The cooling air is directed by the air moving device 16 into the plenum 15. The openings 18 in the side 17 cause a direct jet air impingement under the pressure of the air in the plenum to be directed 25 onto the hollow heat sinks 12 of the integrated circuit module 10. The air passing through the opening 18 impinges on the hollow heat sinks with portions of the air entering the heat sinks and between the heat sinks. The air which enters the 30 heat sinks will pass through and exit at the opening 22 a`t the bottom of the heat sink 12.
This flow of air at the bottom creates a flow ;~ counter to that of the air boundary layer near the Y surface of the covering surface 20 to tllereby 35 break up this air boundary layer. The break up of the air boundary layer due to this turbulence ~4~i8~L
reduces the heat resistance between the module and the cooling medium.
FIGURE 4 illustrates a second embodiment of the present invention wherein a straight fin heat sink 30 is utilized. In this embodiment the heat conductive - covering surface 20 of module 10 has attached thereto a straight finned heat sink which is composed of a heat conductive material. The straight finned heat sink contains slits or openings 32 along its length.
10 Air impingement flow is directed from openings 18 as described in the hollow tube initial embodiment of the present invention. The air flow is impinging downward between the straight finned heat sinks 30 and through the slits or openings 32 to cause the 15 turbulence necessary to reduce the air boundary layer to its lowest possible heat resistance characteristics.
There are other possible configurations for the hollow heat sinks of the present invention. Some `- of these are shown in FIGURES SA and 5B. The top 40 20 of the hollow heat sinks may be flared as shown in FIG. 5A to equal the heat sink spacing to direct more air into the pins. ~his structure also adds rigidity to the overall heat sink device. For parallel, rather than impingement air flow, flow 25 scoops 42 may be placed on the tops of the hollow heat sinks as shown in FIG. 5B to direct air into the top openings of the heat sinks. The scoop 42 being larger than the heat sink opening will force additional air through the heat sink, accelerating 30 it so that it exits at the bottom at a higher velocity than when entaring the top (Venturi effect).
This effect can be augmented further by employing ' inverted and truncated hollow cones with slots on the t sidewalls. Aforementioned and other shapes with 35 slots may be further enhanced by fluting the inside walls thus giving rise to air mixing and increased , local velocities. It should be realized that ' conventional augmentations such as fluting, etc.
.. ..
will appreciably improve heat transfer rates only with the presence of slots on sidewalls through increased wash-effect.
It is preferred to have a plurality of slits equidistant along the surface of the he~t sink as opposed to a single opening. The slits in both the FIGURE 3 and FIGURE 4 embodiments are preferred to extend more than one-half way from the covering body toward the top. The total opening area of the openings is between about one-third to one-half of the heat sink area. This ratio is further optimized for a given application as a function of the heat conduction required through the solid parts of the total heat sink. The amount of opening is important in making the inside surfaces of hollow tubes efficient in transferring heat.
Similarly in flat fins, the openings provide more efficient heat transfer through the wash-effect.
The following examples are included merely to aid in the understanding of the invention and variations may be made by one skilled in the art without departing from the spirit and scope of the invention.
Table I
Thermal Resistance Example Heat Sink in C/Watts 1 Solid Studs (25mm long) 181 of them on 63.5mm0.20
2 Slotted Tubes (25mm long) 181 of them on 63mm~ 0.18
3 Slotted Tubes t25mm long) 61 of them on 63.5mm 0.22
4 Straight Fins (25mm high) 16 of them on 63.5mm 0.32 Slotted Straight Fins (25mm high) 16 of them on 63.5mm 0.26 ~I9-79-030 Each heat sink of the type described in each of the Examples in Table I was instrumented with more than 30 thermocouples both on the fin side and on the side of the plate to which the fins were attached. The heat sink was clamped to a wire heater and the assembly was placed in an air column.
Air inlet temperature and temperatures at various points on the heat sink were measured. The power inputted to the heat sink was very carefully measured to account for extraneous heat losses.
