CA1017071A - Plastic power semiconductor flip chip package - Google Patents
Plastic power semiconductor flip chip packageInfo
- Publication number
- CA1017071A CA1017071A CA216,723A CA216723A CA1017071A CA 1017071 A CA1017071 A CA 1017071A CA 216723 A CA216723 A CA 216723A CA 1017071 A CA1017071 A CA 1017071A
- Authority
- CA
- Canada
- Prior art keywords
- power semiconductor
- flip chip
- chip package
- semiconductor flip
- plastic power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US465820A US3922712A (en) | 1974-05-01 | 1974-05-01 | Plastic power semiconductor flip chip package |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1017071A true CA1017071A (en) | 1977-09-06 |
Family
ID=23849292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA216,723A Expired CA1017071A (en) | 1974-05-01 | 1974-12-23 | Plastic power semiconductor flip chip package |
Country Status (2)
Country | Link |
---|---|
US (1) | US3922712A (en) |
CA (1) | CA1017071A (en) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4057825A (en) * | 1975-07-18 | 1977-11-08 | Hitachi, Ltd. | Semiconductor device with composite metal heat-radiating plate onto which semiconductor element is soldered |
US4012765A (en) * | 1975-09-24 | 1977-03-15 | Motorola, Inc. | Lead frame for plastic encapsulated semiconductor assemblies |
US4084312A (en) * | 1976-01-07 | 1978-04-18 | Motorola, Inc. | Electrically isolated heat sink lead frame for plastic encapsulated semiconductor assemblies |
US4132856A (en) * | 1977-11-28 | 1979-01-02 | Burroughs Corporation | Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby |
US4271588A (en) * | 1977-12-12 | 1981-06-09 | Motorola, Inc. | Process of manufacturing a encapsulated hybrid circuit assembly |
US4215360A (en) * | 1978-11-09 | 1980-07-29 | General Motors Corporation | Power semiconductor device assembly having a lead frame with interlock members |
US4278991A (en) * | 1979-08-13 | 1981-07-14 | Burroughs Corporation | IC Package with heat sink and minimal cross-sectional area |
WO1982003294A1 (en) * | 1981-03-23 | 1982-09-30 | Inc Motorola | Semiconductor device including plateless package |
JPS5966157A (en) * | 1982-10-08 | 1984-04-14 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
EP0204102A3 (en) * | 1985-06-03 | 1987-11-19 | Motorola, Inc. | Direct connection of lead frame having flexible, tapered leads and mechanical die support |
US5184206A (en) * | 1990-10-26 | 1993-02-02 | General Electric Company | Direct thermocompression bonding for thin electronic power chips |
JPH0547958A (en) * | 1991-08-12 | 1993-02-26 | Mitsubishi Electric Corp | Resin sealed semiconductor device |
US5378924A (en) * | 1992-09-10 | 1995-01-03 | Vlsi Technology, Inc. | Apparatus for thermally coupling a heat sink to a lead frame |
KR940016724A (en) * | 1992-12-03 | 1994-07-23 | 빈센트 비. 인그라시아 | Lead Frame Assemblies for Surface Mount Integrated Circuit Power Packages |
KR960000706B1 (en) * | 1993-07-12 | 1996-01-11 | 한국전기통신공사 | Power-device type plastic package structure and the |
US5457071A (en) * | 1993-09-03 | 1995-10-10 | International Business Machine Corp. | Stackable vertical thin package/plastic molded lead-on-chip memory cube |
DE4428320A1 (en) * | 1994-08-10 | 1996-02-15 | Duerrwaechter E Dr Doduco | Plastic housing with a vibration-damping bearing of a bondable element |
US6024274A (en) * | 1996-04-03 | 2000-02-15 | Industrial Technology Research Institute | Method for tape automated bonding to composite bumps |
US7038310B1 (en) * | 1999-06-09 | 2006-05-02 | Matsushita Electric Industrial Co., Ltd. | Power module with improved heat dissipation |
US6225684B1 (en) | 2000-02-29 | 2001-05-01 | Texas Instruments Tucson Corporation | Low temperature coefficient leadframe |
DE10038092A1 (en) | 2000-08-04 | 2002-02-14 | Bosch Gmbh Robert | Method for the electrical connection of a semiconductor component to an electrical assembly |
US6602726B1 (en) * | 2002-01-30 | 2003-08-05 | Texas Instruments Incorporated | Bond surface conditioning system for improved bondability |
KR100521081B1 (en) * | 2002-10-12 | 2005-10-14 | 삼성전자주식회사 | Fabrication and installation method of flip chip |
US20050133934A1 (en) * | 2003-12-23 | 2005-06-23 | Mellody James P. | Thermal interface material bonding |
US7445967B2 (en) * | 2006-01-20 | 2008-11-04 | Freescale Semiconductor, Inc. | Method of packaging a semiconductor die and package thereof |
EP2074654A1 (en) * | 2006-10-06 | 2009-07-01 | Microsemi Corporation | High temperature, high voltage sic void-less electronic package |
US8169081B1 (en) | 2007-12-27 | 2012-05-01 | Volterra Semiconductor Corporation | Conductive routings in integrated circuits using under bump metallization |
WO2014179108A1 (en) | 2013-05-03 | 2014-11-06 | Honeywell International Inc. | Lead frame construct for lead-free solder connections |
US11309177B2 (en) | 2018-11-06 | 2022-04-19 | Stmicroelectronics S.R.L. | Apparatus and method for manufacturing a wafer |
IT201900015416A1 (en) | 2019-09-03 | 2021-03-03 | St Microelectronics Srl | APPARATUS FOR GROWING A SLICE OF SEMICONDUCTOR MATERIAL, IN PARTICULAR SILICON CARBIDE, AND ASSOCIATED MANUFACTURING PROCESS |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3153750A (en) * | 1958-10-14 | 1964-10-20 | Motorola Inc | Semiconductor device with two-piece self-jigging connectors |
US3522490A (en) * | 1965-06-28 | 1970-08-04 | Texas Instruments Inc | Semiconductor package with heat conducting mounting extending from package on side opposite conductor extensions |
NL157456B (en) * | 1968-07-30 | 1978-07-17 | Philips Nv | SEMI-CONDUCTOR DEVICE IN AN INSULATING PLASTIC COVER. |
DE1961042C3 (en) * | 1969-12-05 | 1981-01-15 | Robert Bosch Gmbh, 7000 Stuttgart | Semiconductor component |
US3651448A (en) * | 1970-03-20 | 1972-03-21 | Amp Inc | Power frame for integrated circuit |
US3679946A (en) * | 1970-07-06 | 1972-07-25 | Gen Motors Corp | Strip mounted semiconductor device |
-
1974
- 1974-05-01 US US465820A patent/US3922712A/en not_active Expired - Lifetime
- 1974-12-23 CA CA216,723A patent/CA1017071A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US3922712A (en) | 1975-11-25 |
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