The thermal resistance of each heat sink was then calculated from the measured temperature and power dissipated by the heat sink. The slotted heat sinks of Examples 2, 3 and 5 substantially reduced the thermal resistance and improved the performance of the heat sinks. It should be noted that staggered slots are preferred over in line slots especially in the case of flat fins.
While we have illustrated and described the preferred embodiments of our invention, it is to be understood that we do not limit ourselves to the precise constructions herein disclosed and the right is reserved to all changes and modifications coming within the scope of the invention as defined in the appended Claims.
, .
`' '' ' . .
'
Air inlet temperature and temperatures at various points on the heat sink were measured. The power inputted to the heat sink was very carefully measured to account for extraneous heat losses.
The thermal resistance of each heat sink was then calculated from the measured temperature and power dissipated by the heat sink. The slotted heat sinks of Examples 2, 3 and 5 substantially reduced the thermal resistance and improved the performance of the heat sinks. It should be noted that staggered slots are preferred over in line slots especially in the case of flat fins.
While we have illustrated and described the preferred embodiments of our invention, it is to be understood that we do not limit ourselves to the precise constructions herein disclosed and the right is reserved to all changes and modifications coming within the scope of the invention as defined in the appended Claims.
, .
`' '' ' . .
'
Claims (15)
1. An air cooling system for high density integrated circuit modules comprising:
a module containing integrated circuit chips and having a heat conductive covering surface;
a plurality of hollow heat sinks, each having a top opening at one end and the opposite end attached to said covering surface and each having a side opening therein extending from said covering surface and extend-ing toward said top opening of each said hollow heat sink; and means for impingement air flow substantially parallel to each said hollow heat sink which causes air flow through said top openings of each of said hollow heat sinks and out of said side opening in each said hollow heat sink as well as between said plurality of heat sinks whereby the heat is removed from said hollow heat sinks.
a module containing integrated circuit chips and having a heat conductive covering surface;
a plurality of hollow heat sinks, each having a top opening at one end and the opposite end attached to said covering surface and each having a side opening therein extending from said covering surface and extend-ing toward said top opening of each said hollow heat sink; and means for impingement air flow substantially parallel to each said hollow heat sink which causes air flow through said top openings of each of said hollow heat sinks and out of said side opening in each said hollow heat sink as well as between said plurality of heat sinks whereby the heat is removed from said hollow heat sinks.
2. The system of claim 1 wherein said side opening is a plurality of slits spaced around each of said heat sinks.
3. The system of claim 2 wherein the said slits ex-tend more than half way from said covering surface to said top opening.
4. The system of claim 2 wherein the opening area of said slits is between about one-third to one-half of the heat sink area.
5. The system of claim 1 wherein the said integrated circuit chips within said module contain logic circuits therein producing about three times the heat energy that can be dissipated without this embodiment of heat sink at the same operating chip temperature.
6. The system of claim 1 wherein the said integrated circuit chips within said module contain memory cir-cuits therein producing about three times the heat energy that can be dissipated without this embodiment of heat sink at the same operating chip temperature.
7. The system of claim 1 wherein said hollow heat sink has a circular cross-section.
8. The system of claim 1 wherein said hollow heat sink is attached to said covering surface by brazing.
9. The system of claim 1 wherein said means for im-pingement air flow includes an air plenum adapted to receive cooling air at a substantially constant pres-sure and to direct said cooling air through an open-ing in said plenum located directly above said module and said heat sink.
10. An air cooling system for high density integrated circuit modules comprising:
a module containing integrated circuit chips and having a heat conductive covering surface;
a plurality of straight fin heat sinks attached to said covering surface and each having slits therein extending from said covering surface toward the top of each said straight fin heat sink; and means for impingement air flow substantially parallel to said straight fin heat sinks which causes air flow around said heat sinks and through the slits in said heat sinks whereby the heat is removed from said straight fin heat sinks.
a module containing integrated circuit chips and having a heat conductive covering surface;
a plurality of straight fin heat sinks attached to said covering surface and each having slits therein extending from said covering surface toward the top of each said straight fin heat sink; and means for impingement air flow substantially parallel to said straight fin heat sinks which causes air flow around said heat sinks and through the slits in said heat sinks whereby the heat is removed from said straight fin heat sinks.
11. The system of claim 10 wherein said slits are at least half of the height of the said straight fin heat sink.
12. The system of claim 10 wherein the opening area of said slits is between about one-third to one-half of the heat sink area.
13. The system of claim 10 wherein the said inte-grated circuit chips within said module contain logic circuits therein producing more than about three times the normal amount of power that can be dissipated without a heat sink at the same operating chip tempera-ture.
14. The system of claim 10 wherein the said integrated circuit chips within said module contain memory circuits therein producing more than about three times the nor-mal amount of power that can be dissipated without a heat sink at the same operating chip temperature.
15. The system of claim 10 wherein said means for impingement air flow includes an air plenum adapted to receive cooling air at substantially constant pres-sure and to direct said cooling air through an opening in said plenum located directly above said module and said heat sink.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/096,942 US4296455A (en) | 1979-11-23 | 1979-11-23 | Slotted heat sinks for high powered air cooled modules |
| US096,942 | 1979-11-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1140681A true CA1140681A (en) | 1983-02-01 |
Family
ID=22259852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000360338A Expired CA1140681A (en) | 1979-11-23 | 1980-09-16 | Slotted heat sinks for high powered air cooled modules |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4296455A (en) |
| EP (1) | EP0029501B1 (en) |
| JP (1) | JPS5676554A (en) |
| CA (1) | CA1140681A (en) |
| DE (1) | DE3067705D1 (en) |
Families Citing this family (94)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4291364A (en) * | 1979-12-26 | 1981-09-22 | International Business Machines Corporation | Air-cooled hybrid electronic package |
| IN158133B (en) * | 1981-06-09 | 1986-09-13 | Gen Electric | |
| US4494171A (en) * | 1982-08-24 | 1985-01-15 | Sundstrand Corporation | Impingement cooling apparatus for heat liberating device |
| US4449164A (en) * | 1982-09-27 | 1984-05-15 | Control Data Corporation | Electronic module cooling system using parallel air streams |
| JPS59202657A (en) * | 1983-04-29 | 1984-11-16 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Integral structure heat sink |
| US4546405A (en) * | 1983-05-25 | 1985-10-08 | International Business Machines Corporation | Heat sink for electronic package |
| US4628992A (en) * | 1984-01-23 | 1986-12-16 | At&T Information Systems | Induced flow heat exchanger |
| JPS61139536U (en) * | 1985-02-20 | 1986-08-29 | ||
| JPS61190665U (en) * | 1985-05-22 | 1986-11-27 | ||
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| Publication number | Priority date | Publication date | Assignee | Title |
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| USRE25184E (en) * | 1959-08-03 | 1962-06-12 | Mcadam | |
| US3193610A (en) * | 1962-08-10 | 1965-07-06 | Atlee Corp | Shields for vacuum tubes and the like |
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| FR2157094A5 (en) * | 1971-10-18 | 1973-06-01 | Thomson Csf | |
| US4202408A (en) * | 1978-03-06 | 1980-05-13 | Temple Robert S | Jet type heat exchanger |
| JPS6234450Y2 (en) * | 1978-06-07 | 1987-09-02 |
-
1979
- 1979-11-23 US US06/096,942 patent/US4296455A/en not_active Expired - Lifetime
-
1980
- 1980-09-12 JP JP12619180A patent/JPS5676554A/en active Granted
- 1980-09-16 CA CA000360338A patent/CA1140681A/en not_active Expired
- 1980-10-15 EP EP80106265A patent/EP0029501B1/en not_active Expired
- 1980-10-15 DE DE8080106265T patent/DE3067705D1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US4296455A (en) | 1981-10-20 |
| EP0029501A2 (en) | 1981-06-03 |
| DE3067705D1 (en) | 1984-06-07 |
| JPS5676554A (en) | 1981-06-24 |
| EP0029501B1 (en) | 1984-05-02 |
| EP0029501A3 (en) | 1981-06-17 |
| JPS5719864B2 (en) | 1982-04-24 |
